1. Gold soldering in microelectronic products with tin–indium solder
- Author
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I. U. Smurov, A. T. Kosilov, V. V. Zenin, and G. L. Polner
- Subjects
Materials science ,business.industry ,Metallurgy ,Gold coating ,chemistry.chemical_element ,Integrated circuit ,Condensed Matter Physics ,law.invention ,chemistry ,Dip soldering ,law ,Soldering ,Microelectronics ,General Materials Science ,Composite material ,Tin ,business ,Indium ,Holding time - Abstract
The results of research into the interaction of 0.04 mm diameter gold microwire with STI50 solder have been presented when soldering hybrid integrated circuits and microassemblies on printed boards. The dependence of dissolving of gold wire on the temperature and duration of soldering has been established as well as on holding time at a seam temperature of 100 ° C; the interaction of STI50 solder with gold coating on UHF and HIC boards has been considered when soldering on metallic substrates.
- Published
- 2004
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