1. Cooling Methods for a Typical Printed Circuit Board Assembly in Spacecraft: Simulation and Experiment.
- Author
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Wang, Sheng, Song, Changxu, Zhang, Li, Hu, Fengjiao, Dong, Feng, Liang, Dapeng, Liu, Jiangtao, Zhang, Jingyu, and Chen, Sihong
- Subjects
ELECTRONIC equipment design ,PRINTED circuits ,SPACE vehicles ,CORPORATE meetings ,PACKAGING - Abstract
In this study, cooling methods for a typical spacecraft circuit board assembly are investigated. The power dissipation of the assembly is more than 100 W, and the max heat dissipation of a component is 16 W, making it very difficult to cool the assembly. According to the packaging characteristics and heat dissipation of the components on the circuit board, cooling methods such as potting brackets, cooling springs, and cooling blocks are used, and the effects of various cooling methods are analyzed. Through simulation and experimental research, it is proven that the power components in the printed circuit board assembly meet the requirements of temperature derating, which provides a reference for the thermal design of spacecraft electronic equipment. [ABSTRACT FROM AUTHOR]
- Published
- 2025
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