256 results on '"Huang, Mingliang"'
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2. Methylated septin 9 gene is an important prognostic marker in stage II and stage III colorectal cancer for evaluating local recurrence or distant metastasis after surgery
3. Dual-cluster model of Sn-based binary eutectics and solders
4. Insight into the interatomic competitive mechanism for interfacial stability of room temperature liquid GaInSn/Cu electrode
5. Effect of Sanyrene combined with Mepilex Border in prevention of pressure injuries in the perioperative period of the spinal surgery (赛肤润联合美皮康预防脊柱手术围术期压力性损伤的效果观察)
6. Geochemistry of the Yudong bauxite deposit, south-eastern Guizhou, China: Implications for conditions of formation and parental affinity
7. Fabrication of cerium myristate coating for a mechanochemically robust modifier-free superwettability system to enhance the corrosion resistance on 316L steel by one-step electrodeposition
8. A recurrence prognosis model of colorectal cancer based on preoperative nutritional score and clinical features
9. The mineralization process of the Lanuoma Pb-Zn-Sb deposit in the Sanjiang Tethys region: Constraints from in situ sulfur isotopes and trace element compositions
10. Design of Array Antenna for High-Strength Radiation Field Generation at k-Band
11. Fabrication of broadband antireflection coatings using wavelength-indirect broadband optical monitoring
12. Electromigration-induced failure behavior of low-temperature Cu/Sn-57Bi-1Ag/Cu solder joints
13. Finite element analysis of board-level drop reliability of WLCSP solder joints with eutectic Sn-Bi, hybrid Sn-Bi/Sn-Ag-Cu and Sn-Ag-Cu solders
14. [Corrigendum] MicroRNA‑133b targets TGFβ receptor I to inhibit TGF‑β‑induced epithelial‑to‑mesenchymal transition and metastasis by suppressing the TGF‑β/SMAD pathway in breast cancer
15. All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles
16. Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows
17. Synchrotron radiation imaging study on the rapid IMC growth of Sn–xAg solders with Cu and Ni substrates during the heat preservation stage
18. Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn–xCu solders during multiple reflows
19. Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding
20. Optical perfect absorption for information security realized by the novel multi-layered nanofilm structures filled with lossy dopant
21. In situ study on Cu-Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient
22. Analysis of Field Coupling on Cables for Pulse Current Injection Test
23. Microstructure and mechanical properties of Sn-Ag-Cu/Sn-Pb hybrid solder joints with different Pb contents
24. A highly stable electroplating bath for micro-scale Sn-Ag solder bumping
25. Effects of electroplating parameters on composition and morphology of Au-Sn alloy films
26. Obstructed Growth of Interfacial Intermetallic Compounds on (011) and (111)-Oriented Nanotwinned Cu Substrates
27. Composition design and mechanical properties of low-temperature Sn-Bi-In-(Ag) solders with low Bi content
28. Migration behavior of indium atoms in Cu/Sn–52In/Cu interconnects during electromigration
29. In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process
30. Insight into the effect of reorganized chemical short-range orders at Ga-based alloys/Cu interfaces on the nucleation and growth of CuGa2 crystals
31. Medications and medical care of the Buyi ethnicity in BuyimoJingbooks: an investigation on its philosophical origin
32. The Influence of Cables in The Interference Suppression Characteristics
33. Ultra-wideband 1bit reconfigurable reflectarray based on tight coupling method
34. Stress relaxation and failure behavior of Sn–3.0Ag–0.5Cu flip-chip solder bumps undergoing electromigration
35. Liquid-state and solid-state interfacial reactions between Sn–Ag–Cu–Fe composite solders and Cu substrate
36. Pronounced electromigration of GaInSn/Cu interconnects under super low critical current density
37. The adsorption of Ag 3Sn nano-particles on Cu–Sn intermetallic compounds of Sn–3Ag–0.5Cu/Cu during soldering
38. Non-cyanide Electroplating of Gold-Tin Eutectic Alloy for Flip-Chip Packaging of LED
39. Methylated Septin 9 Gene is an Important Prognostic Marker in Stage II and Stage III Colorectal Cancer for Evaluating Local Recurrence or Distant Metastasis After Surgery
40. Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder
41. Effect of Bi Content on the Microstructure and Mechanical Properties of CU/SN-XBI/CU Solder Joints After Soldering and Aging
42. DeepRTP: A Deep Spatio-Temporal Residual Network for Regional Traffic Prediction
43. Cluster-Delay Consensus for the Second-Order Nonlinear Multi-Agent Systems with Random Noises
44. Genesis of Hydrous-Oxidized Parental Magmas for Intraplate Porphyry Deposits
45. Effect of Solder Volume on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and the Substrates
46. A Wideband Differential Slot Antenna with a Notched Band
47. MicroRNA‑133b targets TGFβ receptor I to inhibit TGF‑β‑induced epithelial‑to‑mesenchymal transition and metastasis by suppressing the TGF‑β/SMAD pathway in breast cancer
48. Effects of Electroplating Process Parameters on Properties of Co-electroplated Au-Sn alloy
49. Heterogeneous lithospheric mantle beneath the southeastern Tibetan Plateau: Evidence from Cenozoic high-Mg potassic volcanic rocks in the Jinshajiang–Ailaoshan Cenozoic magmatic belt
50. Experimental study of oil-paper insulation under combined thermal stress and corona discharge
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