1. Effect of thin-wall copper on the mechanical properties of ultra-light 3D-printed polymeric sandwich panels.
- Author
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Rohani Nejad, Salar, Hosseinpour, Mehrnoosh, and Mirbagheri, Seyed Mohammad Hossein
- Subjects
SANDWICH construction (Materials) ,COPPER ,COMPRESSIVE strength ,ENERGY density ,ELECTROFORMING - Abstract
In this study, a portion of an ultra-light polymeric sandwich panel was produced by additive manufacturing with a dimension of 25 × 25 × 37 mm as a precursor. Then, the precursor was covered with a thin-walled copper through electroforming deposition as a portion of a copper sandwich panel. The weight of the polymeric sandwich panel increased from 2–4 g to 9–13 g for the copper sandwich panel during the electroforming process. Compressive strength and energy absorption density of the polymeric and the copper sandwich panels with open-cell cores measured for 4, 5 and 6 PPI. The results shown that the ultra-light polymeric and copper sandwich panels with 6 PPI have the best mechanical performance in terms of yield stress, energy absorption density and energy absorption efficiency. Moreover, the abovementioned characteristics are 0.09 MPa, 0.11 MJ. m − 3 and 80% for the polymeric sandwich panels, and 1.74 MPa, 0.98 MJ. m − 3 and 70% for the copper sandwich panels, respectively. Therefore, the addition of 9.01 g copper as a reinforcing around the core's polymeric ligaments caused an increase in the yield stress for 20 times and in the energy absorption density for 9 times. Comparing to Ashby diagram, and previous studies, the sandwich panel portions of this study could develop the industry of sandwich panels by using the metallic shells as a reinforcement to ultralight polymeric sandwich structures. [ABSTRACT FROM AUTHOR] more...
- Published
- 2024
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