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1. 3D sequential integration: applications and associated key enabling modules (design & technology)

2. 16kbit 1T1R OxRAM arrays embedded in 28nm FDSOI technology demonstrating low BER, high endurance, and compatibility with core logic transistors

3. Limits of a single active transistor-based amplifier designed for co-integrated M-NEMS/CMOS oscillator purposes

4. 2012 70th Annual Device Research Conference (DRC)

6. 2011 IEEE International Electron Devices Meeting (IEDM)

7. Photoreflectance spectroscopy for the study of GaAsSb/InP heterojunction bipolar transistors

8. Computer aided design and strata control

9. Affaissements miniers et exploitation partielle

10. The cerchar method of pressiometric testing

11. A Review of Low Temperature Process Modules Leading Up to the First (≤500 °C) Planar FDSOI CMOS Devices for 3-D Sequential Integration

12. OPEN PIT SLOPES BACK-ANALYSIS IN COMPLEX ROCK FORMATIONS (GARD COLLIERY, CdF, FRANCE)

13. Full-wafer fabrication by nanostencil lithography of micro/nanomechanical mass sensors monolithically integrated with CMOS.

14. Array of Resonant Electromechanical Nanosystems: A Technological Breakthrough for Uncooled Infrared Imaging.

15. VHF NEMS-CMOS piezoresistive resonators for advanced sensing applications.

17. Full-wafer fabrication by nanostencil lithography of micro/nanomechanical mass sensors monolithically integrated with CMOS.

18. Evaporation of femtoliter sessile droplets monitored with nanomechanical mass sensors.

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