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Rotating prism-pair scanning is a conventional method used to achieve large angles with a straight-line configuration. A disadvantage of prism scanners for line scanning is that the sinusoidal scan produces a non-linear image. We use a laser-diode encoding technique to carry out real-time image linearization in a rotating prism-pair scanning system. In this study, we report on the results obtained in a thermal image system.

Effective primary design can avoid over-specification that will cause waste on cost. In this work, we propose a relatively simple procedure to rapid and reasonably write specifications, design systems and analyze requirements. The IR imager primary system design and analysis concepts adopt here are described. By using the primary design and analysis concept to cope with system performance models and PC based scientific spreadsheet to construct a mathematical software package which provides a costefficient, compliant solution to a design problem and predict thermal imager performance to an analysis problem. An illustrative example is presented to express more detail specifically due to the uncooled IR imager.

In this work, the 30 stacked InAs/GaAs quantum dot infrared photodetector (QDIP) structure was grown by solid-source molecular beam epitaxy technique and demonstrated with dual-band mid- (2.7~5.6μm) and long- (7.5~13.5μm) wavelength normal-incident detections without grating and passivated process for 256×256 FPA. The 256 ×256 QDIP FPA hybridized with snapshot-mode ROIC was mounted in a 68 pin leadless ceramic chip carrier which was put in the testing dewar with IR optical cold spectral filters of the 2.9~5.5μm and 6.5~14.5 μm for the dual-band IR detections, respectively. The testing scheme for thermal imaging uniformity of the InAs/GaAs QDIP focal plane array (FPA) has been proposed and calibrated using a plane-typed blackbody source of a high temperature of 373±1K and lower ambient temperature for the two-point temperature correction. The averaged of specific detectivity (D*) and operability of the QDIP FPA have reached 1.5×10 10 cm-Hz 1/2 /W and 99% at 80K, respectively. The dominant noise equivalent temperature differences (NEDT) of typical figure of merit for QDIP thermal imaging module operated under the temperature of 80K, device biases of -0.7 V and integration time of 32ms with infrared optics and two-point temperature correction (T L =R.T. and T H = 200 °C) are 1.065 K (mid-wavelength IR) and 131mK (long-wavelength IR), respectively. Meanwhile, it is worth to note that these are the first confirmation for dual-band detections of FPA from direct InAs quantum dots matrix embedded in GaAs heterostructure. In the future, the dual-band IR QDIP FPA will become one of the important candidates for hyper-spectral detection and thermal imaging fusion application.

Electronic and optical properties of ideal and real quantum dots (QDs) are extensively studied and derived for the recent decade. Strain caused by the differences of the lattice constants of dot and wetting, barrier materials are decisive for both the self-assembly mechanisms and the electro-optical properties. The research is mainly investigated for realizing the strain effects on the optical properties of InAs/GaAs self-assembled QDs embedded in GaAs barrier layer incorporated with the three-dimensional (3D) Schordinger equation and solved by using finite element method (FEM). From 3D QD geometrical profiles establishing by the spatially geometric equations, the confined electron and hole bandstructures on altering sized lens and pyramidal shape-like QDs with numerical calculations and strained heterostructure of the finite element approximations have been proposed. Applying the fast FEM models, it is demonstrated that the correspondence of ground, excited eigenstates, the probability of density function (|Ψ| 2 ) of the confined levels from the single InAs QD to a matrix of nine QDs to obtain the transition energy and coordinated absorption wavelength to be predicted and summarized clearly. Through calculating energy levels within the conduction and valence band edge confinement on the InAs/GaAs heterostructure with FEM to contradistinguish with corrected to optical transitions and linear absorption spectra can be achieved for verifying to being the specific wavelengths from photoluminescence (PL) and photoresponse (PR) measurements for quantum dot infrared photodetector. By fitting the energy differences among the subbands, the geometrical shape and size of QD can be predicted. Inducting the tendency from single QD to the matrix of 9 QDs, the step-wise bands have been obtained being some regularity clearly. And from the transmission electron microscope (TEM) measurement, the dominant sizes of QDs in the really grown wafer remain the consistent with the numerical analyses applied in 3D QD profile that is interpreted using spatially geometric equations.

In this work, a new improved FEM approach is described for analyzing strain distributions, computing electronic structure, and simulating the optical property of InAs/GaAs self-assembled quantum dot. A window-based software FEMLAB has been employed for multiphysics simulation. This approach can be used as a guideline for fast quantum-dot device structure design, especially in quantum dot lasers and quantum dot infrared photodetectors. Furthermore, the proposed approach and model could be used to develop three-dimensional nano-device simulator with further specific device module.

This paper presents the design and performance of Chung Shan Institute of Science and Technology newest man-portable infrared imaging system, the Seagle-1. The thermal imager is designed for day and night long-range observation and forward reconnaissance and surveillance applications. The camera system achieves an NETD equals 0.067 K at 30 Hz frame rate with f/1.8 optics (300 K background). The design and performance of the 256 X 244 PtSi infrared camera will be described in this paper.© (2000) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

The importance of the thermal image system increases rapidly. Uncooled thermal imagers offer the advantages of room temperature operation, light weight, small size, low power requirements, simplified logistics and increased reliability. In this work, we propose a relatively simple procedure which can reasonably write specifications and design systems with higher speed. The first order design is coped with system performance models and PC based scientific spreadsheet, a mathematical software package constructs to provide a cost-effective, compliant solution to a design problem. An illustrative example is presented to show the details.

In this paper, a process of controlling the size of silicon (Si) quantum dots in SiO2 layers by Si+ implantation and rapid thermal annealing (RTA) is proposed. Through the proposed process, nanoscale Si islands in the range of 2–5 nm have been generated and then analyzed by various techniques including photoluminescence (PL) analysis, atomic force microscopy (AFM), and transmission electron microscopy (TEM). The characterization results are consistent with the results of theoretical computation based on the quantum confinement model by the finite-element method (FEM). The proposed process and results will be helpful in developing single-electron devices.