17 results on '"Hwang, Byeong-Uk"'
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2. Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test
3. Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior
4. Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi
5. Intense pulsed light surface treatment for improving adhesive bonding of aluminum and carbon fiber reinforced plastic (CFRP)
6. Bending reliability of Ni–MWCNT composite solder with a differential structure
7. Pressureless transient liquid phase bonding using SAC305 with hybrid Ag particles and its reliability under high-temperature storage test
8. Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability
9. Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding
10. The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature
11. Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding
12. Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross-Linking Process
13. Effect of SDBS on the oxidation reliability of screen-printed Cu circuits
14. Microstructural evolution and mechanical properties of SAC305 with the intense pulsed light soldering process under high-temperature storage test
15. Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu Ni bonding
16. Pressureless transient liquid phase sintering bonding using SAC305 with hybrid Ag particles for high–temperature packaging applications
17. Growth kinetics of intermetallic compound layers at the interface during laser-assisted bonding depending on surface finish
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