183 results on '"Gourlay, C.M."'
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2. Eutectic solidification in Mg-9Al-0.7Zn: From divorced to coupled growth
3. Al–Mn–Fe intermetallic formation in AZ91 magnesium alloys: Effects of impurity iron
4. Growth twinning and morphology of Al45Cr7 and Al13Fe4
5. Al11Mn4 formation on Al8Mn5 during the solidification and heat treatment of AZ-series magnesium alloys
6. Al2MgC2 and AlFe3C formation in AZ91 Mg alloy melted in Fe-C crucibles
7. In-situ X-ray radiography of twinned crystal growth of primary Al13Fe4
8. Rheological transitions in semi-solid alloys: In-situ imaging and LBM-DEM simulations
9. Solidification orientation relationships between Al3Ti and TiB2
10. Mechanisms of beta-Sn nucleation and microstructure evolution in Sn-Ag-Cu solders containing titanium
11. Semi-solid deformation of Al-Cu alloys: A quantitative comparison between real-time imaging and coupled LBM-DEM simulations
12. Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni
13. Nucleation and growth crystallography of Al8Mn5 on B2-Al(Mn,Fe) in AZ91 magnesium alloys
14. Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds
15. Competition between stable and metastable eutectic growth in Sn-Ni alloys
16. AlSi2Sc2 intermetallic formation in Al-7Si-0.3Mg-xSc alloys and their effects on as-cast properties
17. Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn
18. Grain refinement of electronic solders: The potential of combining solute with nucleant particles
19. Nucleation, grain orientations, and microstructure of Sn-3Ag-0.5Cu soldered on cobalt substrates
20. Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints
21. Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections
22. Dilatancy in semi-solid steels at high solid fraction
23. Nucleation of tin on the Cu6Sn5 layer in electronic interconnections
24. Reaction-induced surface reconstruction of silver in contact with zirconium
25. Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders
26. Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles
27. Thermal etching of silver: Influence of rolling defects
28. Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys
29. Heterogeneous nucleation of Cu6Sn5 in Sn–Cu–Al solders
30. Pore behaviour during semi-solid alloy compression: Insights into defect creation under pressure
31. Heterogeneous nucleation of βSn on NiSn4, PdSn4 and PtSn4
32. In situ study of granular micromechanics in semi-solid carbon steels
33. Role of Fe impurities in the nucleation of metastable NiSn4
34. Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process
35. NiSn4 formation during the solidification of Sn–Ni alloys
36. Exploring dendrite coherency with the discrete element method
37. Kinetics of the η–η′ transformation in Cu 6Sn 5
38. Direct observation of deformation in semi-solid carbon steel
39. Granular deformation mechanisms in semi-solid alloys
40. In situ investigation of unidirectional solidification in Sn–0.7Cu and Sn–0.7Cu–0.06Ni
41. Dilatancy and rheology at 0–60% solid during equiaxed solidification
42. Formation of the surface layer in hypoeutectic Al-alloy high-pressure die castings
43. Development of shear bands during deformation of partially solid alloys
44. Agglomeration and bending of equiaxed crystals during solidification of hypoeutectic Al and Mg alloys
45. The thickness of defect bands in high-pressure die castings
46. Shear mechanisms at 0–50% solid during equiaxed dendritic solidification of an AZ91 magnesium alloy
47. Feeding Mechanisms in High-Pressure Die Castings
48. The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys
49. Defect Band Characteristics in Mg-Al and Al-Si High-Pressure Die Castings
50. A rheological assessment of the effect of trace level Ni additions on the solidification of Sn–0.7Cu
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