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The establishment of micro channel LTCC（Low-temperature cofired ceramics, LTCC） substrate finite element analysis model of multi chip module and the thermal simulation analysis on it. The effect of different microchannel structures, microchannel diameter and fluid flow velocity on the heat dissipation performance was analyzed,Using orthogonal table design, nine multi-chip module models with different combinations of structural parameters were designed. Nine sets of temperature data were obtained and range analysis and variance analysis,The results show that the order of influencing factors on the heat dissipation performance is as follows: microfluidic structure, microfluidic channel diameter and fluid flow rate. When the confidence level is 90%, the micro channel structure and the micro channel diameter have a significant effect on the heat dissipation of the micro channel, and the flow velocity has little effect on the heat dissipation of the micro channel.

Based on ANSYS software established board level optical interconnect module finite element model,by means of the analysis of the model of the thermal-structure random vibration coupling,obtained the data of stress and strain under the coupling condition,analyzed the influence of the change of the shape parameters of three kinds of solder joints,the height of the solder joints,the diameter of the pad and the volume of the solder balls.The results show that the stress and strain value of the solder joint is gradually reduced from the center position to the solder joint at both ends;the maximum stress and strain point appeared in the solder joint at the corner of the array.With the increase of the solder joint height,the maximum stress and strain of the solder joint increased gradually.With the increase of the diameter of the pad and the volume of the solder ball,the maximum stress and strain decreased gradually.

Five process parameters of the embedded substrate, the width of transmission line, the thickness of transmission line, coupling length of transmission lines, the distance between transmission line and substrate dielectric constant were chosed as control factors. By establishing five factors and four levels orthogonal experiment table with 16 parameter levels , cross talk between transmission lines was analyzed. The results show that the distance between transmission lines is the greatest influence on the crosstalk, then the coupling length of transmission lines, and the substrate dielectric constant, the width of transmission line and transmission line thickness have little influence on the crosstalk. The optimal parameter combination is W4T4S4L1D1 with the transmission line width of 15 mil, the transmission line thickness of 70 μm, transmission line coupling distance of 2 mm, coupling length of 5 mm, a dielectric constant of 4.3.

The miniature ball grid array（ BGA） solder joint three point bending stress and strain finite element analysis models were set up,and the influences of ball diameter,ball height,pad diameter and bending load speed on the stress and strain of miniature BGA solder joints were analyzed under the three point bending load. The results show that both of the maximum stress and strain of miniature BGA solder joints increase with the increase of the ball diameter,ball height and bending load speed respectively,whereas reduce with the increase of the pad diameter. With 90% confidence,the ball diameter has a certain effect on the maximum bending stress,the ball height and the pad diameter have no significant effect on the maximum stress of miniature BAG solder joint. The ball diameter,pad diameter,ball height affect the maximum stress of miniature BGA solder joints in a descending order.

Background: The systemic inflammation score (SIS), based on serum albumin (Alb) and lymphocyte-to-monocyte ratio (LMR), is a novel prognostic tool for some tumours. Studies indicate that the SIS can be used as a postoperative prognostic marker. However, its predictive value in elderly oesophageal squamous cell carcinoma (ESCC) patients treated with radiotherapy is unclear. Methods: In total, 166 elderly ESCC patients who received radiotherapy with or without chemotherapy were included. Based on different combinations of Alb and LMR levels, the SIS was divided into 3 groups, SIS = 0 (n = 79), SIS = 1 (n = 71) and SIS = 2 (n = 16). The Kaplan—Meier method was used for survival analysis. Univariate and multivariate analyses were performed to assess prognosis. Time-dependent receiver operating characteristic (t-ROC) curves were used to compare the prognostic accuracy of the SIS with that of Alb, LMR, neutrophil-to lymphocyte ratio (NLR), platelet-to-lymphocyte ratio (PLR), and systemic immune-inflammatory index (SII). Results: Decreased Alb and LMR were both associated with shorter OS, whereas a lower SIS was significantly associated with better outcomes. The OS of SIS = 0, SIS = 1 and SIS = 2 was 28.0 ± 2.9, 16.0 ± 2.8 and 10.0 ± 7.0 months, respectively (p = 0.000). Similar results were also observed for PFS. Multivariate analysis of the model with SIS revealed that the SIS was a significant independent biomarker for predicting OS and PFS. The nomogram showed that the C-index was improved to 0.677 when the SIS factor was incorporated. Furthermore, the 3-year OS rates for patients in the SIS-high group (SIS = 1 and SIS = 2) undergoing concurrent radiotherapy with a single agent (CCRT-1) and concurrent radiotherapy with two agents (CCRT-2) were 42% and 15%, respectively (p = 0.039). The t-ROC curve showed that the SIS was more sensitive than other prognostic factors for predicting overall survival. Conclusion: The SIS may be a useful prognostic marker in elderly patients with ESCC receiving radiotherapy alone or chemoradiotherapy. The SIS showed a better predictive ability for OS than the continuous variable Alb and could stratify patient prognosis in different therapeutic regimens. CCRT-1 may be the best treatment for SIS-high patients. [ABSTRACT FROM AUTHOR]