81 results on '"Keller, Nick"'
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2. 3-D NAND Oxide/Nitride Tier Stack Thickness and Zonal Measurements With Infrared Metrology.
3. 3D NAND Oxide/Nitride Tier Stack Thickness Measurements with Infrared Metrology
4. Characteristic Mueller matrix responses and correlation analysis for vertical GAA nanowire structure manufacturing using RCWA simulated spectra
5. Measurement of W-recess profile in an advanced node 3D NAND device with IRCD technology utilizing a specialized design-rule compliant target
6. In situ spectroscopic ellipsometry and rigorous coupled wave analysis for real time profile evolution of atomic layer deposited films inside SiO2 nanotrenches
7. Decorrelation of optical critical dimensions in mid-infrared ellipsometric spectroscopy of high aspect ratio etch profiles
8. Sexual and Drug Use Risk Behaviors of Long-Haul Truck Drivers and Their Commercial Sex Contacts in New Mexico
9. In situ spectroscopic ellipsometry and rigorous coupled wave analysis for real time profile evolution of atomic layer deposited films inside SiO2 nanotrenches.
10. Measurement of W-recess profile in advanced node 3D NAND device with IRCD technology utilizing a specialized design-rule compliant target
11. Function of a viral genome packaging motor from bacteriophage T4 is insensitive to DNA sequence
12. Risk assessment and screening for sexually transmitted infections, HIV, and hepatitis virus among long-distance truck drivers in New Mexico, 2004-2006
13. Ellipsometric critical dimension metrology employing mid-infrared wavelengths for high-aspect-ratio channel hole module etch processes
14. Scatterometry of nanowire/ nanosheet FETs for advanced technology nodes
15. X-Ray metrology of nanowire/ nanosheet FETs for advanced technology nodes
16. Nondestructive characterization of nanoscale subsurface features fabricated by selective etching of multilayered nanowire test structures using Mueller matrix spectroscopic ellipsometry based scatterometry
17. Novel inline on-device measurement of silicon nitride lateral recess post channel hole ACI with IRCD metrology
18. Runway Safety Area Slope Failure
19. Characterization of Overlay and Tilt in Advanced Technology Nodes using Scatterometry
20. Optical characterization of multi-NST nanowire test structures using Mueller matrix spectroscopic ellipsometry (MMSE) based scatterometry for sub 5nm nodes
21. Non-destructive measurement of bottom width in deep trench isolation structures using IRCD metrology
22. Nonconventional applications of Mueller matrix-based scatterometry for advanced technology nodes
23. Mueller matrix spectroscopic ellipsometry based scatterometry simulations of Si and Si/SixGe1-x/Si/SixGe1-x/Si fins for sub-7nm node gate-all-around transistor metrology
24. Perspective: Optical measurement of feature dimensions and shapes by scatterometry
25. Optical Characterization of multi-NST Nanowire Test Structures using Mueller Matrix Spectroscopic Ellipsometry (MMSE) based scatterometry for sub 5nm nodes.
26. Ellipsometric critical dimension metrology employing mid-infrared wavelengths for high-aspect-ratio channel hole module etch processes
27. Scatterometry of nanowire/nanosheet FETs for advanced technology nodes
28. Advanced applications of scatterometry based optical metrology
29. X-ray metrology of nanowire/ nanosheet FETs for advanced technology nodes
30. A concept artist's journey.
31. Modeling ellipsometric measurement of three-dimensional structures with rigorous coupled wave analysis and finite element method simulations
32. Modeling ellipsometric measurement of novel 3D structures with RCWA and FEM simulations
33. Optical critical dimension metrology for directed self-assembly assisted contact hole shrink
34. Enhancing one dimensional sensitivity with plasmonic coupling: erratum
35. Optical characterization of multi-NST nanowire test structures using Mueller matrix spectroscopic ellipsometry (MMSE) based scatterometry for sub 5nm nodes
36. Sensitivity analysis and line edge roughness determination of 28-nm pitch silicon fins using Mueller matrix spectroscopic ellipsometry-based optical critical dimension metrology
37. Silicon fin line edge roughness determination and sensitivity analysis by Mueller matrix spectroscopic ellipsometry based scatterometry
38. Scatterometric analysis of a plasmonic test structure
39. Optical CD metrology for directed self-assembly assisted contact hole shrink process
40. Enhancing one dimensional sensitivity with plasmonic coupling
41. Comparison of HIV-antibody prevalence in patients consenting to and declining HIV-antibody testing in an STD clinic
42. Modeling ellipsometric measurement of three-dimensional structures with rigorous coupled wave analysis and finite element method simulations.
43. Advanced applications of scatterometry based optical metrology
44. Novel inline on-device measurement of silicon nitride lateral recess post channel hole ACI with IRCD metrology.
45. Optical CD metrology for directed self-assembly assisted contact hole shrink process
46. Silicon fin line edge roughness determination and sensitivity analysis by Mueller matrix spectroscopic ellipsometry based scatterometry
47. Economic perspectives for 1982 indicate downturn: inflation, poor export markets, high import prices show poor 1981 better than this year
48. Scatterometry of nanowire/nanosheet FETs for advanced technology nodes.
49. Ellipsometric critical dimension metrology employing mid-infrared wavelengths for high-aspect-ratio channel hole module etch processes.
50. Function of a Viral Genome Packaging Motor from Bacteriophage T4 is Insensitive to DNA Sequence
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