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1. The PERCIVAL detector: first user experiments

2. P2M: A 2MPixel CMOS Image Sensor for Soft X-Ray Detection.

3. PROMOTION OF TRANSPORT AIRСRAFT FLIGHT SAFETY TAKING INTO ACCOUNT UPDATED CERTIFICATION REQUIREMENTS FOR ICING CONDITIONS

4. ON THE IMPACT OF FLIGHT SAFETY CERTIFICATION REQUIREMENTS ON THE AERODYNAMIC EFFICIENCY OF COMMERCIAL AIRPLANES

5. SOLUTIONS FOR THE NEW TASKS IN AERODYNAMICS IN THE PROCESS OF CERTIFICATION OF AIRPLANCE OF TRASPORT CATEGORY – ANTI-ICE SYSTEM

6. DETERMINATION OF PARASITE DRAG FOR COMMERCIAL AIRPLANE AT TRANSONIC SPEEDS

8. Photovoltaic and photoelectric response of Sn2P2S6 ferroelectric films

9. MEANS TO PROVIDE GROWTH POTENTIAL FOR SUPPORT OF AIRCRAFT COMPETITIVENESS

10. DETERMINATION OF COMMERCIAL AIRCRAFT WING GEOMETRY DURING THE FLIGHT

12. The PERCIVAL detector first user experiments

13. DETERMINATION OF COMMERCIAL AIRCRAFT WING GEOMETRY DURING THE FLIGHT

14. MEANS TO PROVIDE GROWTH POTENTIAL FOR SUPPORT OF AIRCRAFT COMPETITIVENESS

15. Dielectric properties of composite based on ferroelectric copolymer of poly(vinylidene fluoride-trifluoroethylene) and ferroelectric ceramics of barium lead zirconate titanate

16. Characterization of the Percival detector with soft X-rays

17. Study of the Formation Process of Memristor Structures Based on Copper Sulfide

18. Tertiary pyroelectric effect in TGS group crystals

20. Development of an advanced method for compressing the dynamic component of a differential-represented frame

21. PERCIVAL: possible applications in X-ray micro-tomography

23. Formation of Piezo- and Pyroelectric Matrices with the Use of Nanoprofiled Silica

24. Dielectric dispersion of polycrystalline ferroelectric-semiconductor Sn2P2S6 films

25. Formation of an Array of Memristor Structures Using a Self-Assembly Matrix of Porous Anodic Aluminum Oxide

26. Carbon tip aperture cantilevers: Fabrication & features in near-field magneto-optical imaging

28. Multilayered ceramic heterostructures of lead zirconate titanate and nickel-zinc ferrite for magnetoelectric sensor elements

30. Percival P2M-FSI detector: first test at a Synchrotron Ring beamline with tender x-ray photons

31. P2M: First Optical Characterisation Results of a 2MPixel CMOS Image Sensor for Soft X-Ray Detection

32. Defocused Ion Beam Etching of the Silicon Probes for High Resolution Atomic-force Microscopy

33. Formation features and electrophysical properties of ferroelectric films ZnO study

34. Features of silicon deep plasma etching process at 3D-TSV structures producing

35. P2M: A 2MPixel CMOS Image Sensor for Soft X-Ray Detection

36. Numerical simulation of ice accretion on airplane surface

37. Percival: A soft x-ray imager for synchrotron rings and free electron lasers

38. Study of functioning of the magneto-optical method as part of magnetic force microscopy

39. Scanning probe microscopy cantilevers improvement for advanced research and manipulation at nano scale

40. The PERCIVAL soft X-ray Detector

41. Dynamic pyroelectric response of composite based on ferroelectric copolymer of poly(vinylidene fluoride-trifluoroethylene) and ferroelectric ceramics of barium lead zirconate titanate

42. Integration of scanning near field polarization optical microscopy and atomic force microscopy for investigation of magnetic and ferroelectric materials

43. Carrier recovery techniques analysis for PSK signals

44. Advanced aperture cantilevers made by focused ion beam for both magnetic domain structure and morphology investigation in high resolution magneto optical microscopy

45. Resistive switching of CuO nanofibers embedded into hollow channels of SiO2 layer

46. Dielectric properties of composite materials based on P(VDF-TrFE) copolymer and deuterated triglicyne sulfate crystal

47. Photovoltaic and photoelectric response of Sn2P2S6 ferroelectric films

48. The Percival 2-Megapixel monolithic active pixel imager

49. Investigation into the effect of cantilever structural parameters on the sensitivity of magnetic force microscopy

50. Tungsten alloyed with rhenium as an advanced material for heat-resistant silicon ICs interconnects

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