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This paper proposes a wideband continuous-time passive equalizer with an embedded cavity structure that is more compact in size and enables lower-cost processing than conventional technologies. The proposed passive equalizer is composed of a lumped resistor and capacitance in a cavity structure generated by a parasitic channel parasitic component, such as a package ball pad. This equalizer design in which the capacitance is embedded in the cavity structure offers the advantages of reducing the additional occupied printed circuit board (PCB) area and of enabling a small-sized equalizer with a large capacitance for application in high-density systems. For a 40-cm transmission line on PCB with a data rate of 12.5 Gb/s, the measured eye diagram is successfully demonstrated and the eye opening significantly improved to 81.1 mV, with a timing jitter of 28.7 ps. [ABSTRACT FROM PUBLISHER]

In this paper, we propose a fast and accurate model of the vertical noise coupling from an on-chip switching-mode power supply (SMPS) to a low noise amplifier (LNA) in a stacked 3-D-IC. To achieve both speed and accuracy, the model is based on the analytic formulas of static R, L, and C parasitic extraction, and includes consideration of the phase difference in the on-chip inductors using a new iterative calculation method. The proposed model and the prediction of vertically coupled noise at the LNA output using the model are experimentally validated on a fabricated stacked 3-D-IC consisting of an on-chip SMPS and LNA. Good agreement with the measurements is confirmed in both the frequency domain and the time domain. The enhancements of the proposed model, including the broad model bandwidth (<4~GHz) as good as 3-D EM solver and 99% reduction of the simulation elapsed time (2 s) from 3-D EM solver, are confirmed. This paper also analyzes: 1) the impact of vertical noise coupling on the RF signal gain performance of the LNA and 2) the impact of variation in the stacking configuration, location, and thickness of the stacked LNA on the vertical noise coupling using the proposed model. Based on the results of our analysis, this paper proposes and verifies an effective method to reduce the vertical noise coupling using the proposed model. [ABSTRACT FROM PUBLISHER]

In this paper, we propose a compact and wideband electromagnetic bandgap (EBG) structure using a defected ground structure (DGS) to significantly enhance the wideband suppression of power/ground noise coupling in multilayer packages and printed circuit boards. The proposed EBG structure is implemented simply by adding a rectangular-shaped DGS which is etched periodically onto the ground plane without changing any other geometrical parameter from a mushroom-type EBG structure. The DGS effects on the f _L and f _U are thoroughly analyzed using the dispersion characteristics. We experimentally verified that the proposed EBG structure achieved the wideband power/ground noise suppression (below −40 dB) between 2.5 and 16.2 GHz. In addition, we demonstrated the considerable reduction in f_L from 3.4 to 2.5 GHz and a significant increase in f_U from 9.1 to 16.2 GHz when compared with the mushroom-type EBG structure. [ABSTRACT FROM PUBLISHER]