23 results on '"Ku, T. K."'
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2. Fully 3-D symmetrical TSV monolithic transformer for RFIC
3. Highly robust self-compliant and nonlinear TaOX/HfOX RRAM for 3D vertical structure in 1TnR architecture
4. Vertical resistive switching memory (VRRAM): A real 3D device demonstration and analysis of high-density application
5. Electrical characteristics of bumpless interconnects for through silicon via (TSV) and Wafer-On-Wafer (WOW) integration.
6. Scalability issue in Ti/HfO bipolar resistive memory with 1T-1R configuration by resistance pinning effect during 1st RESET and its solution
7. Improvement of switching uniformity and scalability in 1T-1R HfOx-based bipolar resistive memory with Zr inserting layer
8. Ti/HfO2 Based RRAM Operation Voltage Scaling for Embedded Memory
9. Electrical characterization of through silicon vias (TSVs) with an on chip bus driver for 3D IC integration
10. Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300 mm Multi-Project Wafer (MPW)
11. Testkey Design of Through Silicon Vias (TSVs) for Accurate De-embedding and RF Model Parameters Extraction
12. Challenges and Trends of Resistive Memory (Memristor) Based Circuits for 3D-IC Applications
13. Impact of slurry in Cu CMP (chemical mechanical polishing) on Cu topography of Through Silicon Vias (TSVs), re-distribution layers, and Cu exposure
14. Wafer Bumping and Characterizations of Fine-Pitch Lead-Free Solder Microbumps on 12” (300mm) wafer for 3D IC Integration
15. Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300mm Multi-Project Wafer (MPW)
16. Thin Wafer Handling of 300mm Wafer for 3D IC Integration
17. Design and analysis of Toeplitz preconditioners
18. Impact of interface nature on deep sub-micron Al-plug resistance
19. Two-step planarized Al-Cu PVD process using long throw sputtering technology.
20. Enhanced electron emission from phosphorus- and boron-doped diamond-clad Si field emitter arrays
21. Two-step planarized Al-Cu PVD process using long throw sputtering technology
22. Preconditioned iterative methods for solving Toeplitz-plus-Hankel systems.
23. Preconditioned iterative methods for block Toeplitz systems.
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