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With the developments of the electronic industry, efforts to achieve high DC insulating reliability are underway to improve the mean time to failure (MTTF) of multilayer ceramic capacitors (MLCCs). However, there are few studies on appropriate measuring methods to evaluate their different reliability characteristics quantificationally. This study measured different reliability characteristics of BaTiO 3 -based multilayer ceramic capacitors sintered at three different temperatures with highly accelerated life tests (HALTs). Kaplan–Meier survival analysis, two-parameter Weibull fitting, and a new method using a stud genetic algorithm were used to calculate their MTTF in HALT conditions, and the comparison among them was carried out to select a proper fitting way. With the appropriate method, their MTTF at the rated condition was predicted and compared. Their conduction modes were also differentiated to explain their aging sensitivities to temperature and voltage. As a result, a proper way to evaluate the sample's reliability characteristics with a bathtub curve was established, and the best sintering temperature for capacitance that is also the best for reliability at the rated condition was confirmed. Meanwhile, different conducting models of MLCCs were also proved to be related to their insulation stability. [ABSTRACT FROM AUTHOR]

Copyright of Elektronik Industrie is the property of Hüthig GmbH and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

As a basic component of the versatile semiconductor devices, metal oxides play a critical role in modern electronic information industry. However, ultra-high precision nanopatterning of metal oxides often involves multi-step lithography and transfer process, which is time-consuming and costly. Here, we report a strategy, using metal-organic compounds as solid precursor photoresist for multi-photon lithography and post-sintering, to realize ultra-high precision additive manufacturing of metal oxides. As a result, we gain metal oxides including ZnO, CuO and ZrO2 with a critical dimension of 35 nm, which sets a benchmark for additive manufacturing of metal oxides. Besides, atomic doping can be easily accomplished by including the target element in precursor photoresist, and heterogeneous structures can also be created by multiple multi-photon lithography, allowing this strategy to accommodate the requirements of various semiconductor devices. For instance, we fabricate an ZnO photodetector by the proposed strategy. By using metal-organic compounds as solid precursor photoresist for multi-photon lithography and post-sintering, Cao et al. report ultra-high precision nano additive manufacturing of 2D and 3D metal oxide semiconductors with dimension down to 35 nm. [ABSTRACT FROM AUTHOR]

SiCp/Al matrix composites exhibit excellent thermal and mechanical properties, making them highly desirable in aerospace, automobile, and electronics industries. However, a drawback arises during the welding process, wherein the brittle Al4C3 compound tends to form in the weld joint of SiCp/Al matrix composites, leading to a significantly diminishes the toughness and strength. To mitigate the issue of brittle Al4C3 formation in the weld joint, laser welding with TixSi powders as a filler was employed. The microstructure, interfacial behavior and microhardness of the SiCp/Al matrix composites in the weld joint were characterized. The results reveal that the weld beads are smooth and uniform, with no observed pores, cracks, sparks, or other defects. Within the weld joint, there are TiC particles and bulk Al3Ti present, and notably, no needlelike Al4C3 phase is found in the zone. As the Ti/Si molar ratio of the mixed powder TixSi increases, the number and volume of the bulk phase reach a peak value at the molar ratio of 3:1 (Ti3Si). The weld interface zone consists of five layers: a serration-shaped layer near the base materials, a layer with white particles, a layer with white slender reticular structures, and chrysanthemum-like structures. Additionally, numerous white particles form around the SiC particles in the interface zone. The microhardness value of the weld joint initially decreases and then increases with the increase in the Ti/Si molar ratio of the TixSi filler powder, and the minimum microhardness value is about 148.6 HV for the Ti2Si. [ABSTRACT FROM AUTHOR]

This study uses two frequentist approaches and the Bayesian method of estimation using progressively first‐failure type‐II censored data to estimate process capability index (PCI), Cpc$C_{pc}$, for the Wilson–Hilferty (WH) distribution. A competitive maximum product of spacing (MPS) method for estimation of Cpc$C_{pc}$ is proposed in the frequentist method as an alternative to conventional likelihood (LK)‐based estimation. We have also taken into account the PS function in the Bayesian setup as an alternative to the conventional LK function, and both LK and PS‐based Bayesian estimates are given for Cpc$C_{pc}$. Further, the Bayes estimates are evaluated by applying Tierney–Kadane (TK) approximation method and Markov chain Monte Carlo (MCMC) method with the help of both LK and PS functions and Jeffrey's prior. Additionally, the approximate confidence intervals based on the suggested frequentist techniques as well as the Bayes highest posterior density (HPD) credible intervals are built for the index Cpc$C_{pc}$. In addition, two bootstrap confidence intervals are obtained. In the simulation exercise, the performance of the Bayes and traditional estimates of Cpc$C_{pc}$ is assessed in terms of their mean squared errors, and the average width and coverage probabilities of the CIs and HPD intervals are compared. An actual data set from the electronic industries is reanalyzed in order to show the efficacy of the proposed index and estimation methodology. [ABSTRACT FROM AUTHOR]

With the rapid increase in power density of electronic devices, thermal management has become urgent for the electronics industry. Controlling temperature in the back-end-of-line is crucial for maintaining the reliability of integrated circuits, where many atomic-scale interfaces exist. The theoretical models of interface thermal conductance not only accurately predict the values but also help to analyze the underlying mechanism. This review picks up and introduces some representative theoretical models considering interfacial roughness, elastic and inelastic processes, and electron–phonon couplings, etc. Moreover, the limitations and problems of these models are also discussed. [ABSTRACT FROM AUTHOR]

Automatic electroplating production lines have been widely used in electronics industries to reduce the labour intensity and improve the production efficiency. In the multi-variety and low-volume electroplating production, it is known that the task loading sequence and hoist scheduling are coupled with each other, and they codetermine the production efficiency, while all the existing scheduling methods consider them separately, and thus the optimal production schemes become unavailable. Therefore, this paper develops a Task sequence-Hoist scheduling Coupled Optimization (THCO) model which simultaneously considers the requirements and practical constrains of task sequence and hoist scheduling, having an optimization objective of minimizing the maximum completion time. For this model, a double-layer code is developed and an Improved Salp Swarm Algorithm (ISSA) is developed by introducing three improvement strategies: the random spare strategy which is used to increase the population diversity, the nonlinear adaptive weight strategy which is used to balance the exploration and exploitation capacities, and a golden sine algorithm which is used to improve the convergence rate. Experiments based on 23 benchmark functions are then conducted. The obtained results show that ISSA has better convergence and solving quality than existing algorithms. Furthermore, several production cases prove that THCO can generate production schemes that better meet the requirements of production lines. [ABSTRACT FROM AUTHOR]

The fabrication of stable, tailored domain patterns in ferroelectric crystals has wide applications in optical and electronic industries. All-optical ferroelectric poling by pulse laser irradiation has been developed recently. In this work, we studied the creation of the domain structures in MgO-doped lithium tantalate by focused irradiation with a femtosecond near-infrared laser. Cherenkov-type second harmonic generation microscopy was used for domain imaging of the bulk. We have revealed the creation of enveloped domains around the induced microtracks under the action of the depolarization field. The domain growth is due to a pyroelectric field caused by a nonuniform temperature change. The domains in the bulk were revealed to have a three-ray star-shaped cross-section. It was shown that an increase in the field excess above the threshold leads to consequential changes in domain shape from a three-ray star to a triangular and a circular shape. The appearance of comb-like domains as a result of linear scanning was demonstrated. All effects were considered in terms of a kinetic approach, taking into account the domain wall motion by step generation and kink motion driven by excess of the local field over the threshold. The obtained knowledge is useful for the all-optical methods of domain engineering in ferroelectrics. [ABSTRACT FROM AUTHOR]

This article analyzes structural changes of regional production network (RPN) for the electronics industry across 20 Northeast Asia regions for the period 2005–2015. We develop an extended Structural Decomposition Analysis approach which decomposes changes in Vertical Specialization (VS) share into seven components of foreign intermediate suppliers, input composition, and import intensity in terms of the import structure; and production structure, trade balance, trade openness, and domestic demand in terms of the export one. The development of production fragmentation in Northeast Asia's electronic industry was associated with the coexistence of nine subregional patterns, including four VS patterns of Coastal China, Inland China, North China, and Central China; four vertical integration (VI) patterns of Northeast Japan, Central Japan, Seoul region, and Busan region. The substantial increases in the VS of North China and Central China result from changes in domestic demand and production structure, while the decline in the VS in Central Japan and Busan region is influenced by the shifts in import intensity and trade openness. [ABSTRACT FROM AUTHOR]

This study aims to establish a systematic data-driven analysis that exemplifies a precious reverse logistic portrayal toward industry 4.0 and extension impute for sustainable growth due to there are plenty of indicators unveils among the massive diffusion of reverse logistic and industry 4.0 in extending literature. A combination of content analysis, networking analysis, fuzzy Delphi method, fuzzy decision-making trial and evaluation laboratory, and Choquet integral is adopted. This study contributes to insight on a valid hierarchical structure of reverse logistic toward industry 4.0, explore the causal inter-relationships among the attributes and identify the critical attributes for achieving sustainable performance, and identify the decisive reverse logistic activities in electronic industry practices in Vietnam. The result shows that sustainable circularity, smart municipality and digitalising accessibility are causal aspects with potential opportunities, challenges for prominent improvement. The digitalising accessibility is emphasised as the most important aspect in the structure. The collection stage and disposition stage are indicated to be top prioritised to enhance the electronic reverse logistic practices toward the industry 4.0 in Vietnam. [ABSTRACT FROM AUTHOR]

An electronic product usually contains numerous electronic components. To improve market competitiveness and operational flexibility, the electronics industry has begun to outsource electronic components. To help firms ensure that the lifetimes of procured electronic components meet market needs, this study proposes a fuzzy supplier selection model based on the confidence interval of the lifetime performance index proposed by (Chen and Yu, Annals of Operations Research 311:51–64, 2022). Under the assumption that the lifetime of an electronic component follows an exponential distribution, we derive the confidence intervals of the lifetime performance index for each supplier and use the confidence intervals of various suppliers to construct a fuzzy membership function. We propose a model based on this function to identify the optimal supplier. The fuzzy test incorporates historical data and expert experience to maintain evaluation accuracy in cases of small sample sizes. A numerical example is provided to demonstrate the efficacy of this method. [ABSTRACT FROM AUTHOR]

Purpose: The study explores the evolution of Indian domestic electronics manufacturing post-economic reforms and also investigates the lack of natural growth stages among Indian start-up/SME electronics manufactures. Design/methodology/approach: The theoretical framework is inspired by Dawar and Frost's survival strategy theory that local companies may follow to overcome competitive threats from MNCs. The study adopts a qualitative methodology, more precisely, a phenomenological approach to walking through policy/regulatory reforms amid market distortions, technological gaps and colonial mindset from the perspective of Indian domestic electronics manufacturers. The study has adopted Gioia method of data analysis to inductively suggest a few research propositions. Findings: The phenomenological approach revealed eight essential structure (essence) narratives to explore the complex issue that plague the industry: make in India, made in India, preferential market access strategy, equitable market access strategy, blue ocean strategy, competitive positioning strategy, technical capability and importance of policy/regulatory arbitrage. Practical implications: The situation of Indian electronics manufacturing units is comparable to the bonsai tree situation, where natural evolution in business stages does not exist; they are born and die as start-ups/MSMEs. The study advocates for equitable market access by removing market distortions. The long-term solution may lie in making available locally manufactured products as a dependable alternative to the imported products or produced locally by MNC OEMs in terms of cost, quality, technology, volume, after-sale service and integrated supply chain. Originality/value: While the favorable FDI policies, digital India and make-in India initiatives have strengthened domestic electronics production, it is yet to significantly impact India's position in global trade, including manufacturing and exports. [ABSTRACT FROM AUTHOR]

The current study investigates factors influencing sustainable software practices due to the growing concern for environmental desolation in software sustenance among software practitioners in the electronic industry. It validates the GREEN SOFT Reference Model in the Malaysian context by conducting a study in Selangor, Malaysia, using non-probability sampling techniques. The research involved 250 employees from various software departments. Partial least square via SmartPLS3.3 examined the constructs of governance, software strategy, knowledge accessibility, software practitioners, sustainable environmental practices and sustainable software practices. Empirical results show that the GREEN SOFT Reference Model positively and directly influenced software practices, including software strategy, software practitioners, sustainable environmental practices and knowledge accessibility. However, knowledge accessibility moderated the link between software strategy and sustainable software practices. The other factors did not indicate the moderating effect. The research shows that knowledge accessibility has the most substantial impact compared to the other factors. Therefore, the study suggests that practitioners should pursue sustainable software practices to enhance effectiveness in the workplace. The study presents the theoretical and practical implications for future consideration. [ABSTRACT FROM AUTHOR]

In order to understand the formability of as-received tempered commercial pure titanium grade 2 foils (CP Ti Gr2) with a thickness of 38 µm, a series of micro limited dome height (µ-LDH) tests were conducted in quasi-static speed (0.01 mm/s) at room temperature without the use of a lubricant. A technique developed at NIU was also used to create micro-circular grids (ϕ50 μm) on the as-received material. The forming limit curve (FLC) of the CP Ti Gr2 foils was obtained through the proposed µ-LDH test. For having mechanical properties of the CP Ti Gr2 foils for LS-Dyna FEA (Finite Element Analysis) simulations, a series of tensile tests in three directions were also conducted at room temperature with the same speed. The obtained FLC has been validated using a micro deep drawing case study in which both FEA simulations and experiments were conducted and compared. It has been proven in this study that the FLC obtained using the proposed µ-LDH test can be used for an extremely thin sheet-metal-forming process by the automotive, aerospace, medical, energy, and electronic industries, etc., right away for product design, forming process development, tool and die designs, and simulations, etc. [ABSTRACT FROM AUTHOR]

The development of efficient recovery methods for waste printed circuit boards (WPCBs) not only tackles the environmental risks of disposal but also promotes the conservation of resources within the electronics industry. This study proposes a two-step leaching approach for recovering metals from WPCBs. Initially, transition metals are leached using nitric acid, followed by the recovery of precious metals with thiourea in the second stage. In the first stage, dissolution rates exceeding 90 wt% were achieved for transition metals, including Cu, Fe, Ni, Pb, and Sn. In this stage, the dissolution of precious metals (i.e., Au and Pd) was insignificant. In the second stage, the effect of four parameters was investigated, including the impact of temperature, concentrations of ferric ions, sulfuric media, and thiourea on the recovery of Au and Pd. Precise control over sulfate concentration played a vital role in achieving maximum Au recovery. The optimal acid concentration was 0.2 M, resulting in a recovery rate of ~50 wt%. Ferric ion concentration positively affects Au recovery, whereas, in extracting Pd, optimal conditions imposed the absence of ferric ions. Thiourea concentration positively impacted Au and Pd recovery rates, peaking at 49 wt% for Au at 1 M and 44 wt% for Pd at 1.5 M. Prolonged leaching resulted in declining Au recovery rates, indicating a decrease in reagent concentration. Temperature variation yielded similar outcomes, with 50 °C resulting in peak recovery rates of 53 wt% for Au and 54 wt% for Pd. Metal dissolution kinetics during leaching were analyzed using pseudo-first-order and pseudo-second-order models. The second-order model proved suitable for transition metals in the first stage, while only for Au and Pd in the second stage (with R2 = 0.99). [ABSTRACT FROM AUTHOR]

A few East Asian newly industrialized countries that used to belong to the Global South not only have joined the Global North but also have organized their own production chains in specific industries. Given the imperialist and exploitative nature of global production chains established by the Global North, it should be questioned whether the production chains organized by the East Asian newly industrialized countries are free from the innate nature of production chains. This article adopts a multiregional input-output analysis to examine the bilateral trade relationship between Korea and Vietnam. It finds that the Korean economy has unequally captured the benefits from the bilateral trade with Vietnam in terms of the domestic value-added share and the spillover effect derived from the final demand for Vietnamese products in the textile and electronics industries. JEL Classification: F62, F63 [ABSTRACT FROM AUTHOR]

Qualification is a process that demonstrates whether a product meets or exceeds specified requirements. Testing and data analysis performed within a qualification procedure should verify that products satisfy those requirements, including reliability requirements. Most of the electronics industry qualifies products using procedures dictated within qualification standards. A review of common qualification standards reveals that those standards do not consider customer requirements or the product physics‐of‐failure in that intended application. As a result, qualification, as represented in the reviewed qualification standards, would not meet our definition of qualification for reliability assessment. This paper introduces the application of diagnostics and prognostics techniques to analyze real‐time data trends while conducting qualification tests. Diagnostics techniques identify anomalous behavior exhibited by the product, and prognostics techniques forecast how the product will behave during the remainder of the qualification test and how the product would have behaved if the test continued. As a result, combining diagnostics and prognostics techniques can enable the prediction of the remaining time‐to‐failure for the product undergoing qualification. Several ancillary benefits related to an improved testing strategy, parts selection and management, and support of a prognostics and health management system in operation also arise from applying prognostics and diagnostics techniques to qualification. [ABSTRACT FROM AUTHOR]

AbstractThis paper uses evidence to argue that effective active industrial policies helped stimulate industrial upgrading from low and medium value-added activities to high value-added activities in the electronics industry of South Korea and Taiwan. However, passive industrial policies, largely driven by foreign direct investment have restricted industrial upgrading so that the electronics industry in Malaysia and Thailand have not upgraded beyond low and medium value-added activities. Consequently, the paper suggests that it is possible to attract foreign multinational operations in labour-intensive activities by countries endowed with surplus trainable labour, efficient customs coordination, financial incentives, and political stability, but active industrial policies focused on developing the embedding science, technology, and innovation infrastructure and stringent appraisal and monitoring are necessary to stimulate upgrading to high value-added activities. [ABSTRACT FROM AUTHOR]

With the continuous development of high‐end electronic information technologies such as 5G communications, thermal management is an urgent issue in the electronic and circuit industries due to the miniaturization, functionalization and integration. Recently, polymer‐based composites with the fillers of hexagonal boron nitride (h‐BN) have been regarded as promising candidates resulting from their excellent thermal conductivity (TC), good insulation and remarkable comprehensive properties. However, the high surface inertness of h‐BN itself, incompatibility with matrix and other fillers and mismatch of phonon‐spectrum will bring about the matrix/filler and filler/filler interfacial thermal resistance (ITR), which will greatly decline the TC of the composites, and limit their thermal management ability. Therefore, how to design, regulate and improve the interfacial states in composites and eventually enhance the TC is a current challenge. Researchers have made great effort to reduce the ITR of the composites to improve their TC. However, a comprehensive summary and analysis of researches on the improvement methods of the interface states in composites in the past 3 years is still lacking. In this work, the commonly used mechanism models, and simulation methods for calculating and predicting TC was summarized. From perspectives of Synthesis of h‐BNNs, modification, orientation, bridging and three‐dimensional structures construction, we reviewed strategies for improving the interface states in composites, and focused on the ITR regulation and TC improvement. The improvement effects of various methods on TC were compared. The development trend of high TC composite materials was prospected. Highlights: Crystallinity, defect, size, flatness, thickness of hexagonal boron nitride nanosheets (BNNSs) affect interfacial thermal resistance (ITR).Nature of interaction between adjacent layers of BNNS need exploited.Interface and defect are root cause of extra phonon scattering.Shape, density, surface area, distribution and compatibility reduce ITR.Theory, model, simulation methods need developed on different levels. [ABSTRACT FROM AUTHOR]

The rapid advancement of the electronics industry has continuously increased demands for the E‐glass yarn's quality and production capacity. The twisting and winding process stands out as a crucial step in E‐glass yarn production. Twisted bobbin yarns are produced separately using constant spindle speed technology and constant tension technology in order to address issues such as high yarn breakage rates and excessive yarn hairiness during twisting. By comparing the twisting tension, yarn breakage rates, and yarn hairiness between these two technologies, this study delves into the impact of twisting technology on E‐glass yarn quality and production capacity. The results indicate that, in comparison with constant spindle speed technology, constant tension technology reduces the unevenness ratio of twisting tension from 8.94% to 0.55%, decreases yarn breakage rates from 3.05% to 2.03%, reduces long hairiness by 20.3%, and reduces short hairiness by 25.1%. By reducing the spindle speed when the bobbin yarn's diameter increases, constant tension twisting technology reduces the unevenness ratio of twisting tension, yarn breakage rate, and yarn hairiness. These research findings lay the foundation for the development of high‐end E‐glass yarn products and carry significant practical value in improving yarn quality, enhancing production capacity, and reducing E‐glass yarn losses. Highlights: The twisting and winding principle of E‐glass yarn is revealed.The relationship among four tensions in the twisting and winding process is clarified.The parameters for the constant tension twisting technology are developed.The measurement method for the twisting tension is improved. [ABSTRACT FROM AUTHOR]

Despite being indispensable devices in the electronic manufacturing industry, printed circuit boards (PCBs) may develop various soldering defects in the production process, which seriously affect the product's quality. Due to the substantial background interference in the soldering defect image and the small and irregular shapes of the defects, the accurate segmentation of soldering defects is a challenging task. To address this issue, a method to improve the encoder–decoder network structure of UNet is proposed for PCB soldering defect segmentation. To enhance the feature extraction capabilities of the encoder and focus more on deeper features, VGG16 is employed as the network encoder. Moreover, a hybrid attention module called the DHAM, which combines channel attention and dynamic spatial attention, is proposed to reduce the background interference in images and direct the model's focus more toward defect areas. Additionally, based on GSConv, the RGSM is introduced and applied in the decoder to enhance the model's feature fusion capabilities and improve the segmentation accuracy. The experiments demonstrate that the proposed method can effectively improve the segmentation accuracy for PCB soldering defects, achieving an mIoU of 81.74% and mPA of 87.33%, while maintaining a relatively low number of model parameters at only 22.13 M and achieving an FPS of 30.16, thus meeting the real-time detection speed requirements. [ABSTRACT FROM AUTHOR]

Bulk feeders that can automatically feed materials are one of the most commonly used vibration devices in the electronics industry. This study uses voice coil motors to design and implement a dual-axis bulk feeder and a quad-axis bulk feeder, allowing them to handle many kinds of materials. The implemented feeders can improve some of the problems in traditional bulk feeders, such as only one direction of movement, can only handle one kind of material, the contact time between the material and the platform is too long, and the feeder is not suitable to process materials with particular shapes. Two or four voice coil motors are placed under the platform of the implemented feeder. The vibration of the platform is controlled by the up-and-down movements of the voice coil motors, so that the bulk materials on the platform can be moved to the desired direction according to the feeding requirements. This study proposes a control method to control voice coil motors. For example, using different combinations of up-and-down movements of these four voice coil motors, the quad-axis voice coil feeder can move the material in eight horizontal directions, such as up, down, right, left, up right, up left, down right, and down left, as well as vertically flip. Since the frequency and amplitude of each vibration of the voice coil motor can be easily and instantly adjusted through the program, the implemented feeder can handle other types of materials without modifying the hardware of the device. Finally, some experimental results illustrate that the implemented dual-axis and quad-axis voice coil feeders can indeed effectively handle various bulk materials. [ABSTRACT FROM AUTHOR]

Supply chains are very important for the economy of a country. With increased globalization and outsourcing, the supply chain risks have increased. It becomes imperative to identify the various risks inherent in a supply chain and to find out the interrelationships between them so that we can manage/mitigate them. The electronics industry plays a major role in the country's economy. This paper seeks to understand the risks inherent in an electronics supply chain and model the risks using interpretive structural modeling. [ABSTRACT FROM AUTHOR]

Ultrashort-pulse lasers (USPLs) are used in the machining of zirconia ceramics (ZrO 2) because of their extremely high peak intensities. However, highly efficient and high precision microprocessing of ZrO 2 remains challenging. In this study, we applied a transient and selective laser (TSL) processing technique by combining a USPL and a continuous-wave (CW) laser to realize ultrafast drilling of opaque ZrO 2. Ultra-high-efficiency TSL drilling of ZrO 2 was achieved with a processing efficiency 1800 times higher than that of USPL drilling. The material removal mechanism, hole formation process, and parameter dependence of TSL drilling were revealed by direct observation of the internal processing phenomenon on a timescale of microseconds. The variations in the processed surface characteristics, including surface morphology, elemental composition, and phase composition, are also presented. Subsequently, the effect of different excited electron regions occurring in the picosecond timescale induced by the USPL on the TSL drilling performance is discussed. Finally, the repeatability and stability of the TSL processing were verified by fabricating microarrays of different sizes. This study will contribute to revealing the ultrafast processing mechanisms of TSL processing in ZrO 2 microfabrication. Furthermore, this technique can significantly broaden the applications of ZrO 2 in the advanced electronic industry by greatly improving the microprocessing efficiency. [ABSTRACT FROM AUTHOR]

Copyright of Revista de Ciencias Sociales (13159518) is the property of Revista de Ciencias Sociales de la Universidad del Zulia Venezuela and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Overview: Prior research has understood the process of digital transformation as shifts between digitization, digitalization, and digital transformation phases and has treated the digital transformation process tautologically. In the literature, digital transformation is understood as transforming the whole organization, including its business processes and value proposition. This understanding is problematic because it fails to capture the need for achieving alignment between the organization, the environment, and the strategy based on the finer details of an organization's context. Achieving this fit is important in a VUCA environment characterized by volatility, uncertainty, complexity, and ambiguity. We conducted a single case study of Linn Products, a UK-based high-tech company renowned for designing and manufacturing high-end home entertainment systems, including digital streaming products, music players, and speakers. This award-winning firm has not only embraced digital transformation but also sustained its performance proactively amidst the dynamic shifts in the consumable electronics industry. Our interpretive longitudinal study spans 2007 to 2023 and incorporates insights from 23 in-depth interviews. Our research provides valuable guidance for practitioners seeking to build resilience and adaptability in an era of digital disruption and polycrisis. In an era marked by polycrisis, organizations must cultivate a combination of threshold and core capabilities to attain organizational fitness amidst the challenges of a VUCA environment. To leverage digital transformation, companies must adopt a strategic approach, whether through providing digital support in business processes or opting for full digital participation. Success in digital transformations hinges on the harmonious alignment of strategy, an organization's unique circumstances, and the dynamic conditions of the VUCA environment. [ABSTRACT FROM AUTHOR]

Purpose: In this paper, we investigate the coevolution of the supply network and procurement strategies in the context of semiconductors and electronics for the automotive industry over 3 decades. We aim to explain how procurement strategy interrelates with changes in supply network structure and what the implications of a hub-centric structure network structure are for procurement in supply. Design/methodology/approach: We collected in-depth primary and secondary data that stretched back to 1996 from a leading automotive European original equipment manufacturer (OEM) and its network. Using social network analysis (SNA), we identified OEMs' procurement focus and mapped the evolution of the supply network, the links in the network, and the environmental forces impacting the strategies and the network. Findings: Our findings describe the supply network for semiconductor and electronic components to the automotive industry. The findings suggest that a focus on cost can lead to a Tier 1-centric network structure with many tiers that can fail to assure supply or capture innovation when the external environment is marked by high uncertainty. In such situations, increasing complexity by creating more links in the network can improve transparency and contribute to supply assurance and innovation. Practical implications: The findings indicate that managers should consider the role of the supply network in selecting their strategy to attain objectives of cost, innovation, and supply assurance. Originality/value: This paper presents empirical-based insights into the automotive semiconductor and electronic component supply chain (SC), the unexpected implications of hub-centric supply networks, and the use of SNA in the SC in context. [ABSTRACT FROM AUTHOR]

[Display omitted] The advancement of flexible electronics demands improved components, necessitating heat dissipation membranes (HDMs) to exhibit high thermal conductivity while maintaining structural integrity and performance stability even after extensive deformation. Herein, we have devised a laser-modulated reduction technique for graphene oxide (GO), enabling the fabrication of high-quality, large-scale, low-defect graphene, which yields high-performance HDMs after orderly deposition. The work underscores the crucial role of the laser wavelength and dispersion liquid's coupling intensity in influencing the morphology and properties of graphene. Optimal coupling effect and energy conversion are realized when a laser of 1064 nm wavelength irradiates a triethylene glycol (TEG)/ N , N -Dimethylformamide (DMF) dispersion. This unique synergy generates high transient energy, which facilitates the deprotonation process and ensures a swift, comprehensive GO reduction. In contrast to conventional water-based laser reduction methods, the accelerated reaction magnifies the size of the graphene sheets by mitigating the ablation effect. After membrane construction with an ordered structure, the corresponding membrane exhibits a high thermal conductivity of 1632 W m−1 K−1, requiring only ∼1/10 of the total preparation time required by other reported methods. Remarkably, the resulting HDM demonstrates superior resilience against creasing and folding, maintaining excellent smoothness and negligible reduction in thermal conductivity after violent rubbing. The combination of exceptional flexibility and thermal conductivity in HDMs paves the way for long-term practical use in the flexible electronics industry. [ABSTRACT FROM AUTHOR]

This research article explores the relationship between smartphone usage and job performance among professionals working in the leading electronic media channels in Pakistan. Furthermore, it also examines how gender, education, and age act as moderators in the relationship between smartphone usage and job performance. For this purpose, a survey was carried out involving professionals belonging to the electronic media industry in Pakistan. The findings revealed a positive and significant relationship between their smartphone usage and job performance. The results also showed that the gender of employees did not moderate this relationship, while the education and the age were found to be significant moderators. The study will help the media owners in devising the policies and strategies to facilitate their workers in easy utilization of smartphones for work related tasks. [ABSTRACT FROM AUTHOR]

Copyright of Journal of Donghua University (English Edition) is the property of Journal of Donghua University Editorial Board and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Many industrial production lines today are initially constructed and outfitted with machinery that, despite its inherent capabilities, struggles to satisfy increasing demand over time. The goal of this research is to find solutions to bottlenecks and improve the efficiency of the production line to satisfy rising productivity demands. The study primarily looks at an existing bottle production line in the edible oil industry, where the product is witnessing a boom in demand. Data on processing times at various workstations and their capacities were thoroughly collected and analyzed. Simulation emerged as the preferred tool for investigating and addressing the production line's intrinsic difficulties. Using Microsoft Excel for statistical analysis, an existing simulation model was created using Flexsim simulation, a process-oriented simulation software, to detect bottlenecks in the production line using the Processor block in the simulation. As a result, a modified model was offered to reduce waiting times by 12%, increase productivity by 6%, and increase overall profitability while efficiently dealing with rising demand across all seasons. As a result, this research represents a complete effort to identify operational challenges and present viable solutions that correspond with the industry's changing objectives. The study aims to contribute to optimizing production lines by utilizing contemporary simulation tools and statistical analysis, guaranteeing that they stay adaptive and responsive in the face of rising productivity demands. [ABSTRACT FROM AUTHOR]

Papertronics introduce a sustainable, cost‐effective revolution in electronics, especially for the Internet of Things. This research overcomes the traditional challenges of paper's porosity, which has impeded electronic component fabrication and performance. A novel approach that harnesses paper's natural capillary action, combined with hydrophobic wax patterning, to achieve precise vertical integration of electronic components is introduced. This method marks a significant departure from conventional surface deposition techniques. This study demonstrates the successful creation of tunable resistors, capacitors, and field‐effect transistors, embedded within a single sheet of paper. Contrary to previous assumptions that impeded the use of paper, its rough and porous texture as a strategic advantage, facilitating the precise fabrication of intricate electronic components is leveraged. Machine learning algorithms play an important role in predicting and enhancing the performance of these papertronic components. This innovation facilitates the development of compact printed circuit boards with increased circuit density, enabling the integration of diverse analog and digital circuits in either single or multi‐layer paper formats. The resulting papertronic systems exceed performance benchmarks, offering eco‐friendly disposal through biodegradability or incineration. These breakthroughs establish papertronics as a feasible, eco‐friendly alternative in the electronics industry, permitting widespread adoption and continuous innovation in sustainable electronic solutions. [ABSTRACT FROM AUTHOR]

The process capability index (PCI) has been developed as a useful instrument for measuring how well a product matches customer expectations while also assessing the performance of a process. We are aware that when the quality characteristics of the processes follow normal distribution, conventional PCIs produces superior results. However, these traditional indices could not yield reliable findings when assessing nonnormally distributed processes, which could make decision-making more difficult. In this paper, we take into account the C N p m k c process capacity index, which may be used for both normally distributed and nonnormally distributed processes. We have employed 10 traditional methods of estimation to estimate the PCI C N p m k c when the process has a logistic-exponential distribution, and the performances of these traditional estimates of the index C N p m k c are compared in terms of their mean squared errors through a simulation exercise. Then, we create five PCI C N p m k c bootstrap confidence intervals and contrast them based on their average widths and related coverage probabilities. In order to demonstrate the applicability of the suggested methods of estimation, two data sets pertaining to the electronic industries are re-analyzed. [ABSTRACT FROM AUTHOR]