25 results on '"Hamada, Ryozo"'
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2. Wood and Wood Based Materials. Effects of Factors of Board Preparation on Dimensional Stability of Particleboards.
3. Curing Behavior of Wood Adhesives Under High Steam Pressure
4. <NOTE>Clearance of Butt-joint Between Laminae in LVL
5. チツプボードに関する研究(第3報) : チツプボードのdimensional stabilitiesの改良についての二・三の実験
6. Fundamentals of Molding Wood Particles (II). : Effect of Phenol-Formaldehyde Resin on Moldability
7. Wood drying by Radio-Heating
8. パーティクル・ボードに関する研究 : (第5報)パーティクル・ボードの厚さ及び割裂強度に及ぼす圧締時間の影響
9. Fundamentals of Molding Wood Particles (I), Effect of chemicals on moldability
10. Studies on the chipboard : Part 1. Mechanical Properties
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12. 粉状パーティクルによる硬質板に関する研究
13. Studies on the Particle Board : Report 4; Temperature and Moisture Distribution in Particle Board during Hot-pressing
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15. Studies on the Chipboard : Report 3; Some Experiments on the Improvement of Dimensional Stabilities of Chipboard.
16. Studies on the chipboard : Part 2. Swelling properties of chipboard
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20. Studies on the Particle Board : Report 5; Influences of Press-time on Thickness and Cleavage Strength of Particle Board.
21. Journal of the Society of Materials Science, Japan
22. Evaluation of ambient-temperature setting properties of phenol-resorcinol-formaldehyde resin wood adhesives by TBA method.
23. Journal of the Society of Materials Science, Japan
24. Kagaku To Seibutsu
25. Journal of the Society of Materials Science, Japan
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