1. Extensible 3D architecture for superconducting quantum computing
- Author
-
Kunzhe Dai, Ke Zhang, Guangming Xue, Haifeng Yu, Mengmeng Li, Yang Yu, Xinsheng Tan, and Qiang Liu
- Subjects
Physics and Astronomy (miscellaneous) ,Computer science ,FOS: Physical sciences ,02 engineering and technology ,STRIPS ,Hardware_PERFORMANCEANDRELIABILITY ,01 natural sciences ,law.invention ,Printed circuit board ,Computer Science::Hardware Architecture ,Quantum gate ,Computer Science::Emerging Technologies ,law ,0103 physical sciences ,Hardware_INTEGRATEDCIRCUITS ,010306 general physics ,Quantum computer ,Quantum Physics ,business.industry ,021001 nanoscience & nanotechnology ,Chip ,Qubit ,Scalability ,Optoelectronics ,0210 nano-technology ,business ,Superconducting quantum computing ,Quantum Physics (quant-ph) - Abstract
Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging supercon- ducting chips, especially chips that contain two-dimensional qubit arrays. In our proposed architecture, the center strips of the buried coplanar waveguides protrude from the surface of a dielectric layer as contacts. Since the contacts extend beyond the surface of the dielectric layer, chips can simply be flip-chip packaged with on-chip receptacles clinging to the contacts. Using this scheme, we packaged a multi-qubit chip and per- formed single-qubit and two-qubit quantum gate operations. The results indicate that this 3D architecture provides a promising scheme for scalable quantum computing.
- Published
- 2017
- Full Text
- View/download PDF