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261 results on '"Ghodssi, R."'

3. Design, Microfabrication and Characterization of a Power Delivery System for new Biomedical Applications

Author

Massimo CARUSO, Ghodssi, R., Kim, Y. W., Miceli, R., Caruso, M., Ghodssi, R., Kim, Y., and Miceli, R.

Subjects
biomedical applications, SAW sensor, Biomedical application, Microcoil, lcsh:Electrical engineering. Electronics. Nuclear engineering, Electrical and Electronic Engineering, Settore ING-IND/32 - Convertitori, Macchine E Azionamenti Elettrici, lcsh:TK1-9971, microfabrication
Abstract

This paper presents the design, microfabrication and characterization of a wireless power delivery system capable of driving a surface acoustic wave sensor (SAW) for biomedical applications. The system consists of two planar, spiral-square microcoils, which have been geometrically optimized in order to maximize the quality factor Q. The integration of the SAW - microcoil system into artificial implant sites will allow a real-time biofilm growth monitoring and treatment, providing countless advantages to the related medical applications.

Published
2017

7. MULTIMODAL INTELLIGENT TRANSWELL SYSTEM

Author

Ramiah Rajasekaran, P., primary, Chapin, A.A., additional, Quan, D.N., additional, Jang, S.-H., additional, Hu, L., additional, Herberholz, J., additional, Bentley, W.E., additional, and Ghodssi, R., additional

Published
2018
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11. The binding effect of proteins on medications and its impact on electrochemical sensing : Antipsychotic clozapine as a case study

Author

Banis, G. E., Winkler, Thomas, Barton, P., Chocron, S. E., Kim, E., Kelly, D. L., Payne, G. F., Ben-Yoav, H., Ghodssi, R., Banis, G. E., Winkler, Thomas, Barton, P., Chocron, S. E., Kim, E., Kelly, D. L., Payne, G. F., Ben-Yoav, H., and Ghodssi, R.

Abstract

Clozapine (CLZ), a dibenzodiazepine, is demonstrated as the optimal antipsychotic for patients suffering from treatment-resistant schizophrenia. Like many other drugs, understanding the concentration of CLZ in a patient’s blood is critical for managing the patients’ symptoms, side effects, and overall treatment efficacy. To that end, various electrochemical techniques have been adapted due to their capabilities in concentration-dependent sensing. An open question associated with electrochemical CLZ monitoring is whether drug–protein complexes (i.e., CLZ bound to native blood proteins, such as serum albumin (SA) or alpha-1 acid-glycoprotein (AAG)) contribute to electrochemical redox signals. Here, we investigate CLZ-sensing performance using fundamental electrochemical methods with respect to the impact of protein binding. Specifically, we test the activity of bound and free fractions of a mixture of CLZ and either bovine SA or human AAG. Results suggest that bound complexes do not significantly contribute to the electrochemical signal for mixtures of CLZ with AAG or SA. Moreover, the fraction of CLZ bound to protein is relatively constant at 31% (AAG) and 73% (SA) in isolation with varying concentrations of CLZ. Thus, electrochemical sensing can enable direct monitoring of only the unbound CLZ, previously only accessible via equilibrium dialysis. The methods utilized in this work offer potential as a blueprint in developing electrochemical sensors for application to other redox-active medications with high protein binding more generally. This demonstrates that electrochemical sensing can be a new tool in accessing information not easily available previously, useful toward optimizing treatment regimens., QC 20220426

Published
2017
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12. Power Mems and Microengines

Author

Epstein, A. H., primary, Senturia, S. D., primary, Anathasuresh, G., primary, Ayon, A., primary, Breuer, K., primary, Chen, K-S., primary, Ehrich, F. E., primary, Gauba, G., primary, Ghodssi, R., primary, and Groshenry, C., primary

Published
1997
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25. Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2009)

Author

Bourouina, Tarik, Courtois, B., Ghodssi, R., Karam, J.M., Soma, A., Yang, H.Y., Electronique, Systèmes de communication et Microsystèmes (ESYCOM), Conservatoire National des Arts et Métiers [CNAM] (CNAM)-Université Paris-Est Marne-la-Vallée (UPEM)-ESIEE Paris, Circuits Multi-Projets (CMP), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Centre National de la Recherche Scientifique (CNRS), Dept. of Electrical and Computer Engineering, Memscap, MEMSCAP, Department of Mechanics, Politecnico di Torino = Polytechnic of Turin (Polito), Center of Nanoscience and Nanotechnology, National Chung Hsing University (NCHU), EDA Publishing Association, Conservatoire National des Arts et Métiers [CNAM] (CNAM), and HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-Université Paris-Est Marne-la-Vallée (UPEM)-ESIEE Paris

Subjects
Signal processing, Failure analysis, Physical measurements, Technology CAD in general, Dimensional measurements, Characterization, Structured design methodologies, Assembly technologies, Numerical simulation, actuators, Process integration between MEMS and electronics, Test structures, Interoperability of CAD/CAE tools, Integrated CAD tools, Failure mechanisms, Devices and components (sensors, micromolding), Languages for interchange data among designs and tools, Packaging for harsh environments, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, Materials, Non destructive evaluation, MOEMS packaging, Mechanical simulation, Thermal evaluation, RF and microwave packaging, Reliability, Microlithography issues unique to MEMS/MOEMS, Modeling and simulation of fabrication processes, Yield estimation, Manufacturing, PACS 85.42, Fault simulation and test pattern generation, Process monitoring, Model order reduction, Fault modeling, Integrated processes (micromachining, MEMS/MOEMS libraries and IP, actuators), Multiphysics simulation
Abstract

ISBN: 978-2-35500-009-6; This Symposium is a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland and in 2006 and in 2007 in Stresa, Italy and in 2008 in Nice, France. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. We hope you enjoy the technical presentations of 2 conferences - CAD, Design and Test / Microfabrication, Integration and Packaging -, of 2 joint invited talks, and of a special session on 3D Integration of MEMS.

Published
2009

35. Advanced Techniques in 3D Photolithography for MEMS

Author

MARYLAND UNIV COLLEGE PARK DEPT OF ELECTRICAL AND COMPUTER ENGINEERING, Mosher, L. A., Morgan, B. C., Waits, C. M., Ghodssi, R., MARYLAND UNIV COLLEGE PARK DEPT OF ELECTRICAL AND COMPUTER ENGINEERING, Mosher, L. A., Morgan, B. C., Waits, C. M., and Ghodssi, R.

Abstract

Three dimensional (3D) MEMS fabrication is essential to many power MEMS applications important to today's soldier. We present two advanced techniques to realize 3D structures in photoresist. Both technologies are based on gray-scale photolithography, which is a method to modulate the light intensity incident on photoresist to control the development rate. We compare a commercial technique, HEBS glass, to a technique developed in-house called double-exposure gray-scale. HEBS glass has a better horizontal resolution and is more suited to small structures that require high vertical resolution. Double exposure gray-scale technology has a comparable vertical resolution to HEBS glass, but is better suited to large MEMS structures over 100 m., See also ADM002075., The original document contains color images.

Published
2006

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