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As a kind of Computer Controlled Optical Surfacing(CCOS) technology. Ion Beam Figuring(IBF) has obvious advantages in the control of surface accuracy, surface roughness and subsurface damage. The superiority and characteristics of IBF in optical component processing are analyzed from the point of view of removal mechanism. For getting more effective and automatic tool path with the information of dwell time, a novel algorithm is proposed in this thesis. Based on the removal functions made through our IBF equipment and the adaptive tool-path, optimized parameters are obtained through analysis the residual error that would be created in the polishing process. A Φ600 mm plane reflector element was used to be a simulation instance. The simulation result shows that after four combinations of processing, the surface accuracy of PV (Peak Valley) value and the RMS (Root Mean Square) value was reduced to 4.81 nm and 0.495 nm from 110.22 nm and 13.998 nm respectively in the 98% aperture. The result shows that the algorithm and optimized parameters provide a good theoretical for high precision processing of IBF.

Atmospheric Pressure Plasma Processing (APPP) of silicon-based optics and wafers is a form of chemical etching technology developed in recent years. The material removal rate is comparable to those of conventional mechanical processing methods in precision fabrication. Moreover, there is no mechanical contact or physical loading on the substrate surface, hence no surface or sub-surface damages are induced. Inductively coupled plasma is one realization of APPP. In this work, inductively coupled plasma torch is used to generate plasma and excite etchant particles at atmospheric pressure. These active particles then diffused to the workpiece surface, react with its atoms to form volatile products. The activity and number of particles in plasma are influenced by processing parameters such as input power, distance between nozzle and substrate surface, flow rate of plasma gas argon and precursor gas CF4. These factors have various impacts on material removal rate. Processing experiments are conducted on fused silica to investigate the parameters’ influences on material removal rate. The basic interaction between substrate surface and plasma is illustrated, then the relationships between processing parameters and material removal rate are analyzed. From the experiments some trends are derived. Material removal rate rises with the increase of power and flow rate of CF4, whereas decreases with the increase of processing distance, etc. The etching footprint is proved to be near Gaussian-shaped and believed to have high potential for deterministic surface processing.

The Atmospheric Pressure Plasma Jet (APPJ) is an innovative technology in advanced optics manufacturing; it is a non-contact precision machining method based on the chemical reaction between a reactive neutral radical generated by the plasma and substrate surface atoms for atom-scale material removal. The APPJ involves a complicated process; therefore, the controllability of the technical process was investigated to describe the accuracy of machining efficiency that is the uniformity and repeatability for machining systems, the linearity relation between the removal rates and dwell time. Moreover, the experimental result of the fused quartz removal function variation trend with different processing parameters was discussed. The results of experimentation indicate that the APPJ method has good repeatability within a short dwell time, the removal depth increases with the dwell time and a linearity relation seems appropriate, and the radio frequency (RF) power and the flux of assistant gas oxygen have a great influence on removal efficiency. However, the removal rate remains stable under small perturbation of flux of plasma gas He and reactive gas SF6. And the surface roughness is improved from Ra 9.3nm to Ra 3.7nm.

In the reaction of the atmospheric pressure plasma process, the heat stable process of the atmospheric pressure plasma jet has a direct impact on the removal rate, CF4 is the provider of active F* atom, O2 is important auxiliary gas, and they play an important role in the process. In order to research the rule of the concentration of the 3 parameters upon the atmospheric pressure plasma processing, the atmospheric pressure plasma jet was used for processing and the spectrometer was used to monitor the changes in the process. The experiment indicates that: when the heat is stable, the concentration of the active F* atom essentially remains unchanged; with increasing the concentration of gas CF4, the spectrum of the active F* atom has self-absorption phenomena, so using the atomic emission spectroscopy method to monitor the changes in the concentration of active F* atom generated by CF4 is not completely exact; because O2 can easily react with the dissociation product of CF4, which inhibits the compound of the active F* atom, so in a certain range with increasing the concentration of gas O2, the concentration of the active F* atom becomes strong.

Zerodur material is considered as the ideal material in the high performance optic systems because of its excellent thermal stability characteristics. This paper deals with the impacting factors on the zerodur material surface roughness during atmospheric pressure plasma jet(APPJ) processing. At first, based on multiphase and multi-component in zerodur material, the effect on the zerodur surface chemical components and surface roughness is studied when the element contained Si is etched during the chemical machining process. The change of surface microcosmic topography is observed, it is proved that the technology of atmospheric pressure plasma jet can modify the surface roughness of zerodur material. Moreover, in consideration of the re-deposition phenomenon in the machining process, the composition of the re-deposition are studied and the genesis of the re-deposition were analysed. Scanning Electron Microscopy (SEM) with Energy Dispersive X-ray spectrometry (EDX) were utilized to obtain the elemental composition of the sample powder residuum on zerodur surface. The relationship between substrate roughness and the process parameters is established based on the experimental results. Experimental results indicate that it is beneficial to add certain amount O 2 to modify the surface roughness of zerodur material. This finding provides an important basis for the improvement of surface roughness in APPJ of zerodur material.

This paper presents a novel approach for control of the yoyo playing, using return map parameterization The return map is a scalar function that maps the initial amplitude of the yoyo and the parameter (an intermediate state of the yoyo) to the final amplitude. The optimization programs can be combined with a standard one-degree zero-finding routine to search for an appropriate value of the parameter, such that the final amplitude equals a desired value. The proposed novel algorithm use inversion-based optimization technique for fast solution of the optimization problem, which can greatly reduce the computation time. Simulation on a single yoyo cycle shows the required computation time is about 10 milliseconds, so the software may be applicable to real-time control. The approach is promising as it may be extended to control of other similar systems.