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42 results on '"Hashimoto, Yasunori"'

4. Multi-chip gang bonding technology using the thermo-compression bonder for Si substrate

Author

Mikio Kawakami, Katsumi Terada, Hashimoto Yasunori, Hiroto Tanaka, Yoshihito Mizutani, Imai Koichi, Toshiyuki Jinda, and Noboru Asahi

Subjects
010302 applied physics, Fusion, Materials science, 05 social sciences, Three-dimensional integrated circuit, Chip, 01 natural sciences, Heat capacity, Thermal conductivity, Soldering, 0103 physical sciences, 0501 psychology and cognitive sciences, Wafer, Elasticity (economics), Composite material, 050104 developmental & child psychology
Abstract

Gang bonding process using TCB (thermo-compression bonder) has been developed in recent years as one of the methods to mount advanced packages fast [1, 2]. In the gang bonding process, we can improve the throughput considerably by post-bonding multi pre-bonded chips at a time. However, when a conventional elastic film was used to reduce the variance of bonding load to each chip, we found that the position shift of the chips occurred by deformation of the film especially in narrow pitch chip bonding. In addition, it is difficult to supply enough heat for the solder joint, because the elastic film generally has low thermal conductivity and low heat resistance. In particular, heat capacity necessary for solder fusion is insufficient in the case of chip on wafer (CoW) using Si substrate. In this presentation, we will report about novel gang bonding head (GBH) that is able to reduce the position shift and has both of high thermal conductivity and low elasticity.

Published
2018

6. High Accuracy Thermal Compression Bonding Technology for Large-Sized Substrate

Author

Mikio Kawakami, Yoshihito Mizutani, Hikaru Tomita, Hashimoto Yasunori, Imai Koichi, Masafumi Senda, Katsumi Terada, Toshiyuki Jinda, and Noboru Asahi

Subjects
010302 applied physics, Engineering, Wire bonding, business.industry, 05 social sciences, Mechanical engineering, Thermocompression bonding, Substrate (printing), 01 natural sciences, 0103 physical sciences, Electronic engineering, 0501 psychology and cognitive sciences, Wafer, Integrated circuit packaging, Tape-automated bonding, business, Wafer-level packaging, Flip chip, 050104 developmental & child psychology
Abstract

For improvement of the productivity and the cost reduction, FOWLP (fan-out wafer level package) or FOPLP (fan-out panel level package) process using large-sized substrate has been actively developed in recent years. Above all, we will report about the novel TCB (thermal compression bonding) equipment which is even applicable to a 3D-IC stacking process and a fine pitch FOWLP or FOPLP of RDL-first process using large-sized substrate. We made the prototype which was applicable to CoW of 12 inch wafer and evaluated it. The prototype includes a high rigid fixed stage which is designed to the same size as the bonding head, and a substrate handling mechanism which lifts a substrate from the stage and transfers it to other prescribed position every one bonding cycle. By using this equipment, it is possible to thermally press a chip on even large-sized substrate without causing deterioration in bonding accuracy resulting from stage distortion. Also, it does not need to manage UTOS (Underfill time on stage), when the equipment is used for "2 step bonding process" which can improve the throughput of TCB. In this presentation, we will report about the investigation result of the heat influence on adjacent chip and about the temperature difference in the 3D-IC stacking process by using the prototype. In addition, we will present a novel multi-layer collecting bonding process which is applicable to a large-sized substrate effectively, and report about the result of the evaluation of solder connection of the TSV TEG chip.

Published
2017

7. 3D-IC thermo-compression collective bonding process using high temperature stage

Author

Masafumi Senda, Mikio Kawakami, Hashimoto Yasunori, Hikaru Tomita, Toshiyuki Jinda, Noboru Asahi, Katsumi Terada, Yoshihito Mizutani, and Imai Koichi

Subjects
010302 applied physics, Materials science, business.industry, Three-dimensional integrated circuit, 020206 networking & telecommunications, 02 engineering and technology, 01 natural sciences, Temperature measurement, Substrate (building), Stack (abstract data type), Thermal insulation, Anodic bonding, Soldering, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Composite material, business, Layer (electronics)
Abstract

As one of the methods to stack the 3D-IC fast, the collective bonding process using TCB (thermo-compression bonder) attracts attention [1-3]. In the collective bonding process, we can improve the throughput considerably by postbonding the multilayered pre-bonded chips at a time. However, when the number of the stacked chips increased, we found that the temperature difference between the upper layer and lower layer became large and the good solder connection was not obtained in all the layer in conventional TCB. Therefore, we reported that the collective bonding could be realized by using the heat insulation stage which can prevent an outflow of the heat from the bonding head [1]. By using the heat insulation stage, we could reduce the temperature difference to less than 10oC for four layers, but it was necessary to reduce temperature difference more, depending on the kind of NCF. Besides, it was difficult to reduce difference of temperature when, for example, the number of the stacked chips increased more than eight layers. In this presentation, we report about new collective bonding process that is able to reduce the temperature difference by using high temperature backup stage. We could enable the high temperature process of the stage by using the wafer-handling mechanism which lifts a substrate from the stage every one bonding cycle.

Published
2017

23. Development of Shear Type Compact MR Brake for the Intelligent Ankle-Foot Orthosis and Its Control; Research and Development in NEDO for Practical Application of Human Support Robot

Author

Furusho, Junji, primary, Kikuchi, Takehito, additional, Tokuda, Miwa, additional, Kakehashi, Taigo, additional, Ikeda, Kenichi, additional, Morimoto, Shouji, additional, Hashimoto, Yasunori, additional, Tomiyama, Hiroki, additional, Nakagawa, Akio, additional, and Akazawa, Yasushi, additional

Published
2007
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24. Research and Development of the Lower Limbs Orthosis Intelligently Controlled by Shear-Type Compact MR Brake-1st Report: Development of Shear Type Compact MR Brake and Controllable Ankle-Foot Orthosis with the MR Brake-

Author

Furusho, Junji, primary, Kikuchi, Takehito, additional, Morimoto, Shoji, additional, Tokuda, Miwa, additional, Li, Chengqiu, additional, Hashimoto, Yasunori, additional, Nakagawa, Akio, additional, and Akazawa, Yasushi, additional

Published
2007
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40. Resting123I-BMIPP scintigraphy in diagnosis of effort angina pectoris with reference to subsets of the disease.

Author

Yamabe, Hiroshi, Abe, Hiroaki, Yokoyama, Mitsuhiro, Shiotani, Hideyuki, Kajiya, Sadashi, Mori, Takao, and Hashimoto, Yasunori

Abstract

This study was undertaken to assess the diagnostic value of resting123I-BMIPP scintigraphy in patients with effort angina pectoris. One hundred and four patients underwent scintigraphic and angiographic examinations. The subsets of the patients were stable effort angina pectoris (stable type) in 27 cases, new onset of effort angina pectoris (new onset type) in 21 cases, and worsening effort angina pectoris (worsening type) in 35 cases. The remaining 21 cases were subjects without evidences of coronary artery disease (non-CAD).l23I-BMIPP was injected under resting and pain free condition, then data for single photon emission tomography (SPECT) were acquired. The positive regional123I-BMIPP defects in three coronary territories were visually judged on the tomographic images. The overall sensitivity to diagnose the patients was 62.6% (52/83) and the overall specificity to exclude non-CAD subjects was 95.2% (20/21). The detection rate in each subset of the disease was 48.1% (13/27) in stable type, 47.6% (10/21) in new onset type and 77.1% (27/35) in worsening type (p < 0.05 versus two other types). For detection of stenosed vessels, the overall sensitivity was 41.4% (56/148) and the overall specificity was 93.8% (152/164). The rate of detection of stenosed vessels was 31.7% (13/41) in stable type, 31.4% (11/35) in new onset type, and 55.6% (40/72) in worsening type (p < 0.05 versus two other types). Vessels with 75% stenosis were more sensitively detected in the worsening type (33.3%; 4/12) compared to the remaining two types (8.3%; 1/12) even though the difference was not significant. The resting123I-BMIPP scintigraphy was therefore valuable in diagnosing patients with effort angina pectoris and involved coronary arteries especially in the subset of patients with worsening type. [ABSTRACT FROM AUTHOR]

Published
1998
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42. [Anesthetic management of elderly patients aged 90 years or older].

Author

Murakawa T, Anzawa N, Hashimoto Y, Sakai I, and Matsuki A

Subjects
Aged, Anesthesia, General statistics & numerical data, Anesthesia, Inhalation statistics & numerical data, Anesthesia, Intravenous statistics & numerical data, Female, Humans, Male, Perioperative Care, Aged, 80 and over, Anesthesia, General methods, Surgical Procedures, Operative
Abstract

The authors experienced 55 cases of anesthetic management in 52 elderly surgical patients, 14 men and 38 women, aged 90 to 101 years with an average of 92.1 +/- 2.1 years for the past ten years. Surgical procedures included 38 cases of orthopedic, 14 cases of general surgical and 3 cases of ophthalmic operations. Thirteen cases out of them were emergency. General, epidural, spinal, and local anesthesia were applied in 34 cases, 18 cases, 2 cases, and one case out of these elderly patients, respectively. These general anesthesia consisted of total intravenous anesthesia with propopol, fentanyl and ketamine in 27 cases, sevoflurane with nitrous oxide in 4 cases, isoflurane with nitrous oxide or air in 2 cases, and thiopental anesthesia in one case. The elderly patients had past history of heart disease, dementia, hypertension, cerebral infarction/hemorrhage, diabetes mellitus and others. Their preoperative examinations revealed anemia, hypoproteinemia, renal hypofunction, serum electrolytes imbalance, and others. Vasopessors were given to 42% of the patients during anesthesia and surgery. Their postoperative complications included myocardial infarction, paroxysmal atrial fibrillation, hypotension following anemia, transient hemiparesis, delirium and so on. Two patients developed myocardial infarction postoperatively and died thereafter. The authors suggest that appropriate anesthetic management for elderly patients aged 90 years or older requires proper preoperative evaluation, sufficient vigilance of hemodynamics with direct arterial pressure measurement, reliable preparation of medical agents, and awareness of impairment of circulatory function and others by aging.

Published
2004

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