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Lynx is a proposed NASA X-Ray telescope flight mission aimed at achieving state-of-the-art angular and energy resolution with a 100 kilopixel array to probe the hot energetic young universe in unprecedented detail. To achieve these goals, our team plans on leveraging our current work in development of the focal plane for the Athena X-Ray Integral Field Unit (X-IFU) while advancing the state-of-the-art in transition edge sensor (TES) X-ray detector technology. The TES is an optimal technology for achieving both high energy and fine angular resolution at the same time because pixel features can be made extremely small and the absorber which dominates the heat capacity can be tuned to meet resolution requirements. Specifically, the proposed mission concept calls for a hybrid detector of three different arrays fabricated in the same planar process in one focal plane and optimized for different science goals. The main arrays consist of 5x5 hydras, 25 pixels of 4 micron thick Au absorbers each with a different thermal link to one common TES. The outer array has absorbers on a 50-micron pitch for most of the 5 arc-minute field-of-view, and the inner array has 25-micron absorbers for the central 1 arc-minute region. A high resolution array consisting of single pixel 1 micron thick Au absorbers on 50-micron pitch will lie off to the side. Reading out an array of this magnitude will likely require improvements in indium bump bonding to superconducting flexible wiring. Fabrication of absorbers of two different sizes requires electroplating through a photoresist mold by careful tuning of the current density to achieve uniform flat absorbers on a fine pitch scale, followed by ion milling to yield narrow streets separating the pixels while preserving high quantum efficiency. We report on progress made at fabricating the hybrid array with different absorber sizes and thicknesses. Further, we also report on ongoing work to adequately heat sink the pixels with backside wire bonding and copper coating. We also report on work to improve detector pixel yield and top side indium bump bonding to flexible wiring.

Lynx, one of the four mission concepts under consideration for the next Astrophysics DecadalReview, will include a microcalorimeter array consisting of more than 100,000 pixels in a compact arrangement with absorber pitch as small as 25 microns. In order to realize the desired array scale, fine-pitch multi-level superconducting wiring with high yield, compatible with rapid expansion of our hydra absorber designs, is essential. We have demonstrated a method of integrating transition edge sensor (TES) microcalorimeters with suitable multilevel buried wiring, fabricated at MIT Lincoln Laboratory using advanced tools dedicated to superconducting circuit fabrication. The TES Mo/Au bilayer is deposited on a high-quality oxide surface created by chemical-mechanical polishing, allowing tight specifications on the TES superconducting transition and link conductivity to be achieved even though the process order has been inverted. The TESs contact the top-level niobium wiring through vias etched through silicon dioxide down to the topmost wiring layer. The article discusses the overall fabrication process, as wellas the behavior of sensors with different via designs, proximity structures, and lateral sizes. An initial iteration of the integrated fabrication process indicates that microcalorimeters fabricated in this way should meet mission specifications using a Mo/Au bilayer with a reasonable critical temperature below 100 mK.

Multi-pixel transition-edge sensors (TESs), commonly referred to as 'hydras', are a type of position sensitive micro-calorimeter that enables very large format arrays to be designed without commensurate increase in the number of readout channels and associated wiring. In the hydra design, a single TES is coupled to discrete absorbers via varied thermal links. The links act as low pass thermal filters that are tuned to give a different characteristic pulse shape for x-ray photons absorbed in each of the hydra sub pixels. In this contribution we report on the experimental results from hydras consisting of up to 20 pixels per TES. We discuss the design trade-offs between energy resolution, position discrimination and number of pixels and investigate future design optimizations specifically targeted at meeting the readout technology considered for Lynx.

We have been developing superconducting transition-edge sensor (TES) microcalorimeters for a variety of potential astrophysics missions, including Athena. The X-ray Integral Field Unit (X-IFU) instrument on this mission requires close-packed pixels on a 0.25 mm pitch, and high quantum efficiency between 0.2 and 12 keV. The traditional approach within our group has been to use square TES bilayers on molybdenum and gold that are between 100 and 140 microns in size, deposited on silicon nitride membranes to provide a weak thermal conductance to a 50 mK heat bath temperature. It has been shown that normal metal stripes on top of the bilayer are needed to keep the unexplained noise at a level consistent with the expected based upon estimates for the non-equilibrium non-linear Johnson noise.In this work we describe a new approach in which we use a square TES bilayer that is 50 microns in size. While the weak link effect is much stronger in this size of TES, we have found that excellent spectral performance can be achieved without the need for any normal metal strips on top of the TES. A spectral performance of 1.58 eV at 6 KeV has been achieved, the best resolution seen in any of our devices with this pixel size. The absence of normal metal stripes has led to more uniform transition shapes, and more reliable excellent spectral performance. The smaller TES size has meant that that the thermal conductance to the heat bath, determined by the perimeter length of the TES and the membrane thickness, is lower than on previous devices, and thus has a lower count rate capability. This is an advantage for low count-rate applications where the slower speed enables easier multiplexing in the read-out, thus potential higher multiplexing factors. In order to recover the higher count rate capabilities, a potential path exits using thicker silicon nitride membranes to increase the thermal conductance to the heat bath.

The X-ray integrated field unit (X-IFU) in European Space Agency's (ESA's) Athena mission will be the first high-resolution X-ray spectrometer in space using a large-format transition-edge sensor microcalorimeter array. Motivated by optimization of detector performance for X-IFU, we have conducted an extensive campaign of parametric characterization on transition-edge sensor (TES) detectors with nominal geometries and physical properties in order to establish sensitivity trends relative to magnetic field, dc bias on detectors, operating temperature, and to improve our understanding of detector behavior relative to its fundamental properties such as thermal conductivity, heat capacity, and transition temperature. These results were used for validation of a simple linear detector model in which a small perturbation can be introduced to one or multiple parameters to estimate the error budget for X-IFU. We will show here results of our parametric characterization of TES detectors and briefly discuss the comparison with the TES model.

We develop superconducting transition-edge sensor (TES) microcalorimeter focal planes for versatility in meeting the specifications of X-ray imaging spectrometers, including high count rate, high energy resolution, and large field of view. In particular, a focal plane composed of two subarrays: one of fine pitch, high count-rate devices and the other of slower, larger pixels with similar energy resolution, offers promise for the next generation of astrophysics instruments, such as the X-ray Integral Field Unit Instrument on the European Space Agencys ATHENA mission. We have based the subarrays of our current design on successful pixel designs that have been demonstrated separately. Pixels with an all-gold X-ray absorber on 50 and 75 micron pitch, where the Mo/Au TES sits atop a thick metal heatsinking layer, have shown high resolution and can accommodate high count rates. The demonstrated larger pixels use a silicon nitride membrane for thermal isolation, thinner Au, and an added bismuth layer in a 250-sq micron absorber. To tune the parameters of each subarray requires merging the fabrication processes of the two detector types. We present the fabrication process for dual production of different X-ray absorbers on the same substrate, thick Au on the small pixels and thinner Au with a Bi capping layer on the larger pixels to tune their heat capacities. The process requires multiple electroplating and etching steps, but the absorbers are defined in a single-ion milling step. We demonstrate methods for integrating the heatsinking of the two types of pixel into the same focal plane consistent with the requirements for each subarray, including the limiting of thermal crosstalk. We also discuss fabrication process modifications for tuning the intrinsic transition temperature (T(sub c)) of the bilayers for the different device types through variation of the bilayer thicknesses. The latest results on these 'hybrid' arrays will be presented.

A paper describes the Thermal Infrared Sensor (TIRS), a QWIP-based instrument intended to supplement the Operational Land Imager (OLI) for the Landsat Data Continuity Mission (LDCM). The TIRS instrument is a far-infrared imager operating in the pushbroom mode with two IR channels: 10.8 and 12 microns. The focal plane will contain three 640x512 QWIP arrays mounted on a silicon substrate. The silicon substrate is a custom-fabricated carrier board with a single layer of aluminum interconnects. The general fabrication process starts with a 4-in. (approx.10-cm) diameter silicon wafer. The wafer is oxidized, a single substrate contact is etched, and aluminum is deposited, patterned, and alloyed. This technology development is aimed at incorporating three large-format infrared detecting arrays based on GaAs QWIP technology onto a common focal plane with precision alignment of all three arrays. This focal plane must survive the rigors of flight qualification and operate at a temperature of 43 K (-230 C) for five years while orbiting the Earth. The challenges presented include ensuring thermal compatibility among all the components, designing and building a compact, somewhat modular system and ensuring alignment to very tight levels. The multi-array focal plane integrated onto a single silicon substrate is a new application of both QWIP array development and silicon wafer scale integration. The Invar-based assembly has been tested to ensure thermal reliability.

The silicon substrate carrier was created so that a large-area array (in this case 62,000+ elements of a microshutter array) and a variety of discrete passive and active devices could be mounted on a single board, similar to a printed circuit board. However, the density and number of interconnects far exceeds the capabilities of printed circuit board technology. To overcome this hurdle, a method was developed to fabricate this carrier out of silicon and implement silicon integrated circuit (IC) technology. This method achieves a large number of high-density metal interconnects; a 100-percent yield over a 6-in. (approximately equal to 15-cm) diameter wafer (one unit per wafer); a rigid, thermally compatible structure (all components and operating conditions) to cryogenic temperatures; re-workability and component replaceability, if required; and the ability to precisely cut large-area holes through the substrate. A method that would employ indium bump technology along with wafer-scale integration onto a silicon carrier was also developed. By establishing a silicon-based version of a printed circuit board, the objectives could be met with one solution. The silicon substrate would be 2 mm thick to survive the environmental loads of a launch. More than 2,300 metal traces and over 1,500 individual wire bonds are required. To mate the microshutter array to the silicon substrate, more than 10,000 indium bumps are required. A window was cut in the substrate to allow the light signal to pass through the substrate and reach the microshutter array. The substrate was also the receptacle for multiple unpackaged IC die wire-bonded directly to the substrate (thus conserving space over conventionally packaged die). Unique features of this technology include the implementation of a 2-mmthick silicon wafer to withstand extreme mechanical loads (from a rocket launch); integrated polysilicon resistor heaters directly on the substrate; the precise formation of an open aperture (approximately equal to 3x3cm) without any crack propagation; implementation of IR transmission blocking techniques; and compatibility with indium bump bonding. Although designed for the microshutter arrays for the NIRSpec instrument on the James Webb Space Telescope, these substrates can be linked to microshutter applications in the photomask generation and stepper equipment used to make ICs and microelectromechanical system (MEMS) devices.

We have been developing a 32 x 32 prototype array of individually addressable Micro-Mirrors capable of operating at cryogenic temperature for Earth and Space Science applications. Micro-Mirror-Array technology has the potential to revolutionize imaging and spectroscopy systems for NASA's missions of the 21st century. They can be used as programmable slits for the Next Generation Space Telescope, as smart sensors for a steerable spectrometer, as neutral density filters for bright scene attenuation etc. The, entire fabrication process is carried out in the Detector Development Laboratory at NASA, GSFC. The fabrication process is low temperature compatible and involves integration of conventional CMOS technology and surface micro-machining used in MEMS. Aluminum is used as the mirror material and is built on a silicon substrate containing the CMOS address circuit. The mirrors are 100 microns x l00 microns in area and deflect by +/- 10 deg induced by electrostatic actuation between two parallel plate capacitors. A pair of thin aluminum torsion straps allow the mirrors to tilt. Finite-element-analysis and closed form solutions using electrostatic and mechanical torque for mirror operation were developed and the results were compared with laboratory performance. The results agree well both at room temperature and at cryogenic temperature. The development demonstrates the first cryogenic operation of two-dimensional Micro-Mirrors with bi-state operation. Larger arrays will be developed meeting requirements for different science applications. Theoretical analysis, fabrication process, laboratory test results and different science applications will be described in detail.

The simultaneous measurement of the spectrally and spatially variant transmittance of a linear variable order-sorting filter in a manner that closely resembles its conditions of actual use is described. The transmittance of a prototype order-sorting filter was measured in the 400- to 880-nm wavelength region by illuminating it with the output beam of a spectrophotometer while the filter was attached to the front of a 30 x 32 pixel silicon array detector. The filter was designed to be used in the output beam of a grating spectrometer to prevent the dispersal of higher diffracted orders onto an array detector. Areas of the filter that were spatially matched to the corresponding detector pixel column had measured peak transmittances of about 90 percent that were uniform to within +/- 1.5 percent along a given column. Transmittances for incident wavelengths shorter than the desired bandpass, corresponding to the order overlap region, were measured in the 0.003 range. Line spread function measurements made with the array detector indicated no significant beam spreading caused by inserting the filter into the beam.

A pinned photodiode/interline CCD Detector Array is under development for the EOS/MODIS-T project. Outstanding features of the device include large pixels, spectrally optimized fill factors, and blooming protection. The detector has 30 spatial rows and 32 spectral columns. The device layout is split into two halves; each half has its own detector area, storage area, and output structure.

A programmable CCD (charge-coupled device) driver circuit was designed to drive CCDs in multiphased modes. The purpose of the drive electronics is to operate developmental CCD imaging arrays for NASA's tiltable moderate resolution imaging spectrometer (MODIS-T). Five objectives for the driver were considered during its design: (1) the circuit drives CCD electrode voltages between 0 V and +30 V to produce reasonable potential wells, (2) the driving sequence is started with one input signal, (3) the driving sequence is started with one input signal, (4) the circuit allows programming of frame sequences required by arrays of any size, (5) it produces interfacing signals for the CCD and the DTF (detector test facility). Simulation of the driver verified its function with the master clock running up to 10 MHz. This suggests a maximum rate of 400,000 pixels/s. Timing and packaging parameters were verified. The design uses 54 TTL (transistor-transistor logic) chips. Two versions of hardware were fabricated: wirewrap and printed circuit board. Both were verified functionally with a logic analyzer.