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1. Step Stress Testing of Receiver/Transmitter Units. Part 2

2. Step Stress Testing of Receiver/Transmitter Units. Part 1

3. Modular C3 Interface Analysis (Flexible Intraconnect). Volume I. Executive Summary

4. Modular C3 Interface Analysis (Flexible Intraconnect). Volume 2. Study Methodology and Results

5. Maintainability Prediction and Analysis Study. Revision A

6. Environmental Stress Screening. Revision A

7. RADC (Rome Air Development Center) Nonelectronic Reliability Notebook. Revision B

8. Stress Screening of Electronic Hardware

9. Electronic Equipment Screening and Debugging Techniques

10. Photolithographic Techniques for Surface Acoustic Wave (SAW) Devices

11. RADC Testability Notebook

12. Manufacturing Methods and Technology for Digital Fault Isolation of Printed Circuit Boards. Appendix

13. ONR/Hughes High Speed Towed Array System (HSTAS)

14. ASIM (Automated Interactive Simulation Modeling System) VAX Version User's Manual.

15. AISIM (Automated Interactive Simulation Model) Installation and Acceptance Test Plans and Procedures.

16. Manufacturing Methods and Technology for Digital Fault Isolation of Hybrid Microelectronic Assemblies.

17. AISIM (Automated Interactive Simulation Modeling System) VAX Version Training Manual.

18. Study and Investigation to Update the Nonelectronic Reliability Notebook. Revision A.

19. Manufacturing Methods and Technology for Digital Fault Isolation of Hybrid Microelectronic Assemblies. Attachment 1. Distributed Software Elements.

20. SAW (Surface Acoustic Wave) Resonator and Reflective Array Devices.

21. Mainbeam Notcher.

22. Development of Heat Pipe Module for Power Semiconductor Cooling.

23. Comparison of State Tables and Ordnance Publications for Troubleshooting Digital Equipment.

24. Electrical Characterization of Microprocessor Memories.

25. Adaptive Tracking System Study.

26. Manufacturing Methods and Technology for Digital Fault Isolation of Printed Circuit Boards.

27. Manufacturing Methods and Technology for Digital Fault Isolation for Printed Circuit Boards.

28. Photolithographic Techniques for Surface Acoustic Wave (SAW) Devices. Volume 4. Technical and Operational Parts 4, 5.

29. Nanosecond Pulsers for MM Wave Tubes.

30. AN/TPQ-37 Transmitter Test Bed.

31. Adaptive Tracking System Study.

32. Methods for Manufacturing Heat Pipes for Circuit Cards.

33. Nanosecond Pulsers for MM Wave Tubes.

34. Validation of Software Reliability Models

35. Reliability Acquisition Cost Study (II)

36. Automated FMEA (Failure Modes and Effects Analysis) Techniques

37. Drone Control and Data Retrieval System (DCDRS). Preliminary Design Study Final Report. Volume II. System Design. Part II. RCC Display/Control Subsystem Design Description.

38. Operation and Performance of an Integrated Helicopter Communication System

39. An Ada (Trademark) Network: A Real-Time Distributed Computer System

40. Millimeter-Wave System EMC Study

41. Registration Techniques for Multiple Sensor Surveillance

42. Adaptive Processor Emulation Development.

43. Automated Interactive Simulation Model (AISIM) VAX Version 5.0 User's Manual.

44. Automated Interactive Simulation Model (AISIM) VAX Version 5.0 Training Manual.

45. Automated Interactive Simulation Model (AISIM) VAX Version 5.0 Version Description Document.

46. Automated Interactive Simulation Model (AISIM) Vax Version 5.0 Acceptance Test Procedures.

47. R&M (Reliability and Maintainability) Program Cost Drivers.

48. AISIM (Automated Interactive Simulation Model) Installation and Acceptance Test Plans and Procedures.

49. Reliability Model Demonstration Study. Volume 2.

50. AISIM (Automated Interactive Simulation Model) User's Manual.

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