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Abstract The functional silica/polyamide-imide composite films were prepared via simple ultrasonic blending, after the silica nanoparticles were modified by cationic surfactant—cetyltrimethyl ammonium bromide (CTAB). The composite films were characterized by scanning electron microscope (SEM), thermo gravimetric analysis (TGA) and thermomechanical analysis (TMA). CTAB-modified silica nanoparticles were well dispersed in the polyamide-imide matrix, and the amount of silica nanoparticles to PAI was investigated to be from 2 to 10 wt%. Especially, the coefficients of thermal expansion (CET) continuously decreased with the amount of silica particles increasing. The high thermal stability and low coefficient of thermal expansion showed that the nanocomposite films can be widely used in the enamel wire industry.

An analytical study compared a high temperature superconducting microstrip filter and its gold counterpart with respect to insertion loss, transmission characteristics, bandwidth and other attributes. It was found that the high temperature superconducting filter used in the experiment holds a lot of promise for high efficiency communications systems. Design technique, filter fabrication, experimental arrangements, findings and conclusions are presented.

We analyzed the unsymmetrical fault characteristics of resistive superconducting-fault-current-limiters (SFCL) based on YBCO thin films with the unbalanced faults such as a single line-to-ground fault, a double line-to-ground fault, and a line-to- line fault in a three-phase system. The unsymmetrical rates of fault phases were 6.4, 9.2, 8.8 at the fault onset, but decreased by 1.4, 1.5,3.7 after 50 ms in the fault types, respectively. The positive sequence current I¹ was the highest in a double line-to-ground fault, immediately after the fault onset, but that of a line-to-line fault was the highest after 50 ms. This means the current limiting effect was the worst in a line-to-line fault, due to the unbalanced quench between the SFCL units. The negative sequence currents I² of a single and double line-to-ground faults were relatively low, except for the quench instant, because of the rapid interruption of fault currents by the SFCL. The zero sequence current I0 was similar to the behavior of the negative sequence current. Finally, the positive sequence resistance Z¹ was reduced remarkably immediately after the fault but gradually approached the balanced positive sequence resistance prior to the system fault, except during a line-to-line fault. The simultaneous quench between the SFCL units was important for low line-to-line fault currents. [ABSTRACT FROM AUTHOR]