25 results on '"Groeger, Philip"'
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2. An alternative to M+3S overlay dispositioning metric: number-of-dies-within-spec
3. Focus spot monitoring: design of an automatable detection, classification, and impact analysis pipeline
4. Development of novel focus spot detection methods for high-volume manufacturing
5. Quantifying CD-SEM contact hole roughness and shape combined with machine learning-based pattern fidelity scores for process optimization and monitoring
6. An in-depth look at comprehensive and efficient methodology for CD uniformity budget breakdown
7. Advanced CD uniformity correction using radial basis function (RBF) models
8. Quantifying CD-SEM contact hole roughness and shape combined with machine learning-based pattern fidelity scores for process optimization and monitoring
9. Optimizing focus and dose process windows for robust process control using a multi-feature analysis
10. Real-time full-wafer design-based inter-layer virtual metrology
11. Focus leveling improvement using optimized wafer edge settings
12. CD and OCD sampling scheme optimization for HVM environment
13. Focus budget improvement using optimized wafer edge settings
14. Focus budget improvement using optimized wafer edge settings.
15. Optimizing focus and dose process windows for robust process control using a multi-feature analysis
16. Development of novel focus spot detection methods for high-volume manufacturing.
17. Focus spot monitoring: design of an automatable detection, classification, and impact analysis pipeline.
18. CD and OCD sampling scheme optimization for HVM environment
19. Focus budget improvement using optimized wafer edge settings
20. Focus spot monitoring: design of an automatable detection, classification, and impact analysis pipeline
21. Development of novel focus spot detection methods for high-volume manufacturing
22. Advanced CD uniformity correction using radial basis function (RBF) models.
23. Advanced CD uniformity correction using radial basis function (RBF) models
24. Optimizing focus and dose process windows for robust process control using a multi-feature analysis.
25. Real-time full-wafer design-based inter-layer virtual metrology.
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