301 results on '"Hang, Chunjin"'
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2. Enhanced reaction kinetics and structure integrity of Cu/F co-doped SnO2@C composite for high-performance lithium-ion batteries
3. Pb Segregation in SnPb eutectic solder alloy induced by gamma irradiation
4. Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration
5. Thermal cycle reliability and creep behavior of nano-IMC mixed solder joints
6. Effect of the Second-Phase Particle Distribution on the Brittle Fracture Behavior of Sn-3Ag-0.5Cu Solder
7. Fracture behavior and constitutive relations of Sn-3.0Ag-0.5Cu solder alloy at cryogenic temperature
8. Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition
9. Effect of Nano-Cu6Sn5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints
10. Highly efficient SnO2-Carbon nanosphere heterojunctions decorated with Ag for detecting isopropanol at low operating temperatures
11. Effect of Aging Time on Ductile–Brittle Transition Behaviors of Sn-3.5Ag Solder
12. Effect of gamma irradiation on microstructural evolution and mechanical properties of SnPb eutectic solder joints
13. Ultra-efficient localized induction heating by dual-ferrite synchronous magnetic field focusing
14. In-situ fusion process and Cu–Sn compounds evolution mechanism of nano-intermetallic compound mixed solder joints
15. Effect of nano-intermetallic compound on creep properties and β-Sn grain recrystallization of Cu/Sn-Ag-Cu/Ni solder joints
16. The microstructure evolution and failure mechanism of Sn37Pb solder joints under the coupling effects of extreme temperature variation and electromigration
17. Mechanical properties degradation of Sn[sbnd]37Pb solder joints caused by interfacial microstructure evolution under cryogenic temperature storage
18. Interconnection method based on Cu-foam/Sn composite preform for high-temperature applications
19. Effect of gamma irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints
20. Surface treatment of micron silver flakes with coupling agents for high-performance electrically conductive adhesives
21. Interfacial microstructure characterization and solderability of the low pressure cold sprayed Cu-Al2O3 coating on Al substrate
22. Microstructure and mechanical properties of Sn–Bi solder joints reinforced with Zn@Sn core–shell particles
23. Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging
24. Effect of Cu6Sn5 nanoparticles addition on properties of Sn3.0Ag0.5Cu solder joints
25. One-step PDA coating strategy on pure Zn for blood-contacting engineering
26. Analysis and optimization of induction heating processes by focusing the inner magnetism of the coil
27. A novel antioxidant and low-temperature Sn-Zn solder paste based on Zn@Sn core-shell structure
28. A high-temperature-resistant die attach material based on Cu@In@Ag particles for high-power devices
29. Die-attach bonding at 230 °C using micron Sn-coated Zn particles for high-temperature applications
30. Effect of Ag3Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature.
31. Silver flake/polyaniline composite ink for electrohydrodynamic printing of flexible heaters
32. Robust Cu-Au alloy nanowires flexible transparent electrode for asymmetric electrochromic energy storage device
33. Fabrication of Ag@Ag2O-MnOx composite nanowires for high-efficient room-temperature removal of formaldehyde
34. Phase transformation behavior of Al-Au-Cu intermetallic compounds under ultra-fast micro resistance bonding process
35. Femtosecond laser irradiation induced heterojunctions between carbon nanofibers and silver nanowires for a flexible strain sensor
36. Joining of copper nanowires by electrodepositing silver layer for high-performance transparent electrode
37. Cu@Sn@Ag core–shell particles preform for power device packaging under harsh environments
38. Microstructure and properties of a vacuum-tempered glass with low-temperature-sintered silver paste
39. Highly stable flexible transparent electrode via rapid electrodeposition coating of Ag-Au alloy on copper nanowires for bifunctional electrochromic and supercapacitor device
40. Electrodeposition fabrication of Cu@Ni core shell nanowire network for highly stable transparent conductive films
41. High-efficiency extraction synthesis for high-purity copper nanowires and their applications in flexible transparent electrodes
42. Fabrication and characterization of silk fibroin coating on APTES pretreated Mg-Zn-Ca alloy
43. Effect of Nano-Cu6Sn5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints
44. Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition
45. A low-temperature Cu-to-Cu interconnection method by using nanoporous Cu fabricated by dealloying electroplated Cu–Zn
46. A low-temperature bonding method for high power device packaging based on In-infiltrated nanoporous Cu
47. A paste based on Cu@Sn@Ag particles for die attachment under ambient atmosphere in power device packaging
48. Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures
49. Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes
50. Interconnection method based on solder-filled nanoporous copper as interlayer for high-temperature applications
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