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1. The cytoplasmic domain of CD4 promotes the development of CD4 lineage T cells.

2. Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies

15. Vertically stacked gate-all-around Si nanowire transistors: Key Process Optimizations and Ring Oscillator Demonstration

16. The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps

17. Elimination of the Immunogenicity of Therapeutic Antibodies

18. The European dimension for the mouse genome mutagenesis program

19. T cell activation results in physical modification of the mouse CD8 beta chain

21. The strength of BEOL structures fabricated using low K materials and its impact on CPI failures

26. STRUCTURE AND EXPRESSION OF GLOBIN AND H-2 GENES

27. A study of liquid metal alloy ion sources for the production of ions of interest in the microelectronics industry

28. Th cells and Th2 responses can develop in the absence of MHC class II-CD4 interactions

29. A CD8 genomic fragment that directs subset-specific expression of CD8 in transgenic mice

30. Competitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies

31. The European dimension for the mouse genome mutagenesis program

32. Optimization of porous ultra low-κ dielectrics (κ ≤ 2.55) for 28nm generation

33. A BEOL multilevel structure with ultra low-k materials (k ≤ 2.4)

35. A study of liquid metal alloy ion sources for the production of ions of interest in the microelectronics industry

37. Human CD2 is functional in CD2 transgenic mice

43. Embryonic expression and cloning of the murine GATA-3 gene.

44. Functional Analysis of the Human Neurofilament Light Chain Gene Promoter

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