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Solar Energy is one of the most widely used renewable energy sources, with the solar Photovoltaic (PV) module technologies deployed as one of the primary renewable energy sources to replace fossil fuels. However, the R&D challenge for improving the performance and reliability of PV modules has become an urgent and critical agenda for the energy generation industry sector. The interconnection between the solar PV cells is a very important part of the PV module assembly, and its failure can adversely affect the performance and reliability of the PV module. The interconnection failure has been mostly linked to the crack initiation and propagation in the solder joints used to connect the ribbon interconnection to the cell. This research focuses on the study of the thermal failure of PV module solder joint to determine the optimum ribbon interconnection designs that will give improved thermo-mechanical reliability. It develops a virtual reliability qualification process for the assessment of the life expectancy of PV module interconnections. The FEM simulations in ABAQUS 2019 software are implemented to investigate failure of the solder joints in different ribbon interconnection designs under anticipated life cycle loading conditions and high temperature lamination process. For the first time, the extended finite element method (XFEM) technique is used to determine the crack initiation temperature, crack location, direction and growth rate in solder joint of PV module interconnection under lamination process. Furthermore, the research used the Developed Morrow Energy Density lifetime model to determine the number of cycles to creep-fatigue failure, and then it defined a new generic exponent factor using the Coffin-Manson-Arrhenius model to estimate the lifetime for the designs under different thermal cycling conditions. The research also combines the numerical results of XFEM and creep-fatigue investigation to determine the failure lifetime of PV Module interconnection designs. The results show that the Multi-Busbar interconnection design improves solder joint creep-fatigue life (up to 15%) and consequently provides higher thermo-mechanical reliability for the solar PV modules compared to other studied designs (Conventional and the Light Capturing Ribbon interconnections). The results of this PV module interconnections study can be used for evaluating potential design changes and to facilitate design for reliability validation of different configurations for improving the long-term PV module system reliability.

The operations of c-Si PV modules in elevated temperature climates like Africa and the Middle East are plagued with poor thermo-mechanical reliability and short fatigue lives. There is the need to improve the performance of the system operating in such regions to solve the grave energy poverty and power shortages. Solder interconnection failure due to accelerated thermo-mechanical degradation is identified as the most dominant degradation mode and responsible for over 40% of c-Si PV module failures. Hence the optimisation of c-Si PV module solder interconnections for improved performance in elevated temperature climate is the focus of this research. The effects of relevant reliability influencing factors (RIFs) on the performance (thermo-mechanical degradation and fatigue life) of c-Si PV module solder interconnections are investigated utilising a combination of ANSYS finite element modelling (FEM), Taguchi L25 orthogonal array and analytical techniques. The investigated RIFs are operating temperature, material combination and interconnection geometry. Garofalo creep relations and temperature dependent Young’s Modulus of Elasticity are used to model solder properties, EVA layer is modelled as viscoelastic while the other component layers are modelled using appropriate constitutive material models. Results show that fatigue life decays with increases in ambient temperature loads. Further findings indicate that only the solder layer demonstrates good miniaturisation properties while the standard dimensions for ribbon and contact layers remain the best performing geometry settings. Additionally, from the Taguchi robust optimisation, the Aluminium-Silver ribbon-contact material combination model (ribbon = 180μm, solder = 56μm, contact = 50μm) demonstrated the best performance in elevated temperature climate, reduced solder degradation by 95.1% and is the most suitable substitute to the conventional c-Si PV module solder interconnection in elevated temperature climate conditions – in terms of thermo-mechanical degradation. These findings presented provide more insight into the design and development of c-Si PV modules operating in elevated temperature climates by providing a fatigue life prediction model in various ambient conditions, identifying material combinations and geometry which demonstrate improved thermo-mechanical reliability and elongated fatigue life.