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3 results on '"Jia-Peng Hou"'

1. Fatigue and Fracture Behavior of a Cold-Drawn Commercially Pure Aluminum Wire

Author

Jia-Peng Hou, Qiang Wang, Hua-Jie Yang, Xi-Mao Wu, Chun-He Li, Zhe-Feng Zhang, and Xiao-Wu Li

Subjects
commercially pure aluminum conductor, cold drawing, tension–tension fatigue, grain boundary migration, fracture, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
Abstract

Fatigue properties and cracking behavior of cold-drawn commercially pure aluminum wires (CPAWs) widely used as the overhead transmission conductors were investigated. It was found that the fracture surface of the CPAWs shows an obvious four-stage fracture characteristic, i.e., crack initiation, planar crack propagation, 45°-inclined crack propagation and final rapid fracture. The crack growth mechanisms for the CPAWs were found quite different from those for the conventional coarse-grained materials. The cracks in the CPAWs firstly grow along the grain boundaries (Stage I crack growth), and then grow along the plane of maximum shear stress during the last stage of cycling (Stage II crack growth), leading to the distinctive fracture surfaces, i.e., the granular surface in the planar crack propagation region and the coarse fatigue striations in the 45°-inclined crack propagation region. The grain boundary migration was observed in the fatigued CPAWs. The increase in fatigue load enhances the dislocation recovery, increases the grain boundary migration rate, and thus promotes the occurrence of softening and damage localization up to the final failure.

Published
2016
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2. Mechanism of Abnormal Strength-Electrical Conductivity Relation for an Al-Fe Alloy Wire

Author

Li Rui, Hong Yun Yu, Ma Heng, Qiang Wang, Xiao Wu Li, Jia Peng Hou, Zhefeng Zhang, Zhen Jun Zhang, and Qing Yin Chen

Subjects
Materials science, Electrical resistivity and conductivity, Alloy, engineering, Texture (crystalline), Deformation (engineering), Conductivity, engineering.material, Composite material, Critical value, Microstructure, Tensile testing
Abstract

Excellent strength and electrical conductivity are of great significance for Al wires applied on overhead transmission lines, since the strength and the electrical conductivity are mutually exclusive. In this paper, the strength-electrical conductivity relation of an Al-1.13 wt.% Fe wire fabricated by cold drawing process was investigated by means of microstructure characterization, tensile test, electrical test and theoretical calculation. At the initial stage of the cold-drawing deformation, the strength and the electrical conductivity exhibit a traditional trade-off relation. Surprisingly, the strength-electrical conductivity relation turns to be abnormal as the area reduction exceeds a critical value, 61.9%. The particular phenomenon can be well explained by the formation of the elongated grains. Additionally, the Fe-contained nano-scale precipitates together with the low solubility of Fe element also have an outstanding contribution to the strength and the electrical conductivity of Al-Fe alloy wire. Consequently, the elongated grains, the texture, the low solubility and the nano-scale precipitates are proposed as four mechanisms for designing and preparing high strength-high electrical conductivity Al wire.

Published
2019

3. [Recent advances and perspective in the study of the nano-reinforcing materials for molecular imprinting of proteins]

Author

Zhi-hui, Wu, Miao-ling, Chai, Jia-peng, Hou, and Jun, Pan

Subjects
Molecular Imprinting, Binding Sites, Polymers, Molecular Conformation, Proteins, Nanostructures
Abstract

Molecular imprinting technique (MIT) involves the synthesis of polymer in the presence of a template to produce complementary binding sites in terms of its size, shape and functional group orientation. Such kind of polymer possesses specific recognition ability towards its template molecule. Despite the rapid development of MIT over the years, the majority of the template molecules that have been studied are small molecules, while molecular imprinting of proteins remains a significant yet challenging task due to their large size, structural flexibility and complex conformation. This review, we summarized the research findings over the past years, and discussed the nano-reinforcing materials used to prepare molecular imprinting of proteins and the perspective of these nano-reinforcing materials.

Published
2015

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