1. Continuously thermal conductive pathway of bidisperse boron nitride fillers in epoxy composite for highly efficient heat dissipation
- Author
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Sooyeol Jeong, Lee Su Kim, Sung-Jin Chang, Jung Young Cho, Gi-Ra Yi, Gaehang Lee, Kyuseok Choi, Sun Ha Kim, Myungsu Kim, Joon Yong Park, Jun Min Kim, Ki Min Nam, Dae-Woong Jung, and SangGap Lee
- Subjects
Materials science ,Composite number ,02 engineering and technology ,Epoxy ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,0104 chemical sciences ,chemistry.chemical_compound ,Thermal conductivity ,chemistry ,Mechanics of Materials ,Boron nitride ,visual_art ,Thermal ,Materials Chemistry ,visual_art.visual_art_medium ,Surface modification ,General Materials Science ,Composite material ,0210 nano-technology ,Electrical conductor ,Benzoic acid - Abstract
This study presents a combined strategy of bidisperse boron nitride (BN) and surface modification to improve the thermal conductivity (κ) of the BN-epoxy composite. Surface modification of hexagonal BN was carried out with benzoic acid (BA). The optimal weight ratio of large and small BN (BNl and BNs) was 8:2 for their connectivity in the epoxy matrix. For 50 wt% filler content, the BNl8s2-BA composite has a much higher κ of 2.71 W/m K (out-plane direction), which is 12.3, 1.32, and 1.50 times higher than that of the pure epoxy, and its composite with BNl10s0-BA and BNl8s2, respectively. The chemical-sensitive analyses indicate that carboxyl-carboxylate interaction occurred in partially deprotonated benzoic acid on BN during the epoxy curing process, resulting in in-situ formation of a continuously thermal conductive pathway, which is responsible for the improved κ.
- Published
- 2021
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