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50 results on '"Huang, Chih-Ming"'

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1. The Enhancement of Classification of Imbalanced Dataset for Edge Computing

27. Three Dimensional Interconnects with High Aspect Ratio TSVs and Fine Pitch Solder Microbumps

32. Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

37. Development of Fine Pitch Solder Microbumps for 3D Chip Stacking

48. Development of 25-\mum-Pitch Microbumps for 3-D Chip Stacking.

50. Cervical Hematoma Causing Airway Compromise after Traumatic Laceration of Facial Artery.

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