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Microphase separation of bio-based soft blocks in a hard isosorbide polycarbonate enabled the preparation of a transparent bio-based engineering plastic with improved mechanical properties and processability at milder conditions. The ability to process these isosorbide-containing polycarbonates at lower temperatures in combination with a lower polymerization temperature due to the use of the activated bis(methyl salicyl) carbonate as the carbonate source avoided the undesired elimination of β-hydrogens, which is commonly observed in isosorbide-containing polymers. Preparation of a wide range of custom samples with varying combinations of soft blocks, followed by characterization and statistical analysis, enabled the identification of the correlations between composition and mechanical and thermal properties, resulting in an optimized engineering plastic with facile processing, transparency, and ductility combined with >84% renewable content.

In this paper, we present a method to create a highly sensitive piezoelectric quasi 1–3 composite using a thermoplastic material filled with a piezoelectric powder. An up-scalable high-temperature dielectrophoresis (DEP) process is used to manufacture the quasi 1–3 piezoelectric polymer-ceramic composites. For this work, thermoplastic cyclic butylene terephthalate (CBT) is used as a polymer matrix and PZT (lead zirconium titanate) ceramic powder is chosen as the piezoelectric active filler material. At high temperatures, the polymer is melted to provide a liquid medium to align the piezoelectric particles using the DEP process inside the molten matrix. The resulting distribution of aligned particles is frozen upon cooling the composite down to room temperature in as little as 10 min. A maximum piezoelectric voltage sensitivity (g33) value of 54 ± 4 mV·m/N is reported for the composite with 10 vol% PZT, which is twice the value calculated for PZT based ceramics., Novel Aerospace Materials, Aerospace Structures & Materials

In this paper, we present a method to create a highly sensitive piezoelectric quasi 1–3 composite using a thermoplastic material filled with a piezoelectric powder. An up-scalable high-temperature dielectrophoresis (DEP) process is used to manufacture the quasi 1–3 piezoelectric polymer-ceramic composites. For this work, thermoplastic cyclic butylene terephthalate (CBT) is used as a polymer matrix and PZT (lead zirconium titanate) ceramic powder is chosen as the piezoelectric active filler material. At high temperatures, the polymer is melted to provide a liquid medium to align the piezoelectric particles using the DEP process inside the molten matrix. The resulting distribution of aligned particles is frozen upon cooling the composite down to room temperature in as little as 10 min. A maximum piezoelectric voltage sensitivity (g33) value of 54 ± 4 mV·m/N is reported for the composite with 10 vol% PZT, which is twice the value calculated for PZT based ceramics.

The development of well-adhering, easily producible photonic reflective coatings is still a challenge. Here, an easy-to-produce, industrial viable process is reported that uses a primer layer of the so-called type II photoinitiator to obtain an excellent adhesion between a plastic substrate and one-dimensional (1D) photonic liquid crystalline coatings. Furthermore, a good alignment of the reactive cholesteric liquid crystal mixture is obtained using a bar-coating process, without alignment layers or surfactants. After photopolymerization, cross-hatch tape tests show a good adhesion of the photonic coating having a reflection band of 50% transmission with almost no scattering. Additionally, we demonstrate the ability to create well-adhering ∼100% reflective coatings by coating double layers and the ability to create single-layered cholesteric broadband reflectors using solely a reactivity gradient created by the primer layer. Our new interfacial method gives new opportunities to use reflecting 1D photonic coatings in industrial processes and applications and allows the bonding of almost any polymer to a plastic substrate.