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Realizing a state of matter in two dimensions has repeatedly proven a novel route of discovering new physical phenomena. Van der Waals (vdW) materials have been at the center of these now extensive research activities. They offer a natural way of producing a monolayer of matter simply by mechanical exfoliation. This work demonstrates that the possible multiferroic state with coexisting antiferromagnetic and ferroelectric orders possibly persists down to the bilayer flake of NiI$_{2}$. By exploiting the optical second-harmonic generation technique, both magnitude and direction of the ferroelectric order, arising from the cycloidal spin order, are successfully traced. The possible multiferroic state's transition temperature decreases from 58 K for the bulk to about 20 K for the bilayer. Our observation will spur extensive efforts to demonstrate multi-functionality in vdW materials, which have been tried mostly by using heterostructures of singly ferroic ones until now.

Terahertz spectroscopy can be utilized as an effective nondestructive identification tool for the study of artist’s pigments. Consequently, extensive measurements have been conducted on representative pigment species, and a few terahertz spectral databases have been constructed. However, the reported spectra were often acquired from pigment samples mixed with polyethylene at room temperature with low resolution, which often led to low-quality spectra with unresolved overlapping lines further broadened due to thermal effects. Here, we present our study of vermilion (HgS, mercury sulfide) as an illustration of how we can overcome such difficulties by studying free-standing oil-paint samples at room temperature and then by performing low-temperature measurements on polyethylene-mixed samples to minimize line broadening due to thermal effects. Our results identify clearly resolved absorption peaks due to lattice vibrations of vermilion at 40.4, 44.5, and 89.9 cm–1 at 2 K. The temperature dependence of the peak shift and line broadening reveals anharmonic characteristics of these lattice vibrational modes. Our approach will definitely suggest new ways to improve and enhance existing terahertz spectral databases of ancient and modern pigments toward actual analysis, diagnosis, and conservation of heritage artworks.

Scaling down of semiconductor devices requires high- k dielectric materials to continue lowering the operating voltage of field-effect transistors (FETs) and storing sufficient charge on a smaller area. Here, we investigate the dielectric properties of epitaxial BaHf 0.6 Ti 0.4 O 3 (BHTO), an alloy of perovskite oxide barium hafnate (BaHfO 3 ) and barium titanate (BaTiO 3 ). We found the dielectric constant, the breakdown field, and the leakage current to be 150, 5.0 megavolts per centimeter (MV cm −1 ), and 10 −4 amperes per square centimeter at 2 MV cm −1 , respectively. The results suggest that two-dimensional (2D) carrier density of more than n 2D = 10 14 per square centimeter (cm −2 ) could be modulated by the BHTO gate oxide. We demonstrate an n-type accumulation mode FET and direct suppression of more than n 2D = 10 14 cm −2 via an n-type depletion-mode FET. We attribute the large dielectric constant, high breakdown field, and low leakage current of BHTO to the nanometer scale stoichiometric modulation of hafnium and titanium.

Scaling down of semiconductor devices requires high

As demanding for high performance and miniaturization of electronic devices, interconnection materials required higher reliability in mechanical, thermal and electrical. The importance of electromigration issue has increased because of these trends. We evaluated the electromigration behavior of Sn58Bi solder and Sn58Bi epoxy solder under high temperature and constant current flow. The electromigration test-kit was a designed and fabricated flip chip-type module and the diameter of the solder bump was 250 μm. A current was passed through the two solder joints, producing a current density of 3.0 × 103 A/cm2 at 100 °C. The microstructure of solder joint after electromigration test were investigated with field-emission scanning electron microscopy during electromigration, a Bi-rich layer was observed at the anode side of the solder joint and the formation of Kirkendall voids was observed at the cathode side of the solder joints. Different inorganic materials affect electromigration in the eutectic Sn58Bi solder joints.

AA6061-T4 composites containing SiC and B4C particles were fabricated by friction stir processing (FSP) with an SKD11 tool. The microstructures and mechanical properties of the composites were investigated with various test methods. With the inclusion of ceramic particles, refined grains in the stir zone (SZ) were observed using a scanning electron microscope (SEM) and tunneling electron microscope (TEM). Because the ceramic particles facilitated grain refinement in the SZ via the pinning effect, the SZ with the particles had a much smaller grain size than the SZ without the particles. Vickers hardness test, tensile test and Charpy impact test were conducted to evaluate the mechanical properties. Mechanical properties of the SZ with the ceramic particles were improved relative to those of the SZ without the particles. Vickers hardness (from 50 to 90 HV), tensile strength (from 117 to 253 MPa) and Charpy impact absorbed energy (from 4.2 to 5.6 J) of the SZ increased with the addition of ceramic particles.

Cu nanopaste is a candidate to replace Ag nanopaste, but the oxidation problems associated with Cu nanopaste must be overcome. In this study, we fabricated Cu nanopaste with various contents of sodium dodecylbenzene sulfonate (SDBS), and the oxidation behaviors of Cu nanopaste with various contents of SDBS were investigated. Then, Cu nanopastes were printed using a screen-printing machine and sintered with infrared energy. The fabricated circuits were evaluated using high-temperature storage tests and steady-state temperature humidity bias life testing. The printed Cu pattern with SDBS showed better oxidation-resistant properties than that without SDBS. After the reliability test, 2 wt% of SDBS shows less oxide based on X-ray diffraction, microstructure, and electrical resistivity measurements, and the optimized content of SDBS was 2 wt% in the Cu nanopaste.

Friction stir welding (FSW) is a novel solid-state welding technique. This process has many advantages, such as no consumable requirement, low distortion, low shrinkage, and excellent mechanical properties. Recently, FSW has been successfully used to fabricate metal matrix composites (MMCs), as the process overcomes environmental problems caused by other MMC fabrication processes. In previous studies, the goal was to reinforce the mechanical properties of base materials. In this study, the FSW technique and Ag-decorated carbon nanotubes (Ag-CNTs) were used to enhance the thermal properties of copper, and the microstructures of joints of Ag-CNT-reinforced copper fabricated by FSW were evaluated. The microstructures were analyzed using an optical microscope, and the presence of Ag-CNT in the joint was observed using a scanning electron microscope. Additionally, we confirmed the distribution of Ag-CNTs by electron probe microanalyzer, and the thermal properties of joints were evaluated by laser flash analysis. The Ag-CNT-reinforced Cu composites fabricated by FSW have improved thermal properties compared with conventional copper MMCs.

Matter-light interaction is at the center of diverse research fields from quantum optics to condensed matter physics, opening new fields like laser physics. A magnetic exciton is one such rare example found in magnetic insulators. However, it is relatively rare to observe that external variables control matter-light interaction. Here, it is reported that the broken inversion symmetry of multiferroicity can act as an external knob enabling magnetic excitons in the van der Waals antiferromagnet NiI

Electronic packaging has been miniaturized for high density and performance. Therefore, the formation of reliable interconnections has become an important issue. However, the conventional reflow process depends on a high process temperature and long process time. Those process limitations of the reflow process cause problems with advanced package structures, such as chip delamination and warpage problems in soldering interconnections. Laser-assisted bonding (LAB) has been highlighted as an advanced soldering interconnection process because of an ultrafast bonding process and thermal selectivity. However, the use of a laser homogenizer is necessary to improve laser irradiation area accuracy and it reduces price competitiveness. To overcome the problems of the reflow and the LAB processes, the intense pulsed light (IPL) soldering process has been considered as the next-generation answer for soldering interconnections. The IPL soldering process could reduce thermal damage to polymer components with its extremely short bonding time, thus it could be a solution to the warpage problem. Furthermore, the grain size of solder alloys could be controlled, depending on IPL conditions. In addition, IPL could irradiate in a desired wavelength range using a filter because IPL includes light in a wide wavelength range from ultraviolet to infrared radiation. We investigated the microstructure evolutions and mechanical properties of the IPL soldering process using Sn-3.0Ag-0.5Cu (SAC305) solder. Test-kits for evaluating mechanical properties were designed according to the JEDEC-B117A standard. A copper (Cu) electrode was used with two kinds of surface finish, organic solderability preservative and electroless nickel electroless palladium immersion gold. The IPL soldering process was conducted using different pulse widths (2, 2.25, and 2.5 ms). Other IPL conditions were fixed, such as pulse frequency (3 Hz), pulse number (10), and pulse power (4 kW). The Reflow process was conducted at a peak temperature of 270°C for 5 min. After the soldering process, a high-temperature storage test was performed at 150°C to evaluate the mechanical reliability of the solder ball. The IPL soldering process generated a thinner and flatter-shaped intermetallic compounds layer than the reflow process at the interface between the solder and the Cu electrode. Moreover, small grain size and microstructure region aligned in the same orientation were shown in the solder alloy that was fabricated using the IPL soldering process. Shear strengths of IPL soldering are 6%-11% higher than the reflow process in all high-temperature storage test conditions. The novel soldering process using an IPL energy source is suggested as a solution to the warpage problem and to improve mechanical properties.

Nickel-decorated multi-walled carbon nanotubes (Ni-MWCNTs) were synthesized using a colloidal method and an electroless plating method to form Ni nanoparticles on the surface of MWCNTs. The Ni electroless plating process was optimized with solutions at various pH (5, 6, 7, and 8) levels. The Ni-MWCNTs fabricated at pH 7 show the most stable Ni nanoparticles on the surface of the MWNCTs. After optimization of the Ni plating process, the Ni-MWCNTs/Sn-58Bi composite solder were fabricated with varying contents of (0, 0.05, 0.1 and 0.2 wt%) Ni-MWCNTs. The experimental results show that Ni-MWCNTs enhance the mechanical properties of Sn-58Bi solder. The shear strength of Sn-58Bi solder improves by about 14% with 0.1 wt% Ni-MWCNTs. Furthermore, the microstructure evolution after a high temperature storage test shows that Ni-MWCNTs have an effect on grain refining and interrupt growth of the Intermetallic compound layer. The distribution of Ni-MWCNTs could be recognized with the results of EPMA.

The mechanical reliability of Sn–MWCNT composite solder containing various content of Sn-decorated MWCNTs (0, 0.05, 0.1, and 0.2 wt%) and Sn–58Bi solder were investigated. The Sn-decorated MWCNTs nanoparticles were used to improve the mechanical reliability of Sn–58Bi solder, which is a representative, low-temperature, lead-free solder. The Sn-decorated MWCNT nanoparticles were synthesized using the polyol method, and the Sn–MWCNT composite solder paste was fabricated by mechanical mixing. The shear and bending tests were conducted to evaluate the mechanical properties of the solder joints. We identified the microstructure of solder to investigate the intermetallic compound and failure mechanism of Sn–MWCNT composite solder. Furthermore, a high-temperature storage test at 100 °C for 1000 h was performed to determine long-term reliability. The shear strength and fracture energy increased about 21% and 23%, respectively, with 0.1 wt% Sn-decorated MWCNTs. In addition, the bending reliability of Sn–58Bi solder increased approximately 25%.

We investigated the effect of Ag-coated multi-walled carbon nanotubes (Ag-MWCNT) on the microstructures and electromigration behaviors of a Sn58%Bi solder and organic solderability preservative (OSP) surface finished on the FR-4 printed circuit board (PCB) joint under a current stress of 3000 A/cm2 at 100 °C. Electromigration of Ag-MWCNT Sn58%Bi composite solder was investigated by daisy-chain test-kit. Reaction layers formed at the anode side and cathode side of the Sn58%Bi solder joints consisted of three microstructures; Bi-rich layer, Sn-rich layer, and intermetallic compounds (IMCs, Cu6Sn5 and Cu3Sn). The Bi-rich layer was mainly formed at the anode side in the couple of the Sn58%Bi solder joint with various times of applying current stress. The Bi-rich layer of the Ag-MWCNT Sn58%Bi composite solder joint was approximately 2 times thinner than that of the Sn58%Bi solder joint because the Ag-MWCNT acts as a diffusion barrier. Also, the Cu6Sn5 and Cu3Sn IMCs that formed at the interface between the Ag-MWCNT Sn58%Bi composite solder joints were thinner than those of the Sn58%Bi solder joints. The time to failure (TTF) was longest at the 0.05% Ag-MWCNT Sn58%Bi composite solder joint. Therefore, Ag MWCNT is expected to improve the reliability of electromigration in the Sn58%Bi composite solder joint.

Transient liquid phase sintering (TLPS) bonding has been widely researched for high temperature interconnection. At TLPS bonding, intermetallic compounds (IMCs) form by solid-liquid interdiffusion between molten low–melting point (MP) metals and high–MP metal particles. This IMC formation reaction occurs simultaneously across the whole joint. Therefore, the growth rate of IMCs is higher than conventional TLP bonding, and the bonding process can be performed in low pressure condition for short time.We investigated hybrid TLPS paste using SAC305 with various size of Ag particles (0.5 – 10 μm in diameter) for pressureless bonding. Hybrid TLPS paste was fabricated using SAC305 powder, hybrid Ag particles, and organic solvent by paste mixer. Then, the pastes (hybrid TLPS paste, SAC305) were printed on Cu substrate, and Cu chip was placed onto printed pastes. Pressureless bonding process was carried out at 300℃ for 2 h in air. In cross–sectional micrograph of hybrid TLPS joint, Sn was almost replaced by IMCs, while Sn residue remained after the bonding at SAC305 joint. The mechanical property of joint was evaluated by die shear test. Shear strength of hybrid TLPS joint was 2.5 times higher than that of SAC305. The high–temperature storage test (200 °C) and salt spray test (5 % NaCl at 35 °C) were performed to evaluate the bonding reliability under harsh environment. In both tests, hybrid TLPS joint showed more mechanically and electrochemically robust properties than conventional SAC305 joint.

A novel approach to copper-nickel bonding was investigated by hybrid transient liquid phase sintering (TLPS) method. Hybrid bonding material containing copper, nickel, and Sn-3.0Ag-0.5Cu (SAC305) and an organic solvent was fabricated to form a fast and stable ternary Cu Ni Sn intermetallic compound (IMC) joint between Cu to Ni joint. The atomic distribution was analyzed by an electron probe micro-analyzer, showing full IMC formation of the hybrid TLPS joint. In addition, by simultaneously adding Cu and Ni to SAC305, the IMC was stably formed, and the bonding strength of hybrid TLPS joint was the highest.

The microstructural features and mechanical properties of a B 4 C particle-reinforced Cu matrix composite prepared by friction stir welding (FSW) were investigated. For this purpose, the FSW process was carried out along a 0.6-mm-width gap, between two Cu plates, filled with boron carbide (B 4 C) particles. Microstructural observations taken in the stir zone (SZ) revealed that the presence of B 4 C particles led to the evolution of fine grains (∼2 μm). Based on the hardness measurements of the FSW-fabricated samples, the hardness values were significantly improved after the B 4 C particles were incorporated.

Carbon fiber reinforced plastic (CFRP) is increasingly considered for various industrial applications. CFRP has been applied to the automotive industry to increase fuel efficiency due to its excellent strength and lightweight. Therefore, the demand for dissimilar material joining techniques is gradually increasing. In this study, we investigated the intense pulsed light (IPL) as surface treatment for CFRP. The IPL surface treatment requires a very short processing time and can be easily automated compared with other processes such as chemical and mechanical treatments. The change in morphology and chemical composition of the CFRP-treated surfaces was analyzed using scanning electron microscopy, profiler, and X-ray photoelectron spectroscopy. The bonding strength due to varying IPL exposure time was evaluated by the lap shear test. The apparent shear strength increased by up to 159% in this study. The IPL treatment is very simple and requires short processing time to produce enhanced adhesive joints.

We have developed a new nanofilter using a carbon nanotube-silver composite material that is capable of efficiently removing waterborne viruses and bacteria. The nanofilter was subjected to plasma surface treatment to enhance its flow rate, which was improved by approximately 62%. Nanoscale pores were obtained by fabricating a carbon nanotube network and using nanoparticle fixation technology for the removal of viruses. The pore size of the nanofilter was approximately 38 nm and the measured flow rate ranged from 21.0 to 97.2L/(min·m(2)) under a pressure of 1-6 kgf/cm(2) when the amount of loaded carbon nanotube-silver composite was 1.0 mg/cm(2). The nanofilter was tested against Polio-, Noro-, and Coxsackie viruses using a sensitive real-time polymerase chain reaction assay to detect the presence of viral particles within the outflow. No trace of viruses was found to flow through the nanofilter with carbon nanotube-silver composite loaded above 0.8 mg/cm(2). Moreover, the surface of the filter has antibacterial properties to prevent bacterial clogging due to the presence of 20-nm silver nanoparticles, which were synthesized on the carbon nanotube surface.

A carbon nanotube (CNT) has remarkable properties, but it has disadvantages in application because of its dispersal- and bonding-related issues. Metal–CNT composite materials are necessary in solving these problems. In this study, nickel (Ni)–multi-walled CNTs (Ni–MWCNTs) are synthesized through sequential processing, functionalizing, and electroless plating processes to deposit Ni nanoparticles on MWCNTs. The synthesized Ni–MWCNTs are used to fabricate composite solders with various contents (0, 0.05, 0.1, and 0.2 wt%). The test kit used for the 3-point bending test in this study is designed with a differential package structure to evaluate the bending reliabilities of the Ni–MWCNT composite materials with various contents. The crack initiation and propagation in the microstructure evolution solder joints are also investigated. The bending reliabilities improve with the BGA structure and indicate that the highest bending cycle fails with 0.1 wt% of Ni–MWCNTs. The chemical composition and distribution of the Ni–MWCNTs in the solder joints are investigated with electron probe microanalysis.

A Cu-cored solder ball (CCSB) is often used as the interconnection material for 3D package. The CCSB has a Cu core surrounded by Sn-Ag-Cu alloy. The effect of the Cu core on mechanical reliability of the CCSB was investigated using thermal shock test. Microstructure and thermal shock reliability of the CCSB with organic solderability preservative (OSP) surface finish was compared with that of Sn-3.0wt.%Ag-0.5wt.%Cu (SAC) solder. The thermal shock test was performed in the temperature range of −40 °C to 125 °C in compliance with JESD22-A104. Failure mechanism was analyzed by finite element method analysis. Average number of thermal shock cycles for the CCSB/OSP joints was 1.15 times higher than that for SAC/OSP joints. Maximum value of simulated plastic strain for the SAC/OSP joints was 1.25 times higher than that for the CCSB/OSP joints because the stand-off height of the CCSB/OSP joints could be maintained by the Cu core.

Transient liquid phase (TLP) bonding has attracted much attention as a high-temperature interconnection method. TLP is a bonding method that converts entire joints into heat endurable intermetallic compounds (IMCs) by solid–liquid interdiffusion between high-melting-point (high-MP) parent metals and low-MP bonding metals. However, conventional TLP bonding requires high bonding pressure and long process time because IMC reactions occur only at the interfaces between the high-MP parent metals and the low-MP bonding metals. We fabricated TLP paste using SAC305 with 10 wt% Ag particles to induce IMC reactions to take place across an entire joint simultaneously. A TLP bonding process was performed at 300 °C for 2 h in air without added pressure. SAC residue was found in the SAC305 joint, while the whole SAC305–10 wt% Ag joint was converted into Cu–Sn and Ag–Sn IMCs. The SAC305–10 wt% Ag joint also demonstrated 2.5 times higher maximum shear strength compared with the SAC305 joint. In addition, the bonding reliability was evaluated by high-temperature storage test at 200 °C for 1000 h. The SAC305–10 wt% Ag joint maintained its bonding strength, while the SAC305 joint mechanically deteriorated.

Background and Purpose Advantages of new oral anticoagulations may be greater in atrial fibrillation (AF) patients of poor anticoagulation control with warfarin. The SAMe-TT2R2 scoring system, based on clinical variables, was recently developed to aid in identifying these patients. In this study, we investigated the association of this clinical composite score with genetic factors related warfarin dosing and the quality of anticoagulation control. Methods Clinical and genetic data were collected from 380 consecutive Korean patients with AF (CHA2DS2-VASc score, 3.5±1.8) who were followed for an average of 4 years. We evaluated factors associated with time in therapeutic range (TTR, INR 2-3), including the CYP2C9 and VKORC1 genotypes and the SAMe-TT2R2 score (Sex female, Age two co-morbidities], Treatment [interacting drugs, e.g., amiodarone], Tobacco use within 2 years [doubled], and Race non-white [doubled]). Results The average SAMe-TT2R2 score was 3.4±0.9, range 2-7; and 153 patients (40.2%) had SAMe-TT2R2 scores ≥4. Time in specific INR ranges varied depending on the VKORC1 genotype but not with the CYP2C9 genotype or the SAMe-TT2R2 score. TTR was higher in patients with the VKORC1 1173C>T than in VKORC1 TT (61.7±16% vs. 56.7±17.4%, P=0.031). Multivariate testing showed that VKORC1 genotype but not the SAMe-TT2R2 score was significantly associated with labile INRs. There was no correlation between the SAMe-TT2R2 scores and pharmacogenetic data. Conclusions A genetic factor, but none of the common clinical and demographic factors, as combined in the SAMe-TT2R2 score, was associated with the quality of anticoagulation control in Korean patients with AF.

The SPHC/MgO composites were fabricated by friction stir welding (FSW) and then the mechanical property of the composites was investigated. MgO particles were flocculated on the advancing side in the stir zone (SZ) formed by one-pass processing. On the other hand, MgO particles were more homogenously distributed in the SZ formed by two-pass processing. Compared to the SZ without MgO particles, the hardness profile of the SZ with MgO particles was increased to 20–30 Hv due to refined grain by pinning effect. Grain growth in the SZ without MgO particles was observed at elevated temperature. On the other hand, the fine grain produced with MgO particles was maintained at elevated temperature (∼900℃) due to pinning effect by MgO particles.

This study focuses on the microstructural evolution and failure behavior induced by electromigration in a eutectic Sn–58Bi solder joint. In order to study their effects, surface finishes were prepared with OSP, ENIG, and ENEPIG. The test sample was a flip chip-type reaction module, and the diameter and height of the solder bump were 180 and 100 μm, respectively. A current was passed through the two solder joints, producing a current density of 1.3 × 10 4 A/cm 2 at 100 °C. The time to fail test were carried out sequentially using a test kit under a current density of 1.3 × 10 4 A/cm 2 at 100 °C. The Bi-rich layer was observed at the anode side of the solder joint during the electro migration test. The IMC growth at the interface of the solder joints with current applied was faster than with no-current applied because of a polarity effect. The different surface finished materials affected the behavior of electromigration in the eutectic Sn–58Bi solder joints with current stress. The time to fail (TTF) differed greatly with the surface finishes.

The catalytic oxidation of volatile organic compounds such as benzene, toluene, ethylbenzene, and o-xylene (BTEX) over novel Pt/carbon nanotube (CNT) catalysts fabricated by a molecular-level mixing method was investigated at temperatures ranging from 40 to 150 °C. The Pt/CNT interface was probed by scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and energy dispersive X-ray spectroscopy (EDS) to elucidate the binding nature of the Pt nanoparticle-CNT surface. The breakthrough curves for multi-component mixtures show displacement effects, in which adsorbates exhibit interaction forces that are sufficiently to displace weakly bounded substances during adsorption. Catalytic oxidation was conducted using a BTEX concentration ranging from 100 to 500 ppmv in air at volume hour space velocities (VHSVs) of approximately 7.5 × 104 h−1–3.4 × 105 h−1. The light-off curves were very steep, and complete oxidation was realized at temperatures as low as 115 °C with 30 wt% Pt/CNT, well below the temperatures required using previously studied Pt-based catalysts. The oxidation activity was presumably promoted because of the higher surface BTEX concentration afforded by the adsorption capability of multiwalled carbon nanotubes. The catalyst was characterized by its unique hydrophobic property, which facilitated the conversion of BTEX with high activity at relatively low temperatures and was unaffected by moisture in the system.

Department of Internal Medicine, Hanyang University College of Medicine, Seoul, Korea Here we report a 65-year-old male patient initially presented with dyspnea and chest discomfort. This patient was finally diagnosed with severe hypothyroidism accompanied by heart failure, pericardial effusion and acute renal failure. We suspected that heart failure, pericardial effusion and acute kidney injury were induced by severe hypothyroidism. Thus, we began thyroid hormone replacement therapy. After the therapy, the patient’s dyspnea and chest discomfort were improved. Hypothyroidism has many complications, such as myxedema, dyslipidemia, and depression. In contrast, heart failure, pericardial effusion, and acute kidney injury are very rare complications of hypothyroidism. Only a few cases of heart failure or renal failure combined with hypothyroidism have been reported. Our case suggests that severe hypothyroidism can lead to multiorgan failure, such as heart failure as well as renal failure. Moreover, congestive heart failure induced by severe hypothyroidism can be reversed by thyroid hormone replacement therapy.

The operation of a 100-MeV linear proton accelerator, the major driving values and experimental data need to be archived. According to the experimental conditions, different data are required. Functions that can add new data and delete data in real time need to be implemented. In an experimental physics and industrial control system (EPICS) input output controller (IOC), the value of process variables (PVs) are matched with the driving values and data. The PV values are archived in text file format by using the channel archiver. There is no need to create a database (DB) server, just a need for large hard disk. Through the web, the archived data can be loaded, and new PV values can be archived without stopping the archive engine. The details of the implementation of a data archiving system with channel archiver are presented, and some preliminary results are reported.

The tumor embolism is defined as tumor cells within the vascular system such as pulmonary artery that is not contiguous with the other metastatic foci. The incidence of tumor embolism varies widely ranging from 3% to 26% among seve ral studies; whereas lung cancer, prostate cancer, colorectal cancer, breast cancer, pancreas cancer are associated with high risks for tumor embolism. However thyroid cancer is rarely associated with tumor embolism. Among the rare cases, tumor embolism was reported as being mostly of follicular carcinoma or undifferentiated carcinoma, but few of papillary carcinoma. We report an unusual presentation that pulmonary tumor embolism from thyroid papillary carcinoma was diagnosed with positron emission tomography/computed tomography (CT) and chest CT.

Mycobacterium avium complex (MAC) is the most common pathogen in nontuberculous mycobacterial lung diseases, but vertebral osteomyelitis caused by MAC is rare. We experienced a case of vertebral osteomyelitis with epidural abscess in a rheumatoid arthritis patient who received immunosuppressive agents. Initial assessment was tuberculous vertebral osteomyelitis, and then treated with antituberculous drugs. Fifty-six days later, Mycobacterium intracellulare was identified from abscess culture and drugs were altered to clarithromycin, rifabutin, and ethambutol. After 3 months of M. intracellulare treatment, the radiological findings showed increases of epidural abscess. According to the suseptibility, the patient received intravenous amikacin for four weeks, and then, oral ciprofloxacin in addition to clarithromycin, rifabutin, and ethambutol. The patient is being treated with the medication for 13 months and currently showing slow improvements.

Background Warfarin has a narrow therapeutic window. We hypothesized that genetic factors related to warfarin metabolism ( CYP2C9 ) and activity ( VKORC1 ) would show stronger associations than modifiable factors with the quality of anticoagulation control and risks for thromboembolism and hemorrhage. Methods In this retrospective cohort analysis, clinical and genetic data were collected from 380 patients with atrial fibrillation (AF) who were followed for an average observation period of 4 years. We evaluated the factors associated with time in therapeutic range (TTR, international normalized ratio [INR]: 2-3) and vascular events (either thromboembolic or hemorrhagic), including both genetic ( CYP2C9 and VKORC1 genotype) and modifiable factors (anticoagulation service and warfarin dose assessment interval). Results The genotypic frequency of CYP2C9*3 (rs1057910) was 9.5% and that of VKORC1 1173C>T (rs9934438) was 16.3%. TTR showed dependence on VKORC1 polymorphism: TTR was higher in carriers of the VKORC1 1173C>T than of the VKORC1 TT genotype (61.7 ± 16.0% versus 56.7 ± 17.4%, P = .031). Multivariate testing showed that the VKORC1 genotype and anticoagulation service were independently related to labile INRs (TTR 2 DS 2 -VASc score: Congestive heart failure, Hypertension, Age 75 years or older, Diabetes mellitus, previous Stroke or transient ischemic attack, Vascular disease, Age 65 to 74 years, female) and consequence (neurologic disability), but not genetic factors, were independently associated with vascular events. Conclusions Both genetic factor ( VKORC1 genotype) and clinical efforts (anticoagulation service) influenced the quality of anticoagulation control. However, clinical events were more strongly associated with patient characteristics and clinical efforts than with genetic factors.

The objective of this study is to investigate optimum reaction conditions for the grafting of poly(-vinyl- 2-pyrrolidone) (PVP) onto the surface of plasma-treated polypropylene film. The plasma treatment conditions were fixed as 200 W rf power, 6 LPM Ar flow rate, 30 sec treatment time, and 5 min exposure time after treatment. For graft copolymerization, we investigated the change of grafting degree with respect to reaction time, reaction temperature and -vinyl-2-pyrrolidone concentration. Maximum grafting degree was obtained at the conditions of 6 h reaction time, reaction temperature, and 40% -vinyl-2-pyrrolidone concentration. The introduction of PVP was confirmed by ATR-FTIR, XPS, and SEM analysis.

The surface of polyethylene (PE) was modified through Ar atmospheric pressure plasma treatment and subsequent grafting of glycidyl methacrylate (GMA). Optimum plasma treatment conditions were determined through analyzing the surface free energies calculated from the contact angles between PE samples and three probe liquids, which were RF-power of 200 W, plasma treatment time of 600 sec, Ar flow rate of 5 LPM, and sample-holder moving speed of 20 mm/sec. To introduce the maximum amount of GMA on PE surface treated under the conditions, graft copolymerization conditions such as GMA concentration, temperature, and time were carefully controlled. Grafting degree (GD) was obtained through weight difference analysis of PE film before and after graft copolymerization. A maximum GD was achieved at the GMA concentration of 20 vol%, the temperature of , and the treatment time of 4 hr.

The Internet is encountering a new turning point owing to the raising Web 2.0. A user Just receives the information and service provided by a service provider in the existing web 2.0, but a user can create a new service for himself using an application program and data provided in web 2.0. The digital content market is producing a new service according to Web 2.0. The specific service among them is User Created Contents(UCC) and it is leading to the participation and interesting of user SecondLife also which is the type as Social Network Service(SNS) and VR, is placing as a new service type. This paper defines Web 2.0 environment and classifies as UCC, SNS and Virtual Reality(VR) and defines a variety services shown in new environment. It also analyzes shortcomings and then prospect a new type of service which will be shown in the future.

The aim of this study is to explore the action of 5-HT1 receptor on spontaneous firing activity of the rat medial vestibular nuclear neurons by patch clamp experiments. The spontaneous firing was increased in 45.5% and decreased in 54.5% of the neurons tested with 5-carboxamidotryptamine, non-selective 5-HT1 receptor agonist. And the whole potassium currents of medial vestibular nuclear neurons was decreased in 64% and increased in 36% of cells tested with 5-carboxamidotryptamine. The spontaneous firing rate was increased by 8-OH-DPAT, selective 5-HT1A receptor agonist in 73.3% and was not changed in 26.7%. Whole potassium currents were decreased in 84.2% and was not affected in 15.8% by 8-OH-DPAT. These results suggest that 5-HTIA receptor of the medial vestibular nuclear neurons mediates excitatory effects whereas inhibitory effects are mediated by other 5-HT1 receptors.