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The thermal and chemical stability of potential dielectrics for GaN-based devices in a GaN metal organic chemical vapor deposition (MOCVD) environment is investigated, and their suitability for use as a gate dielectric and as a regrowth mask for the selective area growth of GaN is discussed. Thin films of MgO, Sc2O3, and Sc2O3/MgO were grown by molecular beam epitaxy on GaN/sapphire substrates and then annealed in a MOCVD reactor under GaN growth conditions except for the lack of trimethylgallium. All films were processed into metal-oxide-semiconductor diodes and were characterized before and after being annealed using atomic force microscopy, x-ray reflectivity, x-ray photoelectron spectroscopy, current-voltage (I-V), and capacitance-voltage (C-V) measurements. The Gibbs free energy of all possible reactions was calculated, and their probability and possible influence on the characterization results is examined. After being annealed, the atomic force microscopy of the oxide films showed some degree of roughening for all of them. Despite the surface roughening, all the oxide films examined showed potential for use as a regrowth mask. The MOCVD anneal caused the electrical properties of the MgO film to degrade considerably, and the Sc2O3 films were unable to be electrically characterized after annealing due to shorting, which is believed to be caused by the formation of a ScN layer on the surface. The effect of the thickness of the Sc2O3 cap for MgO films was investigated. The characterization results indicate that the Sc2O3 film dissolved into MgO during annealing and that a ScN film did not form on the surface. Of all the oxide films examined in this study, the Sc2O3/MgO stack with the thinner Sc2O3 cap exhibited the greatest stability with respect to its electrical properties. [ABSTRACT FROM AUTHOR]

The wide-bandgap ternary (AlxGa1−x)2O3 forms a heterostructure system with Ga2O3 that is attracting attention for modulation-doped field-effect transistors. The options for gate dielectric on (AlxGa1−x)2O3 are limited by the need for adequate band offsets at the heterointerface. Al2O3 deposited by atomic layer deposition (ALD) is one option due to its large bandgap (6.9 eV). We measured the valence-band offset at the Al2O3/(Al0.14Ga0.86)2O3 heterointerface using x-ray photoelectron spectroscopy (XPS). Al2O3 was deposited by ALD onto single-crystal β-(Al0.14Ga0.86)2O3 (bandgap 5.0 eV) grown by molecular beam epitaxy (MBE). The valence-band offset was determined to be 0.23 ± 0.04 eV (straddling gap, type I alignment) for ALD Al2O3 on β-(Al0.14Ga0.86)2O3. The conduction-band offset was 1.67 ± 0.30 eV, providing good electron confinement. [ABSTRACT FROM AUTHOR]

The (AlxGa1−x)2O3/Ga2O3 system is attracting attention for heterostructure field effect transistors. An important device design parameter is the choice of gate dielectric on the (AlxGa1−x)2O3 and its band alignment at the heterointerface. The valence band offset at the SiO2/(Al0.14Ga0.86)2O3 heterointerface was measured using x-ray photoelectron spectroscopy. The SiO2 was deposited by atomic layer deposition (ALD) onto single-crystal β-(Al0.14Ga0.86)2O3 grown by molecular beam epitaxy. The bandgap of the SiO2 was determined by reflection electron energy loss spectroscopy as 8.7 eV, while high resolution XPS data of the O 1s peak and onset of elastic losses were used to establish the (Al0.14Ga0.86)2O3 bandgap as 5.0 eV. The valence band offset was determined to be 1.60 ± 0.40 eV (straddling gap, type I alignment) for ALD SiO2 on β-(Al0.14Ga0.86)2O3. The conduction band offset was 2.1 ± 0.08 eV, providing for a strong electron transport restriction. [ABSTRACT FROM AUTHOR]

Thin films of copper iodide (CuI) were grown on (-201) bulk Ga2O3 and (010) epitaxial (Al0.14Ga0.86)2O3 using a copper film iodination reaction method. The valence band offsets for these heterostructures were measured by X-ray photoelectron spectroscopy (XPS). High resolution XPS data of the O 1s peak and onset of elastic losses were used to establish the (Al0.14Ga0.86)2O3 bandgap to be 5.0 ± 0.30 eV. The valence band offsets were −0.25 eV ± 0.07 eV and 0.05 ± 0.02 eV for CuI on Ga2O3 or (Al0.14Ga0.86)2O3, respectively. The respective conduction band offsets were 1.25 ± 0.25 eV for Ga2O3 and 1.85 ± 0.35 eV for (Al0.14Ga0.86)2O3. Thus, there is a transition from type-II to type-I alignment as Al is added to β-Ga2O3. The low valence band offsets are ideal for hole transport across the heterointerfaces. [ABSTRACT FROM AUTHOR]

Thin-film transistors (TFTs) with channels made of hydrogenated amorphous silicon (a-Si:H) and polycrystalline silicon (poly-Si) are used extensively in the display industry. Amorphous silicon continues to dominate large-format display technology, but a-Si:H has a low electron mobility,μ ∼ 1 cm2/V s. Transparent, conducting metal-oxide materials such as Indium-Gallium-Zinc Oxide (IGZO) have demonstrated electron mobilities of 10-50 cm2/V s and are candidates to replace a-Si:H for TFT backplane technologies. The device performance depends strongly on the type of band alignment of the gate dielectric with the semiconductor channel material and on the band offsets. The factors that determine the conduction and valence band offsets for a given material system are not well understood. Predictions based on various models have historically been unreliable and band offset values must be determined experimentally. This paper provides experimental band offset values for a number of gate dielectrics on IGZO for next generation TFTs. The relationship between band offset and interface quality, as demonstrated experimentally and by previously reported results, is also explained. The literature shows significant variations in reported band offsets and the reasons for these differences are evaluated. The biggest contributor to conduction band offsets is the variation in the bandgap of the dielectrics due to differences in measurement protocols and stoichiometry resulting from different deposition methods, chemistry, and contamination. We have investigated the influence of valence band offset values of strain, defects/vacancies, stoichiometry, chemical bonding, and contamination on IGZO/dielectric heterojunctions. These measurements provide data needed to further develop a predictive theory of band offsets. [ABSTRACT FROM AUTHOR]

Thin-film transistors (TFTs) with channels made of hydrogenated amorphous silicon (a-Si:H) and polycrystalline silicon (poly-Si) are used extensively in the display industry. Amorphous silicon continues to dominate large-format display technology, but a-Si:H has a low electron mobility,μ ∼ 1 cm2/V s. Transparent, conducting metal-oxide materials such as Indium-Gallium-Zinc Oxide (IGZO) have demonstrated electron mobilities of 10-50 cm2/V s and are candidates to replace a-Si:H for TFT backplane technologies. The device performance depends strongly on the type of band alignment of the gate dielectric with the semiconductor channel material and on the band offsets. The factors that determine the conduction and valence band offsets for a given material system are not well understood. Predictions based on various models have historically been unreliable and band offset values must be determined experimentally. This paper provides experimental band offset values for a number of gate dielectrics on IGZO for next generation TFTs. The relationship between band offset and interface quality, as demonstrated experimentally and by previously reported results, is also explained. The literature shows significant variations in reported band offsets and the reasons for these differences are evaluated. The biggest contributor to conduction band offsets is the variation in the bandgap of the dielectrics due to differences in measurement protocols and stoichiometry resulting from different deposition methods, chemistry, and contamination. We have investigated the influence of valence band offset values of strain, defects/vacancies, stoichiometry, chemical bonding, and contamination on IGZO/dielectric heterojunctions. These measurements provide data needed to further develop a predictive theory of band offsets. [ABSTRACT FROM AUTHOR]