60 results on '"Ikota, Masami"'
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2. Need for LWR metrology standardization: the imec roughness protocol
3. Metrology of thin resist for high NA EUVL
4. A method for quantifying the three-dimensional shape of circuit patterns with a top-down CD-SEM image
5. Regularized autoencoder for the analysis of multivariate metrology data
6. EB metrology of Ge channel gate-all-around FET: buckling evaluation and EB damage assessment
7. Regularized autoencoder for the analysis of multivariate metrology data
8. Metrology of thin resist for high NA EUVL
9. Electron beam metrology for advanced technology nodes
10. Visualization of 3D structure of semiconductor devices by "Dig and See" using GFIS-SIM
11. Linewidth and roughness measurement of SAOP by using FIB and Planer-TEM as reference metrology
12. Linewidth roughness of advanced semiconductor features using focused ion beam and planar-transmission electron microscope as reference metrology
13. Precise measurement of thin-film thickness in 3D-NAND device with CD-SEM
14. The need for LWR metrology standardization: the imec roughness protocol
15. Line-width roughness of advanced semiconductor features by using FIB and planar-TEM as reference metrology
16. Impact of annealing temperature on DSA process: toward faster assembly kinetics (Conference Presentation)
17. How to measure a-few-nanometer-small LER occurring in EUV lithography processed feature
18. Measurement of pattern roughness and local size variation using CD-SEM: current status
19. Contact inspection of Si nanowire with SEM voltage contrast
20. 3D-profile measurement of advanced semiconductor features by using FIB as reference metrology
21. Variability study with CD-SEM metrology for STT-MRAM: correlation analysis between physical dimensions and electrical property of the memory element
22. Enabling CD SEM metrology for 5nm technology node and beyond
23. A New Defect Distribution Metrology with a Consistent Discrete Exponential Formula and Its Applications
24. Advanced CD-SEM metrology for qualification of DSA patterns using coordinated line epitaxy (COOL) process
25. 3D-profile measurement of advanced semiconductor features by reference metrology
26. Process monitor of 3D-device features by using FIB and CD-SEM
27. Visualization of 3D structure of semiconductor devices by "Dig and See" using GFIS-SIM
28. Linewidth and roughness measurement of SAOP by using FIB and Planer-TEM as reference metrology
29. Line profile measurement of advanced-FinFET features by reference metrology
30. Measurement of pattern roughness and local size variation using CD-SEM: current status
31. Line-width roughness of advanced semiconductor features by using FIB and planar-TEM as reference metrology
32. Contact inspection of Si nanowire with SEM voltage contrast
33. The need for LWR metrology standardization: the imec roughness protocol
34. Variability study with CD-SEM metrology for STT-MRAM: correlation analysis between physical dimensions and electrical property of the memory element
35. 3D-profile measurement of advanced semiconductor features by using FIB as reference metrology
36. In-line e-beam inspection with optimized sampling and newly developed ADC
37. Regularized autoencoder for the analysis of multivariate metrology data.
38. 3D-profile measurement of advanced semiconductor features by reference metrology
39. New patterned wafer inspection system with the function to classify fatal defects
40. New particle-inspection system for CMP-planarization-processed metal layers
41. Recent Technology for Particle Detection on Patterned Wafers
42. Development of On-machine Printing System for Spatial Filter.
43. Partilcle Detection Technology on Wafer Using Spatial Filter.
44. Development of Particle Detection System using Subtracted Image Signal.
45. EB metrology of Ge channel gate-all-around FET: buckling evaluation and EB damage assessment.
46. Contact inspection and resistance–capacitance measurement of Si nanowire with SEM voltage contrast.
47. How to measure a-few-nanometer-small LER occurring in EUV lithography processed feature
48. Enabling CD SEM metrology for 5nm technology node and beyond
49. Advanced CD-SEM metrology for qualification of DSA patterns using coordinated line epitaxy (COOL) process
50. Process monitor of 3D-device features by using FIB and CD-SEM
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