Search

Objective: In this study，we aimed to identify differentially expressed heat shock proteins (HSPs) profile in the villi and decidua from early missed abortion(EMA) patients. Methods: By using high-throughput and high-precision Parallel Reaction Monitoring (PRM)-based targeted proteomics technique, this study studied the expressions of HSPs in villi and decidua of 10 EMA patients and 10 controls. Meanwhile, the expressions of 3 HSPs in villi of another 22 EMA patients and 22 controls were verified with Western blotting and immunohistochemistry (IHC). Results:Compared with the control group, there were potential differences in the expressions of 16 HSPs and 42 polypeptides in human villi and decidua. Among them, HSP90AB1, HSPD1 and HSPA13 were down-regulated in expressions in villi of EMA patients, with a statistically significant difference, which was consistent with the verification results of Western blot and IHC. Conclusion: Using PRM- based targeted proteomics technique, this study for the first time screens and quantitatively analyzes the expression profile of HSPs in villi and decidua of patients with EMA. The significant down-regulated expressions of HSP90AB1, HSPD1 and HSPA13 are discovered to have a potentially intimate association with the occurrence of EMA. Findings in our study may provide novel potential research targets related to HSPs for the pathogenesis, prevention and treatment of EMA.

This article reports the effects of phosphorus addition on the melting behavior, microstructure, and mechanical properties of Sn3.0Ag0.5Cu solder. The melting behavior of the solder alloys was determined by differential scanning calorimetry. The interfacial microstructure and phase composition of solder/Cu joints were studied by scanning electron microscopy and energy dispersive spectrometry. Thermodynamics of Cu-P phase formation at the interface between Sn3.0Ag0.5Cu0.5P solder and the Cu substrate was characterized. The results indicate that P addition into Sn3.0Ag0.5Cu solder can change the microstructure and cause the appearance of rod-like Cu3P phase which is distributed randomly in the solder bulk. The Sn3.0Ag0.5Cu0.5P joint shows a mixture of ductile and brittle fracture after shear testing. Meanwhile, the solidus temperature of Sn3.0Ag0.5Cu solder is slightly enhanced with P addition.