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21 results on '"Jong-Joo Rha"'

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1. Analysis of Microstructure Evolution and Mechanical Properties during Compression of Open-Cell Ni-Foams with Hollow Struts Using Micro-CT and FEM

2. Broadband Visible and Near-Infrared Absorbers Implemented with Planar Nanolayered Stacks

4. Effect of ozone pulse time on the properties of the thin-film amorphous-silicon solar cell with atomic-layer-deposited V2O5-x films as the hole-transporting layer

5. Structural coloration of stainless steel with planar thin-film surface cavity structure

6. Fabrication of metal electrodes on flexible substrates by controlled deposition of conductive nano-ink

7. Fabrication of Micro Pattern on Flexible Substrate by Nano Ink using Superhydrophobic Effect

8. Effect of Two-step CHF3Plasma Treatment for Poly(imide) and Poly(ethyleneTerephthalate) Pre-treated by O2Plasma on Surface Characteristics

9. Lubrication properties of silver-palladium alloy prepared by ion plating method for high temperature stud bolt

10. The Surface Morphology and Characteristics of Poly (ethylene Terephthalate) Film

11. THE EFFECT OF RESIDUAL STRESS ON THE WEAR PROPERTIES OF DLC COATINGS

12. Silver-palladium alloy deposited by DC magnetron sputtering method as lubricant for high temperature application

13. Fabrication of Super Water Repellent Surfaces by Vacuum Plasma

14. Effect of metal ion implantation on thermal instability of diamond-like carbon films

15. Microstructures, mechanical properties, and tribological behaviors of Cr–Al–N, Cr–Si–N, and Cr–Al–Si–N coatings by a hybrid coating system

17. A study of the interfacial structure between the TiN film and the iron nitride layer in a duplex plasma surface treatment

18. The effect of Ti ion bombardment on the interfacial structure between TiN and iron nitride

19. Boron nitride stamp for ultra-violet nanoimprinting lithography fabricated by focused ion beam lithography

20. Low Temperature Two-Step Atomic Layer Deposition of Tantalum Nitride for Cu Diffusion Barrier

21. Low Temperature Two-Step Atomic Layer Deposition of Tantalum Nitride for Cu Diffusion Barrier.

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