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The authors use optical supercontinuum spectroscopy to probe the time evolution of the absorption spectrum of gallium vacancy charge states in \ensuremath{\beta}- Ga${}_{2}$O${}_{3}$ at ultrafast time scales.

We report enhancement-mode $\beta $ -Ga2O3 (BGO) MOSFETs on a Si-doped homoepitaxial channel grown by molecular beam epitaxy. A gate recess process is used to partially remove the epitaxial channel under the 1- $\mu \text{m}$ gated region to fully deplete at ${V}_{\textsf {GS}}= 0$ V. BGO MOSFETs achieve drain current density near 40 mA/mm and ${I}_{ \mathrm{\scriptscriptstyle ON}}/{I}_{ \mathrm{\scriptscriptstyle OFF}}$ ratio ~109 which is the highest reported for homoepitaxial normally-off BGO transistors. At ${V}_{\textsf {GS}}= \textsf {0}$ V, a breakdown voltage of 198 and 505 V is achieved with the source–drain spacing of 3 and $8~\mu \text{m}$ , respectively. The power switching figure of merits for dc conduction and dynamic switch losses meet or exceed the theoretical silicon limit and previously reported depletion-mode BGO transistors.

We report on MOSFETs fabricated on Ge-doped $\beta $ -Ga2O3 homoepitaxial material grown by molecular beam epitaxy on (010) Fe-doped semi-insulating substrates. The Ge-doped channel devices performed similar to previously reported devices with Sn- and Si-doped channels with the drain current ON/OFF ratios of $> 10^{8}$ and the saturated drain current of >75 mA/mm at $V_{G}=0$ V. Hall effect measurements showed a high carrier mobility of 111 cm2/( $\text{V}\cdot \text{s}$ ) with $4\times 10^{17}$ cm $^{-3}$ active carriers. A MOSFET with a gate-drain spacing of $5.5~\mu \text{m}$ had a three-terminal breakdown voltage of 479 V.

This paper introduces a growth method---suboxide molecular-beam epitaxy (S-MBE)---which enables the growth of Ga2O3 and related materials at growth rates exceeding 1 micrometer per hours with excellent crystallinity in an adsorptioncontrolled regime. Using a Ga + Ga2O3 mixture with an oxygen mole fraction of x(O) = 0.4 as an MBE source, we overcome kinetic limits that had previously hampered the adsorption-controlled growth of Ga2O3 by MBE. We present growth rates up to 1.6 micrometer per hour for Ga2O3--Al2O3 heterostructures with unprecedented crystalline quality and also at unparalleled low growth temperature for this level of perfection. We combine thermodynamic knowledge of how to create molecular-beams of targeted suboxides with a kinetic model developed for the S-MBE of III-VI compounds to identify appropriate growth conditions. Using S-MBE we demonstrate the growth of phase-pure, smooth, and high-purity homoepitaxial Ga2O3 films that are thicker than 4 micrometer. With the high growth rate of S-MBE we anticipate a significant improvement to vertical Ga2O3-based devices. We describe and demonstrate how this growth method can be applied to a wide-range of oxides. S-MBE rivals leading synthesis methods currently used for the production of Ga2O3-based devices., Comment: 15 pages, 12 figures

Here, we have explored the thermal stability of α-(Al,Ga)2O3 grown by the molecular-beam epitaxy on m-plane sapphire under high-temperature annealing conditions for various Al compositions (i.e., 0%, 46%, and 100%). Though uncapped α-Ga2O3 undergoes a structural phase transition to the thermodynamically stable β-phase at high temperatures, we find that an aluminum oxide cap grown by atomic layer deposition preserves the α-phase. Unlike uncapped α-Ga2O3, uncapped α-(Al,Ga)2O3 at 46% and 100% Al content remain stable at high temperatures. We quantify the evolution of the structural properties of α-Ga2O3, α-(Al,Ga)2O3, and α-Al2O3 and the energy bandgap of α-Ga2O3 up to 900 °C. Throughout the anneals, the α-Ga2O3 capped with aluminum oxide retains its high crystal quality, with no substantial roughening.

β-Ga2O3 is an ultra-wide bandgap semiconductor and is thus expected to be optically transparent to light of sub-bandgap wavelengths well into the ultraviolet. Contrary to this expectation, it is found here that free electrons in n-doped β-Ga2O3 absorb light from the IR to the UV wavelength range via intra- and inter-conduction band optical transitions. Intra-conduction band absorption occurs via an indirect optical phonon mediated process with 1 / ω 3 dependence in the visible to near-IR wavelength range. This frequency dependence markedly differs from the 1 / ω 2 dependence predicted by the Drude model of free-carrier absorption. The inter-conduction band absorption between the lowest conduction band and a higher conduction band occurs via a direct optical process at λ ∼ 349 nm (3.55 eV). Steady state and ultrafast optical spectroscopy measurements unambiguously identify both these absorption processes and enable quantitative measurements of the inter-conduction band energy and the frequency dependence of absorption. Whereas the intra-conduction band absorption does not depend on light polarization, inter-conduction band absorption is found to be strongly polarization dependent. The experimental observations, in excellent agreement with recent theoretical predictions for β-Ga2O3, provide important limits of sub-bandgap transparency for optoelectronics in the deep-UV to visible wavelength range and are also of importance for high electric field transport effects in this emerging semiconductor.

Beta-Ga2O3 has emerged as a promising candidate for electronic device applications because of its ultra-wide bandgap, high breakdown electric field, and large-area affordable substrates grown from the melt. However, its thermal conductivity is at least one order of magnitude lower than that of other wide bandgap semiconductors such as SiC and GaN. Thermal dissipation in electronics made from beta-Ga2O3 will be the bottleneck for real-world applications, especially for high power and high frequency devices. Similar to GaN/AlGaN interfaces, beta-(AlxGa1-x)2O3/Ga2O3 heterogeneous structures have been used to form a high mobility two-dimensional electron gas (2DEG) where joule heating is localized. The thermal properties of beta-(AlxGa1-x)2O3/Ga2O3 are the key for heat dissipation in these devices while they have not been studied before. This work reports the first measurement on thermal conductivity of beta-(Al0.1Ga0.9)2O3/Ga2O3 superlattices from 80 K to 480 K. Its thermal conductivity is significantly reduced (5.7 times reduction) at room temperature comparing with that of bulk Ga2O3. Additionally, the thermal conductivity of bulk Ga2O3 with (010) orientation is measured and found to be consistent with literature values regardless of Sn doping. We discuss the phonon scattering mechanism in these structures by calculating their inverse thermal diffusivity. By comparing the estimated thermal boundary conductance (TBC) of beta-(Al0.1Ga0.9)2O3/Ga2O3 interfaces and Ga2O3 maximum TBC, we reveal that some phonons in the superlattices transmit through several interfaces before scattering with other phonons or structural imperfections. This study is not only important for Ga2O3 electronics applications especially for high power and high frequency applications, but also for the fundamental thermal science of phonon transport across interfaces and in superlattices.

The goal is to gain additional insight into physical mechanisms and the role of microstructure on the formation of ohmic contacts and the reduction of contact resistance. We have measured a decreasing film resistivity in the vertical direction with increasing thickness of pulsed-laser deposited ZnO and IGZO. As the ZnO thickness increases from 122 nm to 441 nm, a reduction in resistivity from 3.29 Ω-cm to 0.364 Ω-cm occurred. The IGZO resistivity changes from 72.4 Ω-cm to 0.642 Ω-cm as the film is increased from 108nm to 219 nm. In the ZnO, the size of nanocolumnar grains increase with thickness resulting in fewer grain boundaries, and in the amorphous IGZO, the thicker region exhibits tunnel-like artifacts which may contribute to the reduced resistivity.

In this work, we provide early insight into the combined tradespace for both power switching and RF applications afforded by the high critical, electric-field strength of β-Ga 2 O 3 . MOSFETs formed by homoepitaxial growth of β-Ga 2 O 3 films doped with Sn, Si, and Ge on bulk substrates have been characterized electrically. Several key milestones have been achieved such as enhancement-mode operation > 600 V, low ohmic contact resistance < 0.2 Ω·mm, and RF power gain in the GHz regime. These results show great promise for monolithic and hybrid integration of RF amplifiers and switch technologies.

As a transparent conducting oxide with a large bandgap of ∼4.9 eV and associated large estimated critical electric field (E c ) strength of 8 MV/cm, β-Ga 2 O 3 (BGO) has been touted for its tremendous potential as a power switch. Power switch metrics such as Baliga's figure of merit (BFOM) estimating dc conduction losses and Huang's material figure of merit (HMFOM) incorporating dynamic switching losses are functions of E C 3 and E C respectively [1, 2]. BFOM for BGO is expected to exceed that of GaN by 400% and HMFOM for BGO is expected to be comparable to GaN. It can also be shown that for a given power loss during switching, the switch frequency (f) varies as E C 2 suggesting the potential of BGO power conversion in the GHz regime [1, 2]. The manufacturability and cost value proposition of BGO based on large area native substrate availability as shown by Huang's chip area manufacturing FOM (HCAFOM) indicate a disruptive cost advantage over GaN (330%). Additionally, the Johnson figure of merit (JFOM) representing the power-frequency product for RF amplification for BGO is similar to that of GaN indicating potential for integration of power conversion and RF applications in the same platform. Finally, Huang's high temperature figure of merit (HTFOM) shows that BGO has the lowest metric for all semiconductors compared here due to low thermal conductivity and high field strength. However, all wide bandgap power semiconductors, including diamond, face significant thermal engineering challenges relative to Si because of the inherent high energy densities of materials with large E c values. A summary of unipolar FET figure-of-merit comparisons for power semiconductors is shown in Table 1.

Beta-phase gallium oxide (Ga 2 O 3 ) is a promising wide bandgap semiconductor possessing a larger bandgap (∼4.8 eV) and critical electric field strength (∼8 MV/cm) than GaN and SiC [1]. Early metal-oxide-semiconductor field-effect transistors (MOSFETs) have shown promising depletion-mode operation with high critical field strength [2], high-current density [3] and high breakdown voltage [4]. On native substrates, enhancement-mode operation has been achieved with a gated unintentional doped channel [5] and fin-channels [6], the latter achieving 600-V normally-off breakdown voltage. However, both are limited to ∼1 mA/mm or less. Here, we report a new enhancement-mode device achieved by gate recess with improved drain-current > 20 mA/mm and near 200-V breakdown for laterally scaled 3-μm source-drain distance (L sd ).

The breadth of circuit fabrication opportunities enabled by metal-oxide thin-film transistors (MO-TFTs) is unprecedented. Large-area deposition techniques and high electron mobility are behind their adoption in the display industry, and substrate agnosticism and low process temperatures enabled the present wave of flexible electronics research. Reports of circuits involving complementaryMO-TFTs, oxide-organic hybrid combinations, and even MO-TFTs integrated onto Si LSI back end of line interconnects demonstrate this technology’s utility in 2D and 3D monolithic heterogeneous integration (HI). In addition to a brief literature review focused on functional HI between MO-TFTs and a variety of dissimilar active devices, we share progress toward integrating MO-TFTs with compound semiconductor devices, namely GaN HEMTs. A monolithically integrated cascode topology was used to couple a HEMT’s >200 V breakdown characteristic with the gate driving characteristic of an IGZO TFT, effectively shifting the HEMT threshold voltage from -3 V to +1 V.

Si-doped Ga2O3 thin films were fabricated by pulsed laser deposition on semi-insulating (010) β-Ga2O3 and (0001) Al2O3 substrates. Films deposited on β-Ga2O3 showed single crystal, homoepitaxial growth as determined by high resolution transmission electron microscopy and x-ray diffraction. Corresponding films deposited on Al2O3 were mostly single phase, polycrystalline β-Ga2O3 with a preferred (20 1 ¯ ) orientation. An average conductivity of 732 S cm−1 with a mobility of 26.5 cm2 V−1 s−1 and a carrier concentration of 1.74 × 1020 cm−3 was achieved for films deposited at 550 °C on β-Ga2O3 substrates as determined by Hall-Effect measurements. Two orders of magnitude improvement in conductivity were measured using native substrates versus Al2O3. A high activation efficiency was obtained in the as-deposited condition. The high carrier concentration Ga2O3 thin films achieved by pulsed laser deposition enable application as a low resistance ohmic contact layer in β-Ga2O3 devices.

We report on Sn-doped β-Ga2O3 MOSFETs grown by molecular beam epitaxy with as-grown carrier concentrations from 0.7 × 1018 to 1.6 × 1018 cm−3 and a fixed channel thickness of 200 nm. A pulsed current density of >450 mA/mm was achieved on the sample with the lowest sheet resistance and a gate length of 2 μm. Our results are explained using a simple analytical model with a measured gate voltage correction factor based on interface charges that accurately predict the electrical performance for all doping variations.

Sn-doped gallium oxide (Ga2O3) wrap-gate fin-array field-effect transistors (finFETs) were formed by top-down BCl3 plasma etching on a native semi-insulating Mg-doped (100) β-Ga2O3 substrate. The fin channels have a triangular cross-section and are approximately 300 nm wide and 200 nm tall. FinFETs, with 20 nm Al2O3 gate dielectric and ∼2 μm wrap-gate, demonstrate normally-off operation with a threshold voltage between 0 and +1 V during high-voltage operation. The ION/IOFF ratio is greater than 105 and is mainly limited by high on-resistance that can be significantly improved. At VG = 0, a finFET with 21 μm gate-drain spacing achieved a three-terminal breakdown voltage exceeding 600 V without a field-plate.