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3. Design and Manufacture of Automotive Hybrid Steel/Carbon Fiber Composite B-Pillar Component with High Crashworthiness

4. In-situ thickness measurement of epoxy molding compound in semiconductor package products using a Terahertz-Time of Flight System

5. Prediction of the mechanical behavior of fiber-reinforced composite structure considering its shear angle distribution generated during thermo-compression molding process

7. Multi-pulsed flash light sintering of copper nanoparticle pastes on silicon wafer for highly-conductive copper electrodes in crystalline silicon solar cells

8. Non-destructive Evaluation of Defects of Glass Fiber Composites using Imaging System based on Photo-mixer Terahertz Technique

9. Improving pedestrian safety via the optimization of composite hood structures for automobiles based on the equivalent static load method

10. Real time thickness measurement based on terahertz time-domain spectroscopy for chip-top epoxy molding compound in semiconductor package

11. Rapid, cool sintering of wet processed yttria-stabilized zirconia ceramic electrolyte thin films

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