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This work evaluates the wire bondability and the reliability tests for the stacked-chip TFBGA wire bond packaging with the Sn–4.0Ag–0.5Cu lead-free solder ball. The bonding-over-active-circuit (BOAC) pad is the top test chip and the normal pad is the bottom test chip and is combined in the stacked-chip packaging. Both test chips are 90 nm low-K dielectric with five copper layers and one layer aluminum pad and a background ranging from 775 μm to 150 μm. According to the simulation results, the maximum normal stress of low-K layer for the BOAC pad is higher than that of the normal pad by 146.4%. However, the maximum shear stress of Cu metal layer for the BOAC pad is lower than that of the normal pad by 64.2%. To compare the bonding pad strength for the BOAC and normal pad low-K wafers, this work uses the simplified two-layer model to extract the effective mechanical properties of the two bonding pad structures. The effective average Young’s modulus of the normal pad and the BOAC pad are 86 GPa and 69 GPa, respectively. The test results indicate that the effective Young’s modulus of the normal pad exceeds that of the BOAC pad by 17 GPa. The wire bondability test of the ball shear and the wire pull test results are superior to the specification by 80% and 83.75%, respectively. All stacked-chip TFBGA packaging samples underwent reliability tests, including HAST, TCT, and HTST. All the wire bondability and reliability tests passed the specification for the BOAC pad and the normal pad low-K structures. Accordingly, this work shows that the proposed stacked-chip TFBGA packaging passes the wire bondability and the reliability tests. The proposed packaging improves the electrical performance, enhances the utility of the active chip area and saves chip area through the use of low-K and BOAC chips. Furthermore, the results show that the equivalent stiffness of the bonding pad structure can be used as the bondability and reliability test index for the chip.

Objective Internalized stigma can lead to pervasive negative effects among people with severe mental illness (SMI). Although prevalence of internalized stigma is high, there is a dearth of interventions and meanwhile a lack of evidence as to their effectiveness. This study aims at unraveling the existence of different therapeutic interventions and the effectiveness internalized stigma reduction in people with SMI via a systematic review and meta-analysis. Methods Five electronic databases were searched. Studies were included if they (1) involved community or hospital based interventions on internalized stigma, (2) included participants who were given a diagnosis of SMI > 50%, and (3) were empirical and quantitative in nature. Results Fourteen articles were selected for extensive review and five for meta-analysis. Nine studies showed significant decrease in internalized stigma and two showed sustainable effects. Meta-analysis showed that there was a small to moderate significant effect in therapeutic interventions (SMD = − 0.43; p = 0.003). Among the intervention elements, four studies suggested a favorable effect of psychoeducation. Meta-analysis showed that there was small to moderate significant effect (SMD = − 0.40; p = 0.001). Conclusion Most internalized stigma reduction programs appear to be effective. This systematic review cannot make any recommendation on which intervention is more effective although psychoeducation seems most promising. More Randomized Controlled Trials (RCT) on particular intervention components using standard outcome measures are recommended in future studies.

This work describes two types of low stress bonding over active circuit (BOAC) structures applying a finite element analysis. The advantage of improving the chip area utility of the BOAC design is approximately 150–180 μm for each dimension. A 0.13 μm 2 Mb high-speed SRAM with fluorinated silicate glass (FSG) low- k dielectric was combined with these two BOAC structures as the test vehicles to evaluate the impact of the probing and wire bonding stress on the reliability. Initially, a cantilevered probe card was applied to probe the BOAC pads using the typical and the worse probing conditions. Before and after the circuits probing (CP1 and CP2) the experimental results were compared, including the 2 Mb high-speed SRAM yield and wafer bit map data. The difference between the CP1 and CP2 results were negligible for all probing split cells. Next, the cross-section of the BOAC pad under the probing area was investigated following the worst probing condition. In addition, the BOAC pads evaluate the bondability, including the use of ball shear, wire pull and cratering tests. Moreover, all BOAC packaging samples underwent reliability tests, including HTOL, TCT, TST, and HTST. All the bondability and reliability tests passed the criteria for both proposed BOAC structures. Finally, the immunity level of both proposed BOAC pads, for ESD-HBM (human body mode) and ESD-MM (machine mode), differed slightly from the normal pads. No performance degradation was detected. Accordingly, this work shows that both proposed BOAC structures can be used to improve the active chip area utility or save the chip area.

E-Business represents new avenues for sustainable competitive advantage. Small and medium-sized enterprises (SMEs) are now expected to be digital-ready to continue as trading partners for their customers. SMEs require socio-technical skills and organizational skills and know-how to comprehend e-Potentials and transform them into e-Implementation. An e-Business planning framework is proposed here which links both in strategic and operations management by applying quality function deployment (QFD, also known as house of quality). The balanced scorecard (BSC) will be used to provide an organization overview to objectives setting, critical in ensuring e-Initiatives are aligned with organization vision and objectives. The paper presents the pilot stage of this research project, discussing how the proposed planning framework works. Data from a case study are employed, and expert advice was sought to prioritize and rank the system components (the ‘whats’) and their interrelationships. The paper begins with an in...

Singapore's electronics manufacturers are facing many questions. In the computer hard‐drive industry, where the problem of obsolescence is common and where a product's lifecycle may be only six months, manufacturers are anxious to know what the next order‐winning criteria will be. Since low labour costs are no longer a key factor, many organisations are developing their competencies in research and development, sales and marketing, logistics and supply chain management in order to maintain competitiveness. This paper illustrates how Seagate has envisaged a climate of cooperation and collaboration to better serve its customers in the areas of technology, cost and delivery. The paper is based on observations and findings following a longitudinal case study approach at the Seagate Storage Product Group (SPG) in Singapore. The seven‐stage implementation framework adopted by Seagate in their SCM project is discussed, together with the process of how Seagate has created a paradigm shift towards a new culture of teamwork‐based collaboration.

The application of any e-Solution promises significant returns. In particular, using internet technologies both within enterprises and across the supply (value) chain provides real opportunity, not only for operational improvement but also for innovative strategic positioning. However, significant questions obscure potential investment; how any value will actually be created and, importantly, how this value will be shared across the value chain is not clear. This paper will describe a programme of research that is developing an enterprise simulator that will provide a more fundamental understanding of the impact of e-Solutions across operational supply chains, in terms of both standard operational and financial measures of performance. An efficient supply chain reduces total costs of operations by sharing accurate real-time information and coordinating inter-organizational business processes. This form of electronic link between organizations is known as business-to-business (B2B) e-Business. The financial measures go beyond simple cost calculations to real bottom-line performance by modelling the financial transactions that business processes generate. The paper will show how this enterprise simulator allows for a complete supply chain to be modelled in this way across four key applications: control system design, virtual enterprises, pan-supply-chain performance metrics and supporting e-Supply-chain design methodology.

Companies are leveraging existing resources and the internet to come up with new or modified business models to respond to the demands of e-business. Companies in the food processing industry are also waking to the reality that e-business technology can make a big difference to the bottom line. This paper presents the result of an action research project which applied a new approach labelled as the Delta Model developed by Hax and Wilde (2001) of Sloan School of Management to strategy development for brick-n-mortar companies launching e-business initiatives. The case company is called Whetstone Food Ingredients (WFI), located in UK. The company is firmly embedded in the agri-product industry and operates in the ‘egg by-product’ subsector. This paper is based upon action research supplemented by a programme of in-depth interviews with managers at WFI for various aspects of their supply chain and e-business initiatives. On the basis of these interviews and the companies also made a range of documents available throughout. These included internal memos, strategy plans, operational control documents and minutes of meetings. The Delta Model and Davenport's methodology of business process reengineering were adopted to structure this analysis. Used in conjunction, they helped to develop a vision, analyse the business processes, identify critical business processes, benchmark the critical processes, and then develop the information technology infrastructure. The infrastructure thus supported the critical business processes and leveraged the e-business supply chain to enable the company to gain competitive edge.

Evaluates a simulation approach to measuring supply chain performance which incorporates order release theory. Within manufacturing a number of order release mechanisms have been developed. The importance of order release is first examined and its applicability to monitoring the performance of the supply chain is proposed. A simulation model of a typical, single channel logistics network was developed. Using the simulation model, each of the order release mechanisms was assessed and close agreement was obtained with the work of previous researchers. A new order release approach is proposed which is found to be superior to those analysed previously and should lead to improved supply chain performance.

The rapid changes in the environment have exerted significant pressures on healthcare providers to reassess their strategies. Furthermore, it is a paradox that the best clinicians are, themselves, not the best managers in running the healthcare services. Hence, a management model is set up using quality function deployment (QFD) where strategies are developed through a partnership between managers and clinicians for the provision of total quality healthcare in the light of dramatic changes in the health‐care environment. The QFD‐led model consists of seven parts, which includes service planning, operational planning and new concepts deployment. The power of the QFD‐led model comes from the detailed discussions with customers about their expectations, comparisons with competitors and considerations of how the healthcare provider can meet the customers’ expectations most effectively. The application of QFD in a restructured regional acute‐care hospital is discussed.

The design of flexible manufacturing systems (FMSs) is an essential but costly process. Although FMS design appears to be an excellent area for applying artificial intelligence (AI) and computer simulation techniques, to date there have been limited investigations on integrating AI with the modular simulation software available for FMS design. In this paper an integrated approach for the automatic design of FMS is reported, which uses simulation and multi-criteria decision-making techniques. The design process consists of the construction and testing of alternative designs using simulation methods. The selection of the most suitable design (based on the multi-criteria decision-making technique, the analytic hierarchy process (AHP)) is employed to analyze the output from the FMS simulation models. Intelligent tools (such as expert systems, fuzzy systems and neural networks), are developed for supporting the FMS design process. Active X technique is used for the actual integration of the FMS automatic design process and the intelligent decision support process.

Today, hospitals not only have to contend with the dynamics of regulation and market forces but most importantly “service quality”. Service quality is a measure of how well the total service package meets customers’ expectations. The abilities to identify and prioritize customers’ expectations and to perform existing process assessment are important elements of a successful quality improvement strategy. The inherent characteristics of services complicate the efforts for quality improvement. Quality function deployment (QFD) is a systematic technique for designing services or products that are based on customers’ expectations. Given the proven success of QFD in manufacturing, this paper explores the applicability of QFD in health care. It describes the QFD technique and how it leads to a better understanding of customers’ expectations. It presents recommendations and a generic framework that is supported by empirical findings as a reference model for hospitals.

Patient process recognition and re‐engineering (PPR) has become a major concern of recent health care development and management. This paper discusses the position of the National Health Service (NHS) in the UK; where it is at present and where it aims to be. It suggests that the work of the current government in developing community care is central to the work of both the Leicester Royal Infirmary and the Peterborough Hospitals NHS Trust, when building relationships between primary (community) and secondary (hospital) health care provision. This paper aims to examine whether and how PPR can improve patient processes in the NHS. It does this through a case study of PPR in Peterborough Hospital.

The main thrust of this article is to discuss a survey of 60 companies, predominantly from the user’s perspective, that use the Internet currently; and to examine the effectiveness of their current Internet Web sites. The results of an online survey were subjected to statistical analysis and this revealed some interesting findings. It was found that 30 percent of the companies had facilities for conducting transactions online and only 7 percent charged users for Web site access. Overall, the Web sites rated highly in terms of ease of access, content and structure but scored poorly for their number of unique features. Of the six industry sectors surveyed (electronic commerce, entertainment and leisure, financial and banking services, information services, retailing and travel and tourism), it was the retailing sector that showed the best overall performance. The best individual Web site in the survey was the Financial Times (http://www.ft.com). It is suggested that this initial survey work could be advanced by extending the sample size and by devising a programme of more extensive statistical analysis.

In the past few years a considerable amount of research knowledge regarding organizational change and concurrent engineering (CE) has been accumulated. Suggests that organizational growth provides a framework for the emergence of CE techniques. Organizational growth demands CE and it is important to consider how changes to the organizational structure can best enhance the implementation of CE principles.

Small and medium‐sized firms (SMFs) can make valuable economic and social contributions through their distinctive capabilities for innovation. However, SMFs rarely possess adequate R&D resources and are therefore dependent upon external technological information. We believe that collaboration between higher education institutions (HEIs) and SMFs has considerable potential for strengthening innovatory activity in the UK. However, very little detailed information is available about the process of technology transfer from the perspectives of HEIs and SMFs. This paper examines ways in which HEIs establish links with SMFs as a means of commercializing their scientific and technological research. A questionnaire was used to obtain data from 37 HEIs on technological alliances with SMFs. In addition, a number of interviews were carried out with individuals responsible for marketing HEI science and technology.

Reviews the wide range of perspectives on the nature, scope and implications of computer integrated manufacturing (CIM). Presents the main deliverable of a three‐year programme of research conducted by the Keele Advanced Manufacturing Group. Entitled CIMple (Computer Integrated Manufacturing Programmed Learning Environment), it comprises a hypermedia‐based and business‐oriented design methodology to assist the user in the analysis, design and implementation of CIM systems. Presents both the underlying models within the methodology and information on how CIMple is used in practice.

Digital control strategies for obtaining sinewave output for a current-source cycloconverter with fast dynamic response are presented. The proposed dual-multiprocessor control system ensures high-quality output. By means of a parameter estimator, it is possible to deduce the instantaneous voltage reference for the cycloconverter without resorting to a high-gain loop. With an appropriate forgetting factor chosen, the estimator is capable of fast tracking, and a reliable, stable voltage reference is thereby produced. Improvement using digital feedback control is achieved by adjusting the loop gain according to the instantaneous input reference level. The resulting current source shows excellent steady-state and transient performance in response to system disturbances, and it generally achieves good waveforms. It also works for induction motor loads under normal running conditions and should find wide application as an adjustable-frequency high-performance power convertor. >

This work evaluates the bondability and the reliability tests for the stacked-chip TFBGA wire bond packaging with the Sn-4.0Ag-0.5Cu lead-free solder ball. The bonding-over-active-circuit (BOAC) pad is the top test chip and the normal pad is the bottom test chip and are combined in the stacked-chip packaging. Both test chips are 90 nm low-K dielectric with six copper layers and one layer aluminum pad and a background ranging from 775 mum to 150 mum. To compare the bonding pad strength for the BOAC and normal pad low-K wafers, this study uses depth-sensing indentation method to identify the effective Young's modulus and hardness. The effective average Young's modulus of the normal pad and the BOAC pad are 86 GPa and 69 GPa, respectively. The test results indicate that the effective Young's modulus of the normal pad exceeds that of the BOAC pad by 17 GPa. The average hardness of both test pad structures is very similar, and measures 0.67-0.7 GPa. The wire bonding parameters for both test pads in this study are the same as the normal and the non-low-K pad structure. The bondability test of the ball shear and the wire pull test results are superior to the criteria by 80% and 83.75%, respectively. All stacked-chip TFBGA packaging samples underwent reliability tests, including HAST, TCT, and HTST All the bondability and reliability tests passed the criteria for the BOAC pad and the normal pad low-K structures. Accordingly, this work shows that the proposed stacked-chip TFBGA packaging passes the bondability and the reliability tests. The proposed packaging improves the electrical performance, enhances the utility of the active chip area and saves chip area through the use of low-K and BOAC chips. Furthermore, the results show that the effective Young's modulus can be the index for the pad structure strength, which is obtained from the depth-sensing indentation test.

Schumpeter (1943) linked innovation to the creation of a dynamic economy: ‘The fundamental impulse that sets and keeps the capitalist engine in motion comes from the new consumer goods, the new methods of production or transportation, the new markets, the new forms of industrial organisation that capitalist enterprise creates’. In other words, both product and process innovations are central to the ability of firms to establish competitive advantage over their rivals. However, in many industries it is increasingly difficult to differentiate between product and process innovations. Financial services organisations rely on technology as a means of facilitating or delivering new products. Even in traditional manufacturing industries the distinction between product and process innovation is becoming blurred.

The process development, characterization and performance evaluation of low-k dielectrics to form multi-level Cu interconnects for the 65 nm CMOS technology node are presented. Significant modifications and improvements over 90nm node have been implemented to overcome those challenges as design rules shrink, which include top via corner rounding control for the robust EM/SM reliability, and inline e-beam inspection for via/trench processes optimization. An in-house developed ECP additive "Trameca" for good Cu gap filling and a controllable hump height for good CMP performance are adopted to achieve tight Rs distributions. The facts that 100% yields of 2.1 millions via chain structure and open/short free on 5m long comb/meander structures along with SM/EM meeting the spec all demonstrated the technology to be a highly manufacturable BEOL process for 65 nm technology node.

A reliable microcomputer-based parameter estimator of the induction motor essential for controlling high-performance solid-state AC drives is developed. The formulation is based on discretization of the d-q equations in the rotor frame. The instrumental variables method proves particularly advantageous when dealing with practical systems having appreciable noises in both the input and the output measurements. >

A microprocessor-based scheme for the parameter estimation of cycloconverter-fed induction motors is presented. The method is based on the fundamental equivalent circuit including temperature-dependent resistances and a nonlinear inductance. The difficulty of parameter estimation in the presence of nonlinearity can be overcome by a nonlinear formulation. An iterative algorithm for solving the nonlinear equations is developed. The algorithm consists of an approximate evaluation of the working point and a refined estimation of the induction motor parameters. Simulation results show the validity of the proposed method, which gives effective indentification of the parameters over a wide operating range of the motor despite the effects of magnetic saturation, waveform ripples, and noise contamination of the measurements. >

For the indirect field-oriented control of an induction motor employing a fast-response current-source cycloconverter, a suitable form of discrete-time model, considering measurement noises of the system variables of the motor, is established to facilitate high-performance control. A special algorithm is developed to facilitate simultaneous effective assessment of the motor parameters and evaluation of voltage references essential for the feedforward control of the power converter. The application of the instrumental variables estimation method in the algorithm has proved to be particularly useful in realistic noisy environments. >

Fine pitch leaded components, such as TSOP/QFP, have been widely used in portable electronics in recent years. One of the most critical issues in the electronic packaging industry is to find effective ways to reduce manufacturing related solder joint defects in these electronic components. During the fine pitch component reflow process, major failure mechanisms include solder bridging, solder opens, insufficient soldering, etc. This research aims to develop a physics-based validated modeling methodology, allowing for effective simulation of the solder joint formation process and prediction of the above solder defects. The goal of the methodology is to determine the optimal solder joint configuration (i.e. bond pad size, stencil aperture design, solder volume, etc.) in a cost-effective manner. The solder joint formation process during the solder solidification stage has been simulated using the Surface Evolver software tool. This paper consists of three integral parts: (1) simulation of the 3D solder joint formation process for the final solder joint geometry configurations; (2) determination of the optimal pad/stencil aperture; and (3) determination of the optimal solder paste volume and material. The methodology can also enable one to analyze the safety margin for a given pad/stencil aperture design. Finally, the simulation models were used to accurately pinpoint the deficiencies in certain pad/stencil aperture designs, which can cause solder bridging, opens or insufficient soldering.

In today’s highly competitive healthcare environment, hospitals increasingly realise the need to focus on service quality as a means to improve their competitive position. Customer‐based determinants and perceptions of service quality therefore play an important role when choosing a hospital. This paper attempts to determine the expectations and perceptions of patients through the use of a generic, internationally used market research technique called SERVQUAL. An analysis covering 252 patients revealed that there was an overall service quality gap between patients’ expectations and perceptions. Thus, improvements are required across all the six dimensions, namely, tangibility, reliability, responsiveness, assurance, empathy and accessibility and affordability.

The ability of firms to introduce new products and to improve their manufacturing processes is central to the creation of competitive advantage. However, Utterback and Abernathy argue that during the course of a product life-cycle there is a gradual shift in emphasis from product to process innovations. It is therefore essential for managers to understand the interaction of product and process during the shift from introduction to maturity. Zahra et al. integrate the frameworks developed by Miles and Snow and Porter to give five generic strategic types: Defender, Cost Leader, Analyser, Cost Differentiator, Prospector. Of central importance to the model is whether managers concentrate their resources on product or process innovation. To examine the relationship between product and process innovation, research was carried out in two mid-corporate manufacturing companies. PAC and Stern are suppliers to the major motor manufacturers but are not direct competitors. The two companies are classified as different strategic types; PAC has adopted an "analyser" strategy and Stern is pursuing a "cost leadership" strategy. The results confirm that generic strategies have direct implications for technology strategy and for the emphasis on product or process innovation.

This paper describes nineteen tests carried out to study the behaviour of longitudinal stiffeners on web plates subjected to predominant shear loading. By considering stiffeners of various dimensions, the behaviour of inadequate and adequate stiffeners is observed and optimum stiffener proportions are established. It is noted that current design rules are safe but over-conservative. An alternative, simple design method is proposed wherein the stiffener is first proportioned according to linear buckling theory and its ultimate load capacity is then checked. It is concluded that, taken in conjunction with complementary information provided previously by the authors, the information provided in this paper should allow current restrictions upon the use of tension field theory for design to be removed.

The application of microprocessors for the control of a voltage-source cycloconverter is described. One of the processors is specifically designed to handle the real-time estimation of the true current zero of a dynamic motor load, thereby determining the optimum instant for current transfer between the equivalent positive and negative converter groups. An algorithm to obtain a fast initial estimate in each half cycle of the output and another algorithm to perform recursive estimation of the cross-over location have been developed.

The paper describes nine tests on two large-scale, transversely stiffened plate girders. The objectives of the tests were to determine the ultimate load capacities, to study the modes of failure and, in particular, to investigate the behaviour of the transverse web stiffeners. The results obtained show that the tension field mechanism approach is capable of predicting the ultimate load capacities of girders with widely differing values of web panel aspect ratio, including girders with closely spaced stiffeners. The new design code for steel bridges, BS 5400, is shown to give slightly, but not unreasonably, conservative values of girder capacity. The tests have also shown that the methods currently proposed for the design of transverse web stiffeners are safe but conservative. The detailed observations of stiffener behaviour reported in the paper should facilitate future development of improved methods of stiffener design.

There are advantages accruing from using triacs in the power circuits of cycloconverters for small and medium drives and from adopting microprocessor control as a replacement for the conventional analogue control circuits. Although an experimental system has been successfully implemented, there has arisen a need to resolve the apparent conflict between the use of a small number of interrupts applied to the microprocessor and a smooth current crossover. A related but distinct problem that calls for attention is the selection of the current zero to minimise unnecessary current distortion. The development of software techniques to improve the waveform synthesis of the microprocessor-controlled triac cycloconverter forms the subject of the present discussion.

There are advantages accruing from using triacs in the power circuits of cycloconverters for small and medium drives and from adopting microprocessor control as a replacement for the conventional analogue control circuits. Although an experimental system has been successfully implemented, there has arisen a need to resolve the apparent conflict between the use of a small number of interrupts applied to the microprocessor and a smooth current crossover. A related but distinct problem that calls for attention is the selection of the current zero to minimise unnecessary current distortion. The development of software techniques to improve the waveform synthesis of the microprocessor-controlled triac cycloconverter forms the subject of the present discussion.