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10. Studies on phosphoglycerate mutases

12. A wire-bond-less 10 KV SiC MOSFET power module with reduced common-mode noise and electric field

13. Next generation integrated drive: a novel thermal and electrical integration technique for high power density converters used in automotive drive systems

14. Design and development of a high-density, high-speed 10 kV SiC MOSFET module

15. Using multi time-scale electro-thermal simulation approach to evaluate SiC-MOSFET power C=converter in virtual prototyping design tool

16. Suppression of electromagnetic interference using screening and shielding techniques within switching cells

23. Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator

26. Integrated half-bridge switch using 70-μm-thin devices and hollow interconnects

27. Integrated Half-Bridge Switch Using 70- ?m-Thin Devices and Hollow Interconnects

28. Interdiffusion coefficients of binary multiphase systems with consideration of variation in Molar volumes

29. A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography

30. Packaging/assembling technologies for a high performance SiC-based planar power module

31. Time-Efficient Sintering Processes to Attach Power Devices Using Nanosilver Dry Film.

33. Built-in Reliability Design of Highly Integrated Solid-State Power Switches With Metal Bump Interconnects.

34. A GaN-HEMT Compact Model Including Dynamic R DSon Effect for Power Electronics Converters.

35. Highly-integrated power cell for high-power wide band-gap power converters

36. Novel silicon carbide integrated power module for EV application

37. A wire-bond-less 10 KV SiC MOSFET power module with reduced common-mode noise and electric field

38. Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling

39. Next generation integrated drive: a novel thermal and electrical integration technique for high power density converters used in automotive drive systems

40. A new analysis for finding the optimum power rating of low voltage distribution power electronics based on statistics and probabilities

41. Characterisation and modeling of Gallium nitride power semiconductor devices dynamic on-state resistance

42. A study on probability of distribution loads based on expectation maximization algorithm

43. Design optimization of quasi-active gate control for series-connected power devices

44. Suppression of electromagnetic interference using screening and shielding techniques within switching cells

45. Design and development of a high-density, high-speed 10 kV SiC MOSFET module

46. A novel full soft-switching resonant power converter for mid-feeder voltage regulation of low voltage distribution network

47. Time-efficient sintering processes to attach power devices using nanosilver dry film

48. Improved reliability of planar power interconnect with ceramic-based structure

49. A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography

50. Using multi time-scale electro-thermal simulation approach to evaluate SiC-MOSFET power C=converter in virtual prototyping design tool