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Abstract This study uses density functional theory calculations to explore the energetics and electronic structures of planar defects in monoclinic β‐Ga2O3, including twin boundaries (TBs) and stacking faults (SFs). TBs on the (001)A, (001)B, (100)A, (100)B, and (−102) planes are examined; it is found that (100)A has a very low formation energy (0.01 Jm‐2), consistent with its observation in a number of experiments. For SFs, SFs on the (100) plane have much lower energy (0.03 Jm‐2) than SFs formed on the (010) and (001) planes. Growth on a (100) surface is thus expected to result in more planar‐defect formation, again consistent with experimental observations. In spite of their higher energies, TBs and SFs on planes other than (100) have been experimentally observed in epitaxial layers. Their origins are explained in terms of coalescence of different growth regions when the growth direction changes, or when low‐energy TBs on the growing surface lead to domains with different twinning orientation.

We report the continuous Si doping in β-Ga2O3 epitaxial films grown by plasma-assisted molecular beam epitaxy through the use of a valved effusion cell for the Si source. Secondary ion mass spectroscopy results exhibit that the Si doping profiles in β-Ga2O3 are flat and have sharp turn-on/off depth profiles. The Si doping concentration was able to be controlled by either varying the cell temperatures or changing the aperture of the valve of the Si effusion cell. High crystal quality and smooth surface morphologies were confirmed on Si-doped β-Ga2O3 epitaxial films grown on (010) and (001) substrates. The electronic properties of Si-doped (001) β-Ga2O3 epitaxial film showed an electron mobility of 67 cm2/Vs at the Hall concentration of 3 × 1018 cm−3.

The electrical performances of III-nitride blue micro-light-emitting diodes (µLEDs) with different tunnel junction (TJ) epitaxial architectures grown by metalorganic chemical vapor deposition are investigated. A new TJ structure that employs AlGaN is introduced. The current density–voltage characteristic is improved by incorporating AlGaN layer above the n-side of the TJ layer, and the effects of the AlGaN/GaN superlattices is examined. Based upon the data from band diagram simulation, net positive polarization charge is formed at the AlGaN/GaN interface, which results in a reduction in tunneling distance and increase in tunneling probability. Moreover, similar electrical improvement is observed in various device dimensions and is independent of operating current density, suggesting that AlGaN/GaN biaxial tensile strain or current spreading is not the main contribution for the improvement. Finally, the effects on the efficiency performances are determined. While the maximum external quantum efficiency of the TJ devices remains identical, the wall-plug efficiency of µLEDs is enhanced significantly by the proposed AlGaN-enhanced TJ design. This work reveals the possibility of energy efficient TJ contact with high transparency in the visible wavelength range.

We report on vertical β-Ga2O3 power diodes with oxidized-metal Schottky contact (PtOx) and high permittivity (high-κ) dielectric (ZrO2) field plate to improve reverse blocking at both Schottky contact surfaces and edges. The PtOx diodes showed excellent forward transport with near unity ideality factor and similar minimum specific on-resistance as Pt. Moreover, the PtOx contacts facilitated higher breakdown voltage and lower leakage current due to their higher Schottky barrier height (SBH) by more than 0.5 eV compared to that of Pt. Most importantly, the reduced off-state leakage of PtOx diodes enabled orders of magnitude less power dissipation than Pt ones for all duty cycles ≤0.5, indicating their great potential to realize low-loss and efficient, high-power β-Ga2O3 switches. The ZrO2 field-oxide further reduced edge leakage with a consistent increase in breakdown voltage. Device simulation demonstrated that the high permittivity of ZrO2 also led to the peak electric field occurring in β-Ga2O3 instead of the dielectric. These results indicate that the combined integration of oxidized-metal contacts to increase SBH and high-κ dielectric field plate to assist edge termination can be promising to enhance the performance of vertical β-Ga2O3 Schottky diodes.

We report on the improvement of the surface morphology of c-plane GaN films grown at high growth rates (∼1 µm/h) using ammonia molecular beam epitaxy through a series of growth optimizations as well as the introduction of indium as a surfactant. The indium surfactant was expected to help with the adatom mobility and, thus, provide smoother growth surfaces. Through a combination of varying V/III ratios, In flux, and growth temperatures, an optimal condition for surface morphology, characterized by atomic force microscopy, was achieved. At higher Ga fluxes for fast growth rates (∼1 µm/h and beam equivalent pressures of ∼5 × 10−7 Torr), higher ammonia flows were necessary to preserve the surface morphology. In addition, indium was an effective surfactant—reducing the roughness and improving the overall surface morphology. However, excessive indium causes the surface morphology to degrade, potentially due to the enhancement of the Ga desorption from the surface as a result of the reaction of indium with ammonia for high indium fluxes. The indium surfactant also resulted in a reduction of background Si impurity concentrations in the film. These effects allow for the growth of thick drift layers with low background dopant concentrations for vertical GaN power devices.

An orientational dependence on the interfacial reaction between aluminum and (010), (001), and (2̄01) β-Ga2O3 substrates is addressed. Electron microscopy and x-ray diffraction were used to assess the interface crystallinity, thickness, and chemical composition of the interfacial layers. At the interface, amorphous aluminum oxide is observed in all three samples with a thicknesses of 3.5 nm for (010) β-Ga2O3 and 2 nm for (001) β-Ga2O3 and (2̄01) β-Ga2O3. Aluminum oxide is formed at the interface as a result of a chemical reaction that reduces the Ga2O3 surface when aluminum is deposited. We propose that in Al on (010) β-Ga2O3, in which the thickest interfacial oxide layer is observed, diffusional pathways of consecutive octahedral Ga sites perpendicular to the interface promote increased interdiffusion in the out-of-plane direction. In contrast, the (001) β-Ga2O3 and (2̄01) β-Ga2O3 substrates exhibit alternating rows of tetrahedral and octahedral Ga sites parallel to the interface, where the rows of tetrahedral Ga sites act as increased energy barriers that impede interdiffusion of Al and β-Ga2O3. The orientational dependence of metal-oxide interlayers in β-Ga2O3 can impact electronic and thermal transport, pointing to the importance of understanding the impact of β-Ga2O3 orientation on interfacial properties.

The impact of AlGaN growth conditions on AlGaN:Si resistivity and surface morphology has been investigated using metalorganic chemical vapor deposition. Growth parameters including growth temperature, growth rate, and trimethylindium (TMI) flow have been systematically studied to minimize the resistivity of AlGaN:Si. We observed a strong anticorrelation between AlGaN:Si conductivity and growth temperature, suggesting increased silicon donor compensation at elevated temperatures. Secondary ion mass spectrometry and positron annihilation spectroscopy ruled out compensation by common impurities or group-III monovacancies as a reason for the observed phenomenon, in contrast to theoretical predictions. The underlying reason for AlGaN:Si resistivity dependence on growth temperature is discussed based on the possibility of silicon acting as a DX center in Al0.65Ga0.35N at high growth temperatures. We also show remarkable enhancement of AlGaN:Si conductivity by introducing TMI flow during growth. A minimum resistivity of 7.5 mΩ cm was obtained for n-type Al0.65Ga0.35N, which is among the lowest reported resistivity for this composition.

We report on ammonia and plasma-assisted molecular beam epitaxy (NH3-MBE and PAMBE) grown GaN layers with a low net carrier concentration (Nnet). Growth parameters, such as growth rate, V–III ratio, and plasma power, were investigated on different substrates to study their impact on surface morphology and background doping levels using atomic force microscopy and capacitance–voltage (C–V) measurements, respectively. The elevated growth rates are especially interesting for vertical power switches, requiring very thick drift regions (over 10 μm) with low background concentrations. For our NH3-MBE-grown layers, Nnet shows an almost linear increase with the growth rate. Using a freestanding substrate and at a fast growth rate of 1.4 μm hr−1, a Nnet value as low as 1 × 1015 cm−3 was achieved. For samples grown via PAMBE, the lowest Nnet among samples grown under a Ga adlayer was 2 × 1016 cm−3 for a growth rate of 0.32 μm h−1 on a GaN-on-sapphire template. The results support the use of MBE for growing high-quality GaN material with reasonably fast growth rates maintaining low background doping levels for high-voltage vertical power electronic devices.

Achieving high quantum efficiency in long-wavelength LEDs has posed a significant challenge to the solid-state lighting and display industries. In this article, we use V-defect engineering as a technique to achieve higher efficiencies in red InGaN LEDs on (111) Si through lateral injection. We investigate the effects of superlattice structure on the V-defect distribution, the electroluminescence properties, and the external quantum efficiency. Increasing the relative thickness of In in the InGaN/GaN superlattice and the total superlattice thickness correlate with a reduction of active region defects and increased external quantum efficiencies. The highest measured on-chip EQE was 0.15% and based on Monte-Carlo ray tracing simulations for light extraction we project this would correspond to a flip-chip EQE of ~2.5%.

In this study, III-nitride red micro-light-emitting diodes (µLEDs) with ultralow forward voltage are demonstrated on a strain relaxed template. The forward voltage ranges between 2.00 V and 2.05 V at 20 A/cm2 for device dimensions from 5 × 5 to 100 × 100 µm2. The µLEDs emit at 692 nm at 5 A/cm2 and 637 nm at 100 A/cm2, corresponding to a blueshift of 55 nm due to the screening of the internal electric field in the quantum wells. The maximum external quantum efficiency and wall-plug efficiency of µLEDs are 0.31% and 0.21%, respectively. This suggests that efficient III-nitride red µLEDs can be realized with further material optimizations.

The role of water (H2O) vapor in reducing background impurity concentration in epitaxial Ga2O3 thin films grown by metalorganic chemical vapor deposition (MOCVD) was studied. Adding H2O vapor to oxygen was found to increase the surface roughness and decrease the carrier concentration but have no effect on the structural quality and RT electron mobility of both the UID and doped films. The H2O vapor promotes the growth of the stable (110) and 1¯10 facets elongated along the [001] direction. Using [H2O] of 250 ppm, the β-Ga2O3 films showed a RMS roughness of >13 nm, which is much higher than that measured for similar films grown without H2O (RMS = 0.8 nm). The electron mobility of the UID Ga2O3 layers grown with and without water vapor was ∼150 cm2/V s, while the carrier concentration dropped by ∼2.5× after increasing the [H2O] to 6000 ppm. Similarly, for the lightly Si doped films, the RT carrier concentration dropped from 5.4 × 1015 cm−3 ([H2O] = 0 ppm) to 3.4 × 1015 cm−3 ([H2O] = 250 ppm), leaving the mobility unaffected. The results offer a new method of using water vapor assisted growth of Ga2O3 films with low RT carrier concentration that are required for the realization of high-performance electronic power devices with high breakdown voltages.

In this work, the growth of (010), (001), and 2¯01 β-Ga2O3 by plasma assisted molecular beam epitaxy was investigated. The presence of an indium flux during growth markedly expands the growth regime for β-Ga2O3 across all orientations to higher growth temperatures and growth rates. This metal oxide catalyzed growth allows for similar growth rates of around 5 nm/min across all three orientations, more than twice that of conventional (010) growth and seven times that of (001) growth without indium. Smooth surface morphologies for (010) and (001) β-Ga2O3 were demonstrated, while 2¯01 was significantly rougher. Additionally, doping with Sn was achieved across all orientations and Hall measurements demonstrated higher electron mobility (55 cm2/Vs for a carrier concentration of 3.3 × 1018 cm−3) for (001) β-Ga2O3 grown via metal oxide catalyzed epitaxy than conventional growth.

We report on record low free carrier concentration values in metalorganic chemical vapor deposition (MOCVD) grown β-Ga2O3 by using N2O for oxidation. Contrary to the pure oxygen, the N2O oxidant produced β-Ga2O3 thin films co-doped with nitrogen and hydrogen, but the incorporation efficiency of both impurities is strongly dependent on key MOCVD growth parameters. An array of growth conditions resulted in β-Ga2O3 thin films with N and H concentrations ranging as high as ∼2 × 1019 cm−3 and ∼7 × 1018 cm−3, respectively, to films with no SIMS detectable N and H was identified. Films grown without detectable N and H concentrations showed a room temperature electron mobility of 153 cm2/V s with the corresponding free carrier concentration of 2.4 × 1014 cm−3. This is the lowest room temperature carrier concentration reported for MOCVD grown β-Ga2O3 with excellent electron mobility. A thin β-Ga2O3 buffer layer grown using N2O reduced the net background concentration in an oxygen grown film and is attributed to the compensation of Si at the film/substrate interface by N, which acts as a deep acceptor. The results show that the use of the N2O oxidant can lead to low background concentration and high electron mobility, which paves the road for the demonstration of high-performance power electronic devices with high breakdown voltages and low on-resistances.

InGaN-based red micro-size light-emitting diodes (μLEDs) have become very attractive. Compared to common AlInGaP-based red µLEDs, the external quantum efficiency (EQE) of InGaN red µLEDs has less influence from the size effect. Moreover, the InGaN red µLEDs exhibit a much more robust device performance even operating at a high temperature of up to 400 K. We review the progress of InGaN red μLEDs. Novel growth methods to relax the strain and increase the growth temperature of InGaN red quantum wells are discussed.

Highly conductive silicon-doped AlGaN and ohmic contacts are needed for deep-UV LEDs and ultrawide bandgap electronics. We demonstrate improved n-Al0.65Ga0.35N films grown by metal–organic chemical vapor deposition (MOCVD) on sapphire substrates using a low V/III ratio (V/III = 10). A reduced V/III ratio improves repeatability and uniformity by allowing a wider range of silicon precursor flow conditions. AlxGa1−xN:Si with x > 0.5 typically has an electron concentration vs. silicon concentration trend that peaks at a particular “knee” value before dropping sharply as [Si] continues to increase (self-compensation). The Al0.65Ga0.35N:Si grown under the lowest V/III conditions in this study does not show the typical knee behavior, and instead, it has a flat electron concentration trend for [Si] > 3 × 1019 cm−3. Resistivities as low as 4 mΩ-cm were achieved, with corresponding electron mobility of 40 cm2/Vs. AFM and TEM confirm that surface morphology and dislocation density are not degraded by these growth conditions. Furthermore, we report vanadium-based ohmic contacts with a resistivity of 7 × 10−5 Ω-cm2 to AlGaN films grown using a low V/III ratio. Lastly, we use these highly conductive silicon-doped layers to demonstrate a 284 nm UV LED with an operating voltage of 7.99 V at 20 A/cm2, with peak EQE and WPE of 3.5% and 2.7%, respectively.

The impact of high energy neutron irradiation on the creation of specific radiation-induced deep level defect states and the ensuing influence of these defects on the electronic properties of (010) β-Ga2O3, doped with Ge and grown by plasma-assisted molecular beam epitaxy, were explored. A significant amount of carrier removal was observed in the irradiated samples exposed to 1 MeV equivalent neutron fluences of 8.5 × 1014 cm−2 and 1.7 × 1015 cm−2, which suggests the formation of compensating defects by neutron irradiation. Using a combination of deep level transient/optical spectroscopy (DLTS/DLOS) techniques to probe the entire ∼4.8 eV bandgap with high energy resolution, three specific trap states were introduced by neutron irradiation at EC-1.22 eV, EC-2.00 eV, and EC-0.78 eV. Of these, the former two states, observed by DLOS, were also present prior to irradiation, whereas the trap at EC-0.78 eV, observed by DLTS, was not evident prior to neutron irradiation. The radiation dependence suggests that intrinsic point defects are the likely physical sources for these states. Subsequent lighted capacitance-voltage measurements further revealed that these three states are the source for the observed strong carrier compensation, with the trap at EC-2.00 eV appearing as the strongest compensating defect for the neutron-irradiated β-Ga2O3.

We report on record electron mobility values measured in lightly Si doped homoepitaxial β-Ga2O3 grown by metal-organic chemical vapor deposition. The transport properties of the films were studied using temperature-dependent Hall measurements. Numerous (010) β-Ga2O3 layers grown at different conditions showed peak electron mobility exceeding 104 cm2/V s at low temperature (LT), with the highest value of 11 704 cm2/V s at 46 K. The room temperature electron mobilities of the films were between 125 cm2/V s and 160 cm2/V s with the net background charge concentration between ∼5 × 1015 cm−3 and ∼2 × 1016 cm−3. The obtained LT mobility values for β-Ga2O3 were found to be comparable to or higher than the highest LT electron mobilities in bulk SiC and GaN films in the literature. The results demonstrate the capability of metalorganic chemical vapor deposition (MOCVD) for growing high quality ultrapure β-Ga2O3 epitaxial films that are suitable for high power electronic device applications.

In this work, we report record electron mobility values in unintentionally doped β-Ga2O3 films grown by metal-organic chemical vapor deposition. Using degenerately Sn-doped regrown n+ β-Ga2O3 contact layers, we were able to maintain Ohmic contact to the β-Ga2O3 films down to 40 K, allowing for reliable temperature-dependent Hall measurement. An electron mobility of 176 cm2/V s and 3481 cm2/V s were measured at room temperature and 54 K, respectively. The room and low temperature mobilities are both among the highest reported values in a bulk β-Ga2O3 film. A low net background charge concentration of 7.4 × 1015 cm−3 was confirmed by both temperature dependent Hall measurement and capacitance-voltage measurement. The feasibility of achieving low background impurity concentration and high electron mobility paves the road for the demonstration of high performance power electronics with high breakdown voltages and low on-resistances.

The interband absorption of the transparent conducting semiconductor rutile stannic oxide (SnO2) is investigated as a function of increasing free electron concentration. The anisotropic dielectric functions of SnO2:Sb are determined by spectroscopic ellipsometry. The onsets of strong interband absorption found at different positions shift to higher photon energies with increasing free carrier concentration. For the electric field vector parallel to the optic axis, a low energy shoulder increases in prominence with increasing free electron concentration. We analyze the influence of different many-body effects and can model the behavior by taking into account bandgap renormalization and the Burstein-Moss effect. The latter consists of contributions from the conduction and the valence bands which can be distinguished because the nonparabolic conduction band dispersion of SnO2 is known already with high accuracy. The possible originsof the shoulder are discussed. The most likely mechanism is identified to be interband transitions at |k| > 0 from a dipole forbidden valence band.

We report on a high performance Pt/n−Ga2O3/n+Ga2O3 solar blind Schottky photodiode that has been grown by metalorganic chemical vapor deposition. The active area of the photodiode was fabricated using ∼30 Å thick semi-transparent Pt that has up to 90% transparency to UV radiation with wavelengths < 260 nm. The fabricated photodiode exhibited Schottky characteristics with a turn-on voltage of ∼1 V and a rectification ratio of ∼108 at ±2 V and showed deep UV solar blind detection at 0 V. The Schottky photodiode exhibited good device characteristics such as an ideality factor of 1.23 and a breakdown voltage of ∼110 V. The spectral response showed a maximum absolute responsivity of 0.16 A/W at 222 nm at zero bias corresponding to an external quantum efficiency of ∼87.5%. The cutoff wavelength and the out of band rejection ratio of the devices were ∼260 nm and ∼104, respectively, showing a true solar blind operation with an excellent selectivity. The time response is in the millisecond range and has no long-time decay component which is common in photoconductive wide bandgap devices.