20 results on '"Hlina, Jiri"'
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2. Reliability of printed power resistor with thick-film copper terminals
3. Investigation of cooling capability of ceramic substrates for power electronics applications
4. Study of Internal Stress in Conductive and Dielectric Thick Films
5. Behaviour of printed resistors compatible with thick film copper technology
6. Alternative interconnection methods for bare die electronic components
7. Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper
8. Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications
9. Characterization of Thick Film Pastes for Aluminum Nitride Substrates
10. Properties of Thick Printed Copper Films on Aluminum Nitride Substrates
11. Study of co-fired multilayer structures based on Thick Printed Copper technology
12. Optimization of Contacting Technological Process on Printed Conductive Pattern for Wearable Electronics
13. Interconnection of Terminals on Flexible Substrates it Printed Conductie Patterns
14. Copper-filled Vias made by Thick Printed Copper Technology
15. Effect of copper- and silver-based films on alumina substrate electrical properties
16. Properties of Thick Printed Copper Films on Alumina Substrates
17. Printed thick copper films for power applications
18. Multilayer Thick Printed Copper Structures
19. Comparison of copper and silver thick film on alumina substrates properties
20. Adhesion improvement of Thick Printed Copper film on alumina substrates by controlling of oxygen level in furnace
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