197 results on '"Drewniak, J.L."'
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2. Causal RLGC(f) models for transmission lines From measured -parameters
3. Wide-Bandwidth Multi-Resolutional Analysis of a Surface-Mounted PM Synchronous Machine
4. An Efficient Approach for Power Delivery Network Design With Closed-Form Expressions for Parasitic Interconnect Inductances
5. Crosstalk analysis for nonparallel transmission lines using PEEC with a dynamic Green's function formulation
6. Wide-Band Lorentzian Media in the FDTD Algorithm
7. Electromagnetic Interference (EMI) of System-on-Package (SOP)
8. Common-Mode Current Due to a Trace Near a PCB Edge and Its Suppression by a Guard Band
9. Effect of anisotropy on extracted dielectric properties of PCB laminate dielectrics.
10. Analytical expressions for transfer function of supply voltage fluctuation to jitter at a single-ended buffer.
11. bmodel of secondary ESD for a portable product.
12. Differential and extrapolation techniques for extracting dielectric loss of printed circuit board laminates.
13. Electromagnetic compatibility issues in mobile computing
14. A new mixing rule for predicting of frequency-dependent material parameters of composites.
15. Stressed jitter analysis for physical link characterization.
16. DC blocking via structure optimization and measurement correlation for SerDes channels.
17. Design and modeling for chip-to-chip communication at 20 Gbps.
18. Model for ESD LCD upset of a portable product.
19. FDTD modeling of absorbing materials for EMI applications.
20. Modeling of noise coupling inside multilayer printed circuit boards using cavity model and segmentation technique.
21. Physics-based via model development and verification.
22. Stub length prediction for back-drilled vias using a fast via tool.
23. Foreword advanced emc numerical modeling
24. Statistical approach to the EMI modeling of large ASICs by a single noise-current source
25. A study on influence of guard band on common-mode current related to a microstrip line
26. Active probes for creating H-field probes for flat frequency response.
27. Improved technique for extracting parameters of low-loss dielectrics on printed circuit boards.
28. Investigation of mixed-mode input impedance of multi-layer differential vias for impedance matching with traces.
29. Impedance of an infinitely large parallel-plane pair and its applications in engineering modeling.
30. Developing an SI tool set for engineering design discovery, physical insight, and education.
31. Using a single-ended TRL calibration pattern to de-embed coupled transmission lines.
32. Measurement of electromagnetic parameters and FDTD modeling of ferrite cores.
33. Extraction of equivalent inductance in package-PCB hierarchical power distribution network.
34. Development of a concept inventory test for signal and power integrity in electronic design.
35. Cavities' Identification Algorithm for Power Integrity Analysis of Complex Boards.
36. Simulation of Via Interconnects Using Physics-Based Models and Microwave Network Parameters.
37. Differential vias transition modeling in a multilayer printed circuit board.
38. Noise coupling between power/ground nets due to differential vias transitions in a multilayer PCB.
39. Noise coupling between signal and power/ground nets due to signal vias transitioning through power/ground plane pair.
40. Analysis of distributed coupling along nonparallel traces using PEEC with phase term expansions.
41. A concise multiple scattering method for via array analysis in a circular plate pair.
42. Characterization of serial links at 5.5Gbps on FR4 backplanes.
43. Modeling interference coupling between two orthogonal strip lines on adjacent layers.
44. Extraction of causal RLGC models from measurements for signal link path analysis.
45. Efficient prediction of RF interference in a shielding enclosure with PCBs using a general segmentation method.
46. Analysis of the thermal effects of GaAs FETs under the high-power electromagnetic pulses.
47. Progress in representation and validation of physics-based via models.
48. Predictive Modeling of the Effects of Skew and Imbalance on Radiated EMI from Cables.
49. SPICE-Compatible Cavity and Transmission Line Model for Power Bus with Narrow Slots.
50. An Efficient Implementation of Parallel FDTD.
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