291 results on '"Johnson, Christopher Mark"'
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2. Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints
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3. Development and Validation of a Smart Architecture for Thyristor Valves
4. Dependence of overcurrent failure modes of IGBT modules on interconnect technologies
5. The turn-off behaviour and reliability of large area GTO thyristors
6. Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles
7. Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process
8. A GaN-HEMT Compact Model Including Dynamic RDSon Effect for Power Electronics Converters
9. Accurate Measurement of Dynamic on-State Resistances of GaN Devices Under Reverse and Forward Conduction in High Frequency Power Converter
10. Studies on phosphoglycerate mutases
11. System and writings in the philosophy of Jacques Derrida
12. A wire-bond-less 10 KV SiC MOSFET power module with reduced common-mode noise and electric field
13. Next generation integrated drive: a novel thermal and electrical integration technique for high power density converters used in automotive drive systems
14. Design and development of a high-density, high-speed 10 kV SiC MOSFET module
15. Using multi time-scale electro-thermal simulation approach to evaluate SiC-MOSFET power C=converter in virtual prototyping design tool
16. Suppression of electromagnetic interference using screening and shielding techniques within switching cells
17. A High Performance and Low Cost Half Bridge IGBT Planar Power Module
18. Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling
19. Characterisation and Modeling of Gallium Nitride Power Semiconductor Devices Dynamic On-State Resistance
20. Thermal performance and reliability of high temperature SiC power module with direct-cooled stacked Si3N4 substrates
21. Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure
22. A Physical RC Network Model for Electrothermal Analysis of a Multichip SiC Power Module
23. Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator
24. Time-Efficient Sintering Processes to Attach Power Devices Using Nanosilver Dry Film
25. Interconnect Materials Enabling IGBT Modules to Achieve Stable Short-Circuit Failure Behavior
26. Integrated half-bridge switch using 70-μm-thin devices and hollow interconnects
27. Integrated Half-Bridge Switch Using 70- ?m-Thin Devices and Hollow Interconnects
28. Interdiffusion coefficients of binary multiphase systems with consideration of variation in Molar volumes
29. A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography
30. Packaging/assembling technologies for a high performance SiC-based planar power module
31. Time-Efficient Sintering Processes to Attach Power Devices Using Nanosilver Dry Film.
32. Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment
33. Built-in Reliability Design of Highly Integrated Solid-State Power Switches With Metal Bump Interconnects.
34. A GaN-HEMT Compact Model Including Dynamic R DSon Effect for Power Electronics Converters.
35. Highly-integrated power cell for high-power wide band-gap power converters
36. Novel silicon carbide integrated power module for EV application
37. A wire-bond-less 10 KV SiC MOSFET power module with reduced common-mode noise and electric field
38. Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling
39. Next generation integrated drive: a novel thermal and electrical integration technique for high power density converters used in automotive drive systems
40. A new analysis for finding the optimum power rating of low voltage distribution power electronics based on statistics and probabilities
41. Characterisation and modeling of Gallium nitride power semiconductor devices dynamic on-state resistance
42. A study on probability of distribution loads based on expectation maximization algorithm
43. Design optimization of quasi-active gate control for series-connected power devices
44. Suppression of electromagnetic interference using screening and shielding techniques within switching cells
45. Design and development of a high-density, high-speed 10 kV SiC MOSFET module
46. A novel full soft-switching resonant power converter for mid-feeder voltage regulation of low voltage distribution network
47. Time-efficient sintering processes to attach power devices using nanosilver dry film
48. Improved reliability of planar power interconnect with ceramic-based structure
49. A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography
50. Using multi time-scale electro-thermal simulation approach to evaluate SiC-MOSFET power C=converter in virtual prototyping design tool
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