1. Jet Electrochemical Micromachining of Micro-Grooves with Conductive-Masked Porous Cathode
- Author
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Guochao Fan, Xiaolei Chen, Krishna Kumar Saxena, Jiangwen Liu, and Zhongning Guo
- Subjects
micro-groove ,electrochemical machining ,porous cathode ,conductive mask ,machining localization ,dimensional uniformity ,Mechanical engineering and machinery ,TJ1-1570 - Abstract
Surface structures with micro-grooves have been reported to be an effective way for improving the performance of metallic components. Through-mask electrochemical micromachining (TMEMM) is a promising process for fabricating micro-grooves. Due to the isotropic nature of metal dissolution, the dissolution of a workpiece occurs both along the width and depth. Overcut is generated inevitably with increasing depth, which makes it difficult to enhance machining localization. In this paper, a method of electrochemical machining using a conductive masked porous cathode and jet electrolyte supply is proposed to generate micro-grooves with high machining localization. In this configuration, the conductive mask is directly attached to the workpiece, thereby replacing the traditional insulated mask. This helps in achieving a reduction in overcut and an improvement in machining localization. Moreover, a metallic nozzle is introduced to supply a jetted electrolyte in the machining region with enhanced mass transfer via a porous cathode. The simulation and experimental results indicate that as compared with an insulated mask, the use of a conductive mask weakens the electric field intensity on both sides of machining region, which is helpful to reduce overcut and enhance machining localization. The effect of electrolyte pressure is investigated for this process configuration, and it has been observed that high electrolyte pressure enhances the mass transfer and improves the machining quality. In addition, as the pulse duty cycle is decreased, the dimensional standard deviation and roughness of the fabricated micro-groove are improved. The results suggest the feasibility and reliability of the proposed method.
- Published
- 2020
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