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Background. Measuring the degree of deformation of solids is a necessary measure in many fields of science. Such measurements can be performed using sensor equipment containing resistance strain gauges. This type of sensor uses a special type of resistor called a resistance strain gauge. Various methods for incorporating these electronic components into a strain gauge circuit are given. Materials and methods. Using linear equations, numerical characteristics were calculated for different switching options, for example, the sensitivity of the sensor. Results and conclusions. The schemes for including different numbers of active and compensating strain gauges in a measuring bridge are considered. For different types of deformation it is necessary to use suitable switching methods, this must be taken into account when designing information-measuring and control systems.

Background. The study of electronic equipment in the field of the impact of vibration load on it does not cease to be relevant for complex systems with high-speed electronic equipment. Printed circuit board manufacturing technologies, and the printed circuit board itself, currently represents a well-established production mechanism, as a result of which a high-quality product in the form of printed circuit boards is obtained. But despite the high degree of reliability of electronic equipment, and in particular its component part, as a printed circuit board, when certain conditions of external influencing factors occur, there is a high chance of its failure due to the occurrence of critical deformations and mechanical stresses in the design of the printed circuit board. In this regard, there is a problem of taking into account critical deformations in the design of the printed circuit board when certain (harsh) conditions of external influencing factors occur and developing ways to analyze, prevent and improve the design of the printed circuit board. Materials and methods. The paper uses methods and methods of mathematical, simulation, algorithmic and software analysis and calculation of critical deformations taking into account mechanical stresses in typical PCB designs to increase its mechanical strength. Results. Models and methods of modeling electronic equipment designs have been improved to improve accuracy and reliability prediction. Conclusions. The refined mathematical and simulation models of calculation of mechanical stresses and displacements of the printed circuit board, the algorithm of application of the refined mathematical model, the program of calculation of the clarifying coefficient are developed.