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31 results on '"Gurrala, Pavan"'

2. Multiphysics Modelling and Simulation of Hydrogel Membrane for Water Desalination

Author

Gurrala, Pavan Kumar, Trivedi, Ingit, Chaari, Fakher, Series Editor, Gherardini, Francesco, Series Editor, Ivanov, Vitalii, Series Editor, Haddar, Mohamed, Series Editor, Cavas-Martínez, Francisco, Editorial Board Member, di Mare, Francesca, Editorial Board Member, Kwon, Young W., Editorial Board Member, Trojanowska, Justyna, Editorial Board Member, Xu, Jinyang, Editorial Board Member, Tambe, Pankaj, editor, Huang, Peter, editor, and Jhavar, Suyog, editor

Published
2024
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4. An Approach to Identify DeepFakes Using Deep Learning

Author

Gedela, Sai Siddhu, Yanda, Nagamani, Kusumanchi, Hymavathi, Daki, Suvarna, Challa, Keerthika, Gurrala, Pavan, Kacprzyk, Janusz, Series Editor, Gomide, Fernando, Advisory Editor, Kaynak, Okyay, Advisory Editor, Liu, Derong, Advisory Editor, Pedrycz, Witold, Advisory Editor, Polycarpou, Marios M., Advisory Editor, Rudas, Imre J., Advisory Editor, Wang, Jun, Advisory Editor, Abraham, Ajith, editor, Pllana, Sabri, editor, Casalino, Gabriella, editor, Ma, Kun, editor, and Bajaj, Anu, editor

Published
2023
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5. Heat Transfer Enhancement Through Triply Periodic Minimal Surfaces

Author

Baxi, Neel, Patel, Aarya, Gurrala, Pavan Kumar, Chaari, Fakher, Series Editor, Gherardini, Francesco, Series Editor, Ivanov, Vitalii, Series Editor, Cavas-Martínez, Francisco, Editorial Board Member, di Mare, Francesca, Editorial Board Member, Haddar, Mohamed, Editorial Board Member, Kwon, Young W., Editorial Board Member, Trojanowska, Justyna, Editorial Board Member, Bhattacharyya, Suvanjan, editor, Verma, Saket, editor, and Harikrishnan, A. R., editor

Published
2023
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23. Investigation on electroless metallized fused filament fabricated ABS parts.

Author

Trivedi, Achyut and Gurrala, Pavan Kumar

Subjects
ELECTRIC conductivity, FIBERS, ATOM trapping, BINDING sites, HIGH temperatures, COPPER
Abstract

Metallization on plastic has become a handy and popular technique mainly for bringing out the merits of metals to the respective polymer substrate. In the present work, copper electroless metallization is performed, and the effect of deposition temperatures, deposition times, and etching times are examined on additive manufactured specimens. To investigate the effect of etching time, weight measurement of etched samples (5, 15, and 20 min) is performed. The deposition of copper under different conditions is compared as per the Taguchi methodology with the electrical performance and microscopic images. It can be observed from the electrical resistance measurements that conductivity increases and electrical resistance decrease with a higher deposition temperature of 70°C when etched for 20 min and at a lower deposition time of 10 min. The weight measurement results confirm that higher etching time leads to better removal of butadiene due to the creation of more binding sites for metal atoms resulting in better copper metallization. Additionally, at higher deposition temperatures, more metal atoms are trapped in the polymer substrate, thereby increasing the extent of metallization. The results confirm with the microscopic images that metallization at higher deposition temperature, higher etching time, and lower deposition time exhibits better copper deposition. [ABSTRACT FROM AUTHOR]

Published
2023
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