Search

In this study, 48 hot-rolling processing conditions were designed to investigate the influences of thermomechanical processing parameters on the recrystallization behavior and texture development. The hot-rolling experiments were conducted using the thermomechanical simulator Gleeble 3800 at temperatures of 275, 300, and 350 °C with strain rates of 5 and 90 s − 1 up to 60 and 85% reduction. The microstructure and texture analysis were measured by using the EBSD technique on a large area. Experimental results show that the Cube component maintains a volume fraction between 10% and 20%, below the 40% recrystallization fraction, but the volume fraction of Cube significantly increases between 20% and 50% above the 40% recrystallization fraction. However, the fractions of Rotated Cube (RC) and Goss components remain below 10%. [ABSTRACT FROM AUTHOR]

Cu/SiO2 hybrid bonding has been developed for the application of heterogeneous bond interfaces in 3D integrated circuits in which thermal stability and bonding behavior are important. Thus, nano-twinned Cu (NT-Cu) is selected as the bonding material, and the thermal stability of NT-Cu and the bonding behavior of the interface between NT-Cu are investigated using a scanning electron microscope, electron backscatter diffraction, and focused ion beam. In addition to the microstructure analysis, nano-indentation and nano-scratch are employed to characterize the mechanical properties of the matrix and the interface between NT-Cu. As the bonding temperature increases from 200 to 300 °C for NT-Cu, the average grain sizes increase from 0.64 to 0.87 µm, and the rate of grain coarsening increases from 0.14 to 0.25 µm/h1/2. In addition, the fraction of voids at the bonding interface for NT-Cu interconnects decreases from 0.814% to 0.005%, and the penetration depth increases from 228 to 745 nm with an increase in the temperature from 200 to 300 °C. The hardness of the bonding interface obtained by nano-scratch and nano-indentation array testing is ∼1.8 GPa. [ABSTRACT FROM AUTHOR]

Single-phase CaCu3Ti4O12 (CCTO) was synthesized by solid-state reaction. Electron backscatter diffraction, scanning electron microscopy, and atomic force microscopy were adopted to characterize the grain orientation, microstructure, and surface morphology of the CCTO samples with or without thermal etching. Bump strained nano-regions induced by the local compositional disorder at a nano-scale have been discovered, being the origin of the formation of subgrains in CCTO. The proposed mechanism for the formation of subgrains involves the formation of etched pits and subboundaries pertaining to the strained nano-regions rather than dislocation displacement. The dielectric response inside the grains of CCTO relevant to the strained nano-regions is also discussed. [ABSTRACT FROM AUTHOR]

Byline: Jui-Chao Kuo, Han-Hong Wang Electron Back-Scatter Diffraction (EBSD) can be applied to determine lattice defect and local strain distortion. The strain components were obtained with the help of the shifting of zone axis in Kikuchi patterns generated from EBSD. The displacement of zone axis in Kikuchi pattern was determined by using Digital Image Correlation (DIC) method, which provides a great resolution down to 0.01 pixels, which means the ideal sensitivity to be ∼3.6 x 10−5. However, the errors of calculating the residual strain can result from the image quality of Kikuchi patterns, such as the formation of dark areas in the Kikuchi patterns and the background noise.