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A silicon‐containing arylacetylene resin (PSA)/SiO2 syntactic foam was prepared through a chemical foaming approach, with PSA serving as the matrix, quartz sand (QS) and nanosilica (nSiO2) acting as fillers, and their structures and properties were characterized. The results show that the incorporation of appropriate amounts of QS and nSiO2 can reduce the cell size and apparent density of the syntactic foam, and improve its heat resistance, dielectric properties and wave transmission properties. The addition of QS can increase the compressive strength of the syntactic foam, while the addition of nSiO2 decreases the compressive strength. The apparent densities of the PSA/9QS and PSA/9nSiO2 syntactic foams with 9% filler addition are 0.242 g cm−3 and 0.157 g cm−3, respectively, and the temperatures at 5% weight loss (Td5) under a nitrogen atmosphere were 692 °C and 658 °C, respectively. The dielectric constants were 1.59 and 1.25, respectively. The wave transmittance within the frequency range of 8.2–12.4 GHz was 98.5% and 96.8%, respectively. PSA/SiO2 syntactic foam can be used as a lightweight and high‐temperature‐resistant wave‐transmission material in aerospace and other fields. [ABSTRACT FROM AUTHOR]

In this study, carbon foam derived from silicon‐containing arylacetylene resin (CFPSA) was prepared by using silicon‐containing arylacetylene (PSA) resin as the carbon precursor and polyurethane (PU) foam as the organic sacrificial template. CFPSAs with diverse apparent densities were prepared through the simple impregnation of PU foam with PSA resin solutions of varying concentrations. Their structures, such as the pore morphology; chemical composition; thermal stability; compression properties, and electromagnetic interference (EMI) shielding effectiveness (SE), were characterized. The results indicate that with an increase in the PSA resin concentration, the skeleton of CFPSA becomes thicker, the pore size slightly increases, the apparent density increases, the compressive strength increases, and the EMI SE slightly reduces. CFPSA‐10's apparent density is 0.032 g/cm3, its 5% thermal weight loss temperature (Td5) in an air atmosphere is 642°C, its thermal conductivity is 38.1 mW/m K, its specific compression strength is 2.45 MPa/g cm3, and its specific EMI SE divided by thickness (SSE/t) is 2367 dB cm2/g. CFPSA exhibits lightweight and antioxidant properties, as well as excellent electromagnetic interference shielding performance, presenting great potential for application in aerospace and other fields. [ABSTRACT FROM AUTHOR]

Silicon‐containing arylacetylene resin (PSA)‐matrix composites hold great potential for aerospace applications due to their excellent heat resistance. In recent years, many PSAs with specific functions have been designed via materials genome approach (MGA), and appropriate resin transfer molding (RTM) curing processes need to be screened to strike a balance between low cost and high quality. In this study, a novel tool based on finite element curing simulation and multiobjective genetic algorithm was developed to optimize the RTM curing process for novel PSA‐matrix composites. The silicon‐containing fluorenylacetylene resin (PSA‐VBF) was selected as the object to systematically characterize its apparent curing kinetics. To address the problem of explosive polymerization of the resin at the injection port during the RTM process, a multiobjective optimization of the curing process using a genetic algorithm was performed to obtain the Pareto front with the maximum temperature gradient at the injection port of the resin, the maximum degree of cure gradient of the composites, and the process time as the objectives. A global sensitivity analysis was also conducted to identify the key parameters. The results demonstrate that the optimized curing process can significantly reduce the temperature gradient and the curing degree gradient with improved curing efficiency. [ABSTRACT FROM AUTHOR]