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1. Production and Integration of the ATLAS Insertable B-Layer

Author

Abbott, B., Albert, J., Alberti, F., Alex, M., Alimonti, G., Alkire, S., Allport, P., Altenheiner, S., Ancu, L., Anderssen, E., Andreani, A., Andreazza, A., Axen, B., Arguin, J., Backhaus, M., Balbi, G., Ballansat, J., Barbero, M., Barbier, G., Bassalat, A., Bates, R., Baudin, P., Battaglia, M., Beau, T., Beccherle, R., Bell, A., Benoit, M., Bermgan, A., Bertsche, C., Bertsche, D., de Mendizabal, J. Bilbao, Bindi, F., Bomben, M., Borri, M., Bortolin, C., Bousson, N., Boyd, R., Breugnon, P., Bruni, G., Brossamer, J., Bruschi, M., Buchholz, P., Budun, E., Buttar, C., Cadoux, F., Calderini, G., Caminada, L., Capeans, M., Carney, R., Casse, G., Catinaccio, A., Cavalli-Sforza, M., Červ, M., Cervelli, A., Chau, C., Chauveau, J., Chen, S., Chu, M., Ciapetti, M., Cindro, V., Citterio, M., Clark, A., Cobal, M., Coelli, S., Collot, J., Crespo-Lopez, O., Betta, G. Dalla, Daly, C., D'Amen, G., Dann, N., Dao, V., Darbo, G., DaVia, C., David, P., Debieux, S., Delebecque, P., De Lorenzi, F., de Oliveira, R., Dette, K., Dietsche, W., Di Girolamo, B., Dinu, N., Dittus, F., Diyakov, D., Djama, F., Dobos, D., Dondero, P., Doonan, K., Dopke, J., Dorholt, O., Dube, S., Dzahini, D., Egorov, K., Ehrmann, O., Einsweiler, K., Elles, S., Elsing, M., Eraud, L., Ereditato, A., Eyring, A., Falchieri, D., Falou, A., Fausten, C., Favareto, A., Favre, Y., Feigl, S., Perez, S. Fernandez, Ferrere, D., Fleury, J., Flick, T., Forshaw, D., Fougeron, D., Franconi, L., Gabrielli, A., Gaglione, R., Gallrapp, C., Gan, K., Garcia-Sciveres, M., Gariano, G., Gastaldi, T., Gavrilenko, I., Gaudiello, A., Geffroy, N., Gemme, C., Gensolen, F., George, M., Ghislain, P., Giangiacomi, N., Gibson, S., Giordani, M., Giugni, D., Gjersdal, H., Glitza, K., Gnani, D., Godlewski, J., Gonella, L., Gonzalez-Sevilla, S., Gorelov, I., Gorišek, A., Gössling, C., Grancagnolo, S., Gray, H., Gregor, I., Grenier, P., Grinstein, S., Gris, A., Gromov, V., Grondin, D., Grosse-Knetter, J., Guescini, F., Guido, E., Gutierrez, P., Hallewell, G., Hartman, N., Hauck, S., Hasi, J., Hasib, A., Hegner, F., Heidbrink, S., Heim, T., Heinemann, B., Hemperek, T., Hessey, N., Hetmánek, M., Hinman, R., Hoeferkamp, M., Holmes, T., Hostachy, J., Hsu, S., Hügging, F., Husi, C., Iacobucci, G., Ibragimov, I., Idarraga, J., Ikegami, Y., Ince, T., Ishmukhametov, R., Izen, J. M., Janoška, Z., Janssen, J., Jansen, L., Jeanty, L., Jensen, F., Jentzsch, J., Jezequel, S., Joseph, J., Kagan, H., Kagan, M., Karagounis, M., Kass, R., Kastanas, A., Kenney, C., Kersten, S., Kind, P., Klein, M., Klingenberg, R., Kluit, R., Kocian, M., Koffeman, E., Korchak, O., Korolkov, I., Kostyukhina-Visoven, I., Kovalenko, S., Kretz, M., Krieger, N., Krüger, H., Kruth, A., Kugel, A., Kuykendall, W., La Rosa, A., Lai, C., Lantzsch, K., Lapoire, C., Laporte, D., Lari, T., Latorre, S., Leyton, M., Lindquist, B., Looper, K., Lopez, I., Lounis, A., Lu, Y., Lubatti, H., Maeland, S., Maier, A., Mallik, U., Manca, F., Mandelli, B., Mandić, I., Marchand, D., Marchiori, G., Marx, M., Massol, N., Mättig, P., Mayer, J., Goldrick, G. Mc, Mekkaoui, A., Menouni, M., Menu, J., Meroni, C., Mesa, J., Michal, S., Miglioranzi, S., Mikuž, M., Miucci, A., Mochizuki, K., Monti, M., Moore, J., Morettini, P., Morley, A., Moss, J., Muenstermann, D., Murray, P., Nakamura, K., Nellist, C., Nelson, D., Nessi, M., Nisius, R., Nordberg, M., Nuiry, F., Obermann, T., Ockenfels, W., Oide, H., Oriunno, M., Ould-Saada, F., Padilla, C., Pangaud, P., Parker, S., Pelleriti, G., Pernegger, H., Piacquadio, G., Picazio, A., Pohl, D., Polini, A., Pons, X., Popule, J., Bueso, X. Portell, Potamianos, K., Povoli, M., Puldon, D., Pylypchenko, Y., Quadt, A., Quayle, B., Rarbi, F., Ragusa, F., Rambure, T., Richards, E., Riegel, C., Ristic, B., Rivière, F., Rizatdinova, F., Røhne, O., Rossi, C., Rossi, L., Rovani, A., Rozanov, A., Rubinskiy, I., Rudolph, M., Rummler, A., Ruscino, E., Sabatini, F., Salek, D., Salzburger, A., Sandaker, H., Sannino, M., Sanny, B., Scanlon, T., Schipper, J., Schmidt, U., Schneider, B., Schorlemmer, A., Schroer, N., Schwemling, P., Sciuccati, A., Seidel, S., Seiden, A., Šícho, P., Skubic, P., Sloboda, M., Smith, D., Smith, M., Sood, A., Spencer, E., Stramaglia, M., Strauss, M., Stucci, S., Stugu, B., Stupak, J., Styles, N., Su, D., Takubo, Y., Tassan, J., Teng, P., Teixeira, A., Terzo, S., Therry, X., Todorov, T., Tomášek, M., Toms, K., Travaglini, R., Trischuk, W., Troncon, C., Troska, G., Tsiskaridze, S., Tsurin, I., Tsybychev, D., Unno, Y., Vacavant, L., Verlaat, B., Vigeolas, E., Vogt, M., Vrba, V., Vuillermet, R., Wagner, W., Walkowiak, W., Wang, R., Watts, S., Weber, M., Weingarten, J., Welch, S., Wenig, S., Wensing, M., Wermes, N., Wittig, T., Wittgen, M., Yildizkaya, T., Yang, Y., Yao, W., Yi, Y., Zaman, A., Zaidan, R., Zeitnitz, C., Ziolkowski, M., Zivkovic, V., Zoccoli, A., and Zwalinski, L.

Subjects
Physics - Instrumentation and Detectors, High Energy Physics - Experiment
Abstract

During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, smaller radius beam pipe. The motivation for this new pixel layer, the Insertable B-Layer (IBL), was to maintain or improve the robustness and performance of the ATLAS tracking system, given the higher instantaneous and integrated luminosities realised following the shutdown. Because of the extreme radiation and collision rate environment, several new radiation-tolerant sensor and electronic technologies were utilised for this layer. This paper reports on the IBL construction and integration prior to its operation in the ATLAS detector., Comment: 90 pages in total. Author list: ATLAS IBL Collaboration, starting page 2. 69 figures, 20 tables. Published in Journal of Instrumentation. All figures available at: https://atlas.web.cern.ch/Atlas/GROUPS/PHYSICS/PLOTS/PIX-2018-001

Published
2018
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2. Production and integration of the ATLAS Insertable B-Layer

Author

Abbott, B, Albert, J, Alberti, F, Alex, M, Alimonti, G, Alkire, S, Allport, P, Altenheiner, S, Ancu, LS, Anderssen, E, Andreani, A, Andreazza, A, Axen, B, Arguin, J, Backhaus, M, Balbi, G, Ballansat, J, Barbero, M, Barbier, G, Bassalat, A, Bates, R, Baudin, P, Battaglia, M, Beau, T, Beccherle, R, Bell, A, Benoit, M, Bermgan, A, Bertsche, C, Bertsche, D, De Mendizabal, JB, Bindi, F, Bomben, M, Borri, M, Bortolin, C, Bousson, N, Boyd, RG, Breugnon, P, Bruni, G, Brossamer, J, Bruschi, M, Buchholz, P, Budun, E, Buttar, C, Cadoux, F, Calderini, G, Caminada, L, Capeans, M, Carney, R, Casse, G, Catinaccio, A, Cavalli-Sforza, M, Červ, M, Cervelli, A, Chau, CC, Chauveau, J, Chen, SP, Chu, M, Ciapetti, M, Cindro, V, Citterio, M, Clark, A, Cobal, M, Coelli, S, Collot, J, Crespo-Lopez, O, Betta, GFD, Daly, C, D'Amen, G, Dann, N, Dao, V, Darbo, G, Davia, C, David, P, Debieux, S, Delebecque, P, Lorenzi, FD, De Oliveira, R, Dette, K, Dietsche, W, Girolamo, BD, Dinu, N, Dittus, F, Diyakov, D, Djama, F, Dobos, D, Dondero, P, Doonan, K, Dopke, J, Dorholt, O, Dube, S, Dzahini, D, Egorov, K, Ehrmann, O, Einsweiler, K, Elles, S, Elsing, M, Eraud, L, Ereditato, A, and Eyring, A

Subjects
Large detector systems for particle and astroparticle physics, Particle tracking detectors, Nuclear & Particles Physics, Other Physical Sciences, Physical Sciences, Engineering
Abstract

During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, smaller radius beam pipe. The motivation for this new pixel layer, the Insertable B-Layer (IBL), was to maintain or improve the robustness and performance of the ATLAS tracking system, given the higher instantaneous and integrated luminosities realised following the shutdown. Because of the extreme radiation and collision rate environment, several new radiation-tolerant sensor and electronic technologies were utilised for this layer. This paper reports on the IBL construction and integration prior to its operation in the ATLAS detector.

Published
2018

11. Advanced liquid-free, piezoresistive, SOI-based pressure sensors for measurements in harsh environments

Author

Ngo, H.D., Mukhopadhyay, B., Ehrmann, O., Lang, K.D., and Publica

Abstract

In this paper we present and discuss two innovative liquid-free SOI sensors for pressure measurements in harsh environments. The sensors are capable of measuring pressures at high temperatures. In both concepts media separation is realized using a steel membrane. The two concepts represent two different strategies for packaging of devices for use in harsh environments and at high temperatures. The first one is a one-sensor-one-packaging_technology concept. The second one uses a standard flip-chip bonding technique. The first sensor is a floating-concept, capable of measuring pressures at temperatures up to 400 degrees C (constant load) with an accuracy of 0.25% Full Scale Output (FSO). A push rod (mounted onto the steel membrane) transfers the applied pressure directly to the center-boss membrane of the SOI-chip, which is placed on a ceramic carrier. The chip membrane is realized by Deep Reactive Ion Etching (DRIE or Bosch Process). A novel propertied chip housing employing a sliding sensor chip that is fixed during packaging by mechanical preloading via the push rod is used, thereby avoiding chip movement, and ensuring optimal push rod load transmission. The second sensor can be used up to 350 degrees C. The SOI chips consists of a beam with an integrated centre-boss with was realized using KOH structuring and DRIE. The SOI chip is not floating but bonded by using flip-chip technology. The fabricated SOI sensor chip has a bridge resistance of 3250 . The realized sensor chip has a sensitivity of 18 mV/mu m measured using a bridge current of 1 mA.

Published
2015

12. A MCM-D-type Module for the ATLAS Pixel Detector

Author

Becks, K.-H., Beyne, E., Ehrmann, O., Gerlach, P., Gregor, I.M., Pieters, P., Topper, M., Truzzi, C., and Wolf, J.

Subjects
Pixels -- Testing, Sensors -- Usage, Modulators (Electronics) -- Testing, Tracking systems -- Usage, Business, Electronics, Electronics and electrical industries
Abstract

For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic building blocks of the ATLAS pixel detector. A module consists of a sensor tile with an active area of 16.4 mm x 60.4 mm, 16 read out IC's, each serving 24 x 160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and power distribution busses. The dies are attached by flip-chip assembly to the sensor diodes and the local busses. In the following a module based on MCM-D technology will be discussed and prototype results will be presented.

Published
1999

13. Embedding of wearable electronics into smart sensor insole

Author

Hubl, M., primary, Pohl, O., additional, Noack, V., additional, Hahlweg, P., additional, Ehm, C., additional, Derleh, M., additional, Weiland, T., additional, Schick, E., additional, Muller, H-H., additional, Hampicke, D., additional, Gregorius, P., additional, Schwartzinger, T., additional, Jablonski, T., additional, Maurer, J.-P., additional, Hahn, R., additional, Ehrmann, O., additional, Lang, K.-D., additional, Shin, E., additional, and Ngo, H.-D., additional

Published
2016
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16. HIPIMS in full face erosion circular cathode for semiconductor applications

Author

Bellido-Gonzalez, V., primary, Papa, F., additional, Azzopardi, A., additional, Brindley, J., additional, Li, H., additional, Vetushka, A., additional, Kroehnert, K., additional, Ehrmann, O., additional, Lang, K-D., additional, Mackowiak, P., additional, Fernandez, I., additional, Wennberg, A., additional, and Ngo, H. D., additional

Published
2015
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17. Biodiversity in organic and low-input farming systems. Handbook for recording key indicators

Author

Dennis, Peter, Herzog, Felix, Jeanneret, Philippe, Arndorfer, Michaela, Bogers, Marion, Bunce, Robert, Bailey, Debra, Choisis, Jean Philippe, Choisis, Norma, Cuming, David, Ehrmann, O., Fjellstad, Wendy, Franck, T., Fraser, M.D., Friedel, J., Geijzendorffer, I., Gomiero, Tiziano, Jongman, Rob, Kainz, Martin, Kölliker, Roland, Last, Luisa, Lüscher, Gisela, Moreno, G., Nicholas, P., Paoletti, M. G., Papaja-Hülsbergen, Susanne, Pelosi, Céline, Pointereau, Philippe, Sarthou, Jean-Pierre, Schneider, M., Siebrecht, Norman, Targetti, Stefano, Viaggi, Davide, Wilkes, Jerylee, Wolfrum, Sebastian, Aberystwyth University, Research Station ART, Division of Organic Farming & Applied Life Sciences, Universität für Bodenkultur Wien [Vienne, Autriche] (BOKU), Alterra Green World Research (ALTERRA), Dynamiques Forestières dans l'Espace Rural (DYNAFOR), Institut National de la Recherche Agronomique (INRA)-École nationale supérieure agronomique de Toulouse [ENSAT]-Institut National Polytechnique (Toulouse) (Toulouse INP), Université Fédérale Toulouse Midi-Pyrénées-Université Fédérale Toulouse Midi-Pyrénées, lmas Mater Studiorum, Department of Agricultural Economics and Engineering (DEIAGRA), University of Bologna, Division of Organic Farming, Norwegian Forest and Landscape Institute, Federal Department of Economic Affairs DEA - Research Station ART, Zurich, Suisse, Federal Department of Economic Affairs DEA, Institute of Biological, Environmental, and Rural Sciences, Aberystwyth, Royaume Uni., Wageningen UR, Department of Biology, Padova University, Italy, Universita degli Studi di Padova, Centre of Life and Food Science, Weihenstephan, Technical University of Munich, Germany, Technische Universität Munchen - Université Technique de Munich [Munich, Allemagne] (TUM), Federal Department of Economic Affairs, Research Station ART, Zurich, Forestry School, University of Extremadura, Plasencia, Universidad de Extremadura (UEX), Institute of Biological, Environmental and Rural Sciences, Aberystwyth University, Department of Biology, Padova University, Centre of Life and Food Science, Weihenstephan, Technical University of Munich, Ecologie fonctionnelle et écotoxicologie des agroécosystèmes (ECOSYS), Institut National de la Recherche Agronomique (INRA)-AgroParisTech, Initiatives and Innovations for Energy, Agriculture and Environment, Toulouse, France, SOLAGRO, AGroécologie, Innovations, teRritoires (AGIR), Institut National de la Recherche Agronomique (INRA)-Institut National Polytechnique (Toulouse) (Toulouse INP), lmas Mater Studiorum, University of Bologna, Department of Agricultural Economics and Engineering (DEIAGRA), Project no. 227161 project BioBio, Inconnu, Contrat : KBBE - 2B - 227161, Type de commanditaire ou d'auteur de la saisine : Organisations européennes, Institut National de la Recherche Agronomique (INRA)-Ecole Nationale Supérieure Agronomique de Toulouse-Institut National Polytechnique (Toulouse) (Toulouse INP), Technical University of Munich (TUM), UMR : AGroécologie, Innovations, TeRritoires, Ecole Nationale Supérieure Agronomique de Toulouse, and ProdInra, Archive Ouverte

Subjects
[SDV] Life Sciences [q-bio], organic farming, indicator, [SDV]Life Sciences [q-bio], habitat, low-input farming of additional editing and revision of the D2.2
Abstract

This Handbook describes the methods required to measure the direct and indirect indicators of biodiversity in the field or through farmer interviews on organic, low-input and conventional (control) farms during 2010. It is the result of editing and revision of the BIOBIO deliverable D2.2. A total of twelve Case Study regions were selected in eleven countries. A standard habitat mapping procedure for the European scale based on General Habitat Categories (GHCs) was applied. This method has been adapted further to deal with the assessment of organic/low-input farm holdings. An initial classification of farmed and non-farmed land has been used to direct the selection of the samples. After mapping the farm area, in each habitat type selected for flora and fauna surveys, all species indicators were sampled for vegetation, earthworms, bees and spiders. Farm practices and genetic diversity were measured through interviews with the farmer. A digitising protocol was provided to prepare all data for analysis. The practicality and suitability of these methods for sampling plants and selected animals on very different farm types and habitats was evaluated. Lessons learned are described shortly after each chapter indicating difficulties encountered during the field work and giving practical suggestions. Further reports will be available in due course presenting the implication of analyses and results. The cost efficiency of the methodology was measured through reports on input of staff time and materials

Published
2012

19. Only small changes in soil organic carbon and charcoal concentrations found one year after experimental slash-and-burn in a temperate deciduous forest

Author

Eckmeier, E., Gerlach, R., Skjemstad, J. O., Ehrmann, O., Schmidt, M. W. I., Universität Zürich [Zürich] = University of Zurich (UZH), Rheinisches Amt für Bodendenkmalpflege, CSIRO Land and Water, Commonwealth Scientific and Industrial Research Organisation [Canberra] (CSIRO), and Münster 12

Subjects
[PHYS.ASTR.CO]Physics [physics]/Astrophysics [astro-ph]/Cosmology and Extra-Galactic Astrophysics [astro-ph.CO], [SDU.OCEAN]Sciences of the Universe [physics]/Ocean, Atmosphere, [SDU.ASTR]Sciences of the Universe [physics]/Astrophysics [astro-ph], 010504 meteorology & atmospheric sciences, 13. Climate action, 040103 agronomy & agriculture, [SDU.STU]Sciences of the Universe [physics]/Earth Sciences, 0401 agriculture, forestry, and fisheries, 04 agricultural and veterinary sciences, 15. Life on land, [SDU.ENVI]Sciences of the Universe [physics]/Continental interfaces, environment, 01 natural sciences, 0105 earth and related environmental sciences
Abstract

International audience; Anthropogenic fires affected the temperate deciduous forests of Central Europe over millennia. Biomass burning releases carbon to the atmosphere and produces charcoal, which potentially contributes to the stable soil carbon pools and is an important archive of environmental history. The fate of charcoal in soils of temperate deciduous forests, i.e. the processes of charcoal incorporation and transportation, and the effects on soil organic matter are still not clear. In a long-term experimental burning site, we investigated the effects of slash-and-burn and determined soil organic carbon, charcoal carbon and nitrogen concentrations and the soil lightness of colour (L*) in the topmost soil material (0?1, 1?2.5 and 2.5?5 cm depths) before, immediately after the fire and one year after burning. The main results are that (i) only few charcoal particles from the forest floor were incorporated into the soil matrix by soil mixing animals. In 0?1 cm and during one year, the charcoal C concentrations increased only by 0.4 g kg?1 and the proportion of charcoal C to SOC concentrations increased from 2.8 to 3.4%; (ii) the SOC concentrations did not show any significant differences; (iii) soil lightness significantly decreased in the topmost soil layer and correlated with the concentrations of charcoal C (r=-0.87**) and SOC (r=?0.94**) in samples 0?5 cm. We concluded that the soil colour depends on the proportion of aromatic charcoal carbon in total organic matter and that Holocene burning could have influenced soil charcoal concentrations and soil colour.

Published
2007

20. WLCSP technology direction

Author

Töpper, M., Claw, V., Zoschke, K., Ehrmann, O., Reichl, H., and Publica

Abstract

As the complexity of devices and systems is rapidly increasing new packaging technologies play a mayor role for the electronic industry as they determine the size, weight, ease of use, durability, reliability, performance and cost of electronic products. As a consequence for miniaturization, area consuming single chip packages are not useful anymore. Therefore Chip Size Packaging (CSP) has been successfully developed since the 1990s. For further cost reduction, the concept of Wafer Level Packaging (WLP) was established. In contrast to pure wafer bumping, it guarantees the SMT assembly process which is not possible for highest pin count microprocessor without additional interposer based packages. Wafer Level Packaging is unique among all different packaging technology as the processes are done on the wafer prior to singulation. Within years, wafer level packaging has been implemented into manufacturing world-wide, mainly based on thin film redistribution. 3-D stacking te chnologies and the integration of passive components based on thin film processes will further push WLP to a higher degree of integration. The industry-wide migration from WLP to System in Packaging (SiP) and Hetero System Integration will benefit from the flip chip and wafer bumping infrastructure which is currently being created at a breathtaking pace because process technology, process equipment and materials, and the general mode of thinking bear many similarities.

Published
2006

24. Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu/PbSn technology

Author

Töpper, M., Gerlach, P., Dietrich, L., Fehlberg, S., Karduck, C., Meinherz, C., Wolf, J., Ehrmann, O., Becks, K.-H., Reichl, H., and Publica

Abstract

The MCM-D which is described here is a prototype for a pixel detector system for the planned Large Hadron Collider LHC at CERN, Geneva. The project is within the ATLAS experiment. A module consists of a sensor tile with an active area of 16.4 mm x 60.4mm, 16 read out chips, each serving 24x160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and power distribution busses. The extremely high wiring density which is necessary to interconnect the read-out chips was achieved using a thin film Copper/Photo-BCB process above the pixel array. The bumping of the read out chips was done using electroplating PbSn. All dice are then attached by flip-chip assembly to the sensor diodes and the local busses. Focus of this paper is the detailed description of the technologies for the fabrication of this advanced MCM-D.

Published
1999

26. Ein hochsprachenprogrammierbares System zur Vollbildauswertung im Videotakt; Anwendungen zur Interpretation monokularer, semi-strukturierter Bildfolgen bei natürlicher Beleuchtung und schnell bewegter Kamera

Author

Baur, M., Schumm, T., Wertheimer, Reiner, Schanz, Michael, Eckart, Thomas, Nitta, Christian, Hosticka, Bedrich, Wagner, R., Liu, F., Donner, K., Haas, J., Handmann, U., Kalinke, T., Tzomakas, C., Werner, M., Seelen, W. v., Ehrmann, O., Buschick, K., Chmiel, G., Paredes, A., Glaw, V., and Reichl, H.

Subjects
Materialtechnik
Abstract

Im vorliegenden Beitrag wird ein hochsprachenprogrammierbares System zur schritthaltenden Vollbild-Interpretation naturlich beleuchteter Szenenfolgen im Videotakt vorgestellt. Im einzelnen werden folgende Teilmodule und Subsysteme beschrieben: eine hochdynamische, pixellokal autoadaptive CMOS-Kamera mit ca. 120 dB Helligkeitsdynamik (20Bits/Pixel) ein hochsprachenprogrammierbarer Systolic Array Prozessor (fur die pixelbezogenen Verarbeitungsmodule) im PCI-Kartenformat, samt optimierendem Compiler, Simulator und Emulator Systemprozesgeruste unter Linux auf den fur die Echtzeit-Anwendungen eingesetzten Hostrechnern (z.B. DEC/Alpha oder Intel/ Pentium) eine prototypische Anwendung zur bildverarbeitungsbasierten Eigenbewegungsbeobachtung (Translationsrichtung, Eotationsraten) eine prototypische, automotive Anwendung zur schritthalt enden Detektion und Kartierung des Strasen- und Spurverlaufs unter partieller monokularer 3D-Rekonstruktion, sowie prototypische Anwendungen zur Klassifikation verkehrsrelevanter Hindernisse (Verkehrsteilnehmer)

Published
1998

28. Minor changes in soil organic carbon and charcoal concentrations detected in a temperate deciduous forest a year after an experimental slash-and-burn

Author

Eckmeier, E, Gerlach, R, Skjemstad, J O, Ehrmann, O, Schmidt, M W I, Eckmeier, E, Gerlach, R, Skjemstad, J O, Ehrmann, O, and Schmidt, M W I

Abstract

Anthropogenic fires affected the temperate deciduous forests of Central Europe over millennia. Biomass burning releases carbon to the atmosphere and produces charcoal, which potentially contributes to the stable soil carbon pools and is an important archive of environmental history. The fate of charcoal in soils of temperate deciduous forests, i.e. the processes of charcoal incorporation and transportation and the effects on soil organic matter are still not clear. We investigated the effects of slash-and-burn at a longterm experimental burning site and determined soil organic carbon and charcoal carbon concentrations as well as the soil lightness of colour (L*) in the topmost soil material (0–1, 1–2.5 and 2.5–5 cm depths) before, immediately after the fire and one year later. The main results are that (i) only a few of the charcoal particles from the forest floor were incorporated into the soil matrix, presumably by soil mixing animals. In the 0–1 cm layer, during one year, the charcoal C concentration increased only by 0.4 g kg−1 and the proportion of charcoal C to SOC concentration increased from 2.8 to 3.4%; (ii) the SOC concentrations did not show any significant differences; (iii) soil lightness decreased significantly in the topmost soil layer and correlated well with the concentrations of charcoal C (r=−0.87**) and SOC (r=−0.94**) in the samples from the 0–5 cm layer. We concluded that Holocene biomass burning could have influenced soil charcoal concentrations and soil colour.

Published
2007

30. Copper filling of TSVs for interposer applications

Author

Jurgensen, N., primary, Huynh, Q. H., additional, Engelmann, G., additional, Ngo, H.-D., additional, Ehrmann, O., additional, Lang, K.-D., additional, Uhlig, A., additional, Dretschkow, T., additional, Rohde, D., additional, Worm, O., additional, and Jager, C., additional

Published
2012
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31. Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads

Author

Kaynak, M., primary, Wietstruck, M., additional, Zhang, W., additional, Drews, J., additional, Barth, R., additional, Knoll, D., additional, Korndorfer, F., additional, Scholz, R., additional, Schulz, K., additional, Wipf, C., additional, Tillack, B., additional, Kaletta, K., additional, Suchodoletz, M. v., additional, Zoschke, K., additional, Wilke, M., additional, Ehrmann, O., additional, Ulusoy, A. C., additional, Purtova, T., additional, Liu, G., additional, and Schumacher, H., additional

Published
2012
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33. RF-MEMS switch module in a 0.25 μm BiCMOS technology

Author

Kaynak, M., primary, Wietstruck, M., additional, Zhang, W., additional, Drews, J., additional, Scholz, R., additional, Knoll, D., additional, Korndorfer, F., additional, Wipf, C., additional, Schulz, K., additional, Elkhouly, M., additional, Kaletta, K., additional, Suchodoletz, M. V., additional, Zoschke, K., additional, Wilke, M., additional, Ehrmann, O., additional, Muhlhaus, V., additional, Liu, G., additional, Purtova, T., additional, Ulusoy, A. C., additional, Schumacher, H., additional, and Tillack, B., additional

Published
2012
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34. TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules

Author

Zoschke, K., primary, Wolf, J., additional, Lopper, C., additional, Kuna, I., additional, Jurgensen, N., additional, Glaw, V., additional, Samulewicz, K., additional, Roder, J., additional, Wilke, M., additional, Wunsch, O., additional, Klein, M., additional, Suchodoletz, M. V., additional, Oppermann, H., additional, Braun, T., additional, Wieland, R., additional, and Ehrmann, O., additional

Published
2011
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43. Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces

Author

Topper, M., primary, Klein, M., additional, Buschick, K., additional, Glaw, V., additional, Orth, K., additional, Ehrmann, O., additional, Hutter, M., additional, Oppermann, H., additional, Becker, K.-F., additional, Braun, T., additional, Ebling, F., additional, Reichl, H., additional, Kim, S., additional, Tathireddy, P., additional, Chakravarty, S., additional, and Solzbacher, F., additional

Published
2006
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45. Packaging of radiation and particle detectors

Author

Fritzsch, T., primary, Jordan, R., additional, Glaw, V., additional, Topper, M., additional, Dietrich, L., additional, Wolf, J., additional, Ehrmann, O., additional, Oppermann, H., additional, Reichl, H., additional, and Wermes, N., additional

Published
2006
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