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A three-dimensional (3-D) skeleton-reinforced copper composite was designed to overcome the paradox between strength and ductility or conductivity. Open cell copper matrix foams with uniformly embedded reduced graphene oxide (RGO) were prepared via electrodeposition. The foam pores were filled with pure copper phase via spark plasma sintering (SPS). Cu 2 O nanoparticles were formed at the RGO-Cu interface, resulting in improved interfacial bonding. Three-dimensional skeleton-reinforced composites showing a combination of high electrical conductivity (93.24% IACS), tensile strength (343 MPa), and fracture elongation (39.4%) were fabricated with low levels of RGO (0.024 wt%). The possible strengthening mechanism of the skeleton-reinforced composites is discussed basing on the test results. [ABSTRACT FROM AUTHOR]

In this study, copper composite foams reinforced with Al 2 O 3 decorated graphene oxide (AG) were prepared via chemical plating and electrodeposition. Subsequently, copper powders were filled into the pores of the composite foams and then spark plasma sintering (SPS) was employed to fabricate the 3D skeleton-reinforced composites. The tensile strength reached 365 MPa for AG/Cu f ®Cu composites, which was 47.1%, 33.7%, and 13% higher compared with the pure copper, Cu f ®Cu, and GO/Cu f ®Cu composites, respectively. Additionally, improved friction properties with obviously decreased friction coefficient and wear rate were shown in the AG/Cu f ®Cu composite. The structure study and strengthening mechanism analysis indicated that the decoration of Al 2 O 3 on the graphene oxide resulted in enhanced interface bonding, higher load transfer efficiency for the mechanical and friction properties improvement. • Copper composite foams reinforced with Al 2 O 3 decorated graphene oxide (AG) were prepared. • Copper composites reinforced by AG/Cu composite foams were designed and prepared. • Enhanced mechanical and friction properties were shown in the composites. [ABSTRACT FROM AUTHOR]

The use of carbon nanotubes (CNTs) as reinforcing phase in copper-based composites has been extensively studied. However, controlling the synthesis interface structure and explaining the nanoscale interface bonding mechanism through experimental methods still poses challenges. In this study, a model of single-walled carbon nanotube nanocrystalline copper composite was established based on molecular dynamics (MD) simulations to investigate the effects of grain boundaries and dislocations on the composite material. It was found that the addition of nickel atoms improved the interface bonding between carbon nanotubes and the copper matrix, reducing vacancies at the interface. Ni@SWCNT/Cu exhibited better mechanical properties. Structural changes and defect evolution during deformation were studied. The ultimate tensile strength of SWCNT/Cu and Ni@SWCNT/Cu composites increased by 62.29 % and 68.78 % respectively compared to nanocrystalline copper, while the Young's modulus increased by 25.91 % and 32.48 % respectively; moreover, the Young's modulus of these two composites increased by 45.24 % and 49.42 % respectively. Ni@SWCNT/Cu had the lowest wear rate and friction coefficient, with a minimum wear rate of 0.0055 and a minimum friction coefficient of 0.67, demonstrating better wear resistance. The effects of different friction speeds and depths of indentation on the friction performance of the composite materials were also investigated. [ABSTRACT FROM AUTHOR]