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Microfabrication technology with quartz crystals is gaining importance as the miniaturization of quartz MEMS devices is essential to ensure the development of portable and wearable electronics. However, until now, there have been no reports of dimension compensation for quartz device fabrication. Therefore, this paper studied the wet etching process of Z-cut quartz crystal substrates for making deep trench patterns using Au/Cr metal hard masks and proposed the first quartz fabrication dimension compensation strategy. The size effect of various sizes of hard mask patterns on the undercut developed in wet etching was experimentally investigated. Quartz wafers masked with initial vias ranging from 3 μm to 80 μm in width were etched in a buffered oxide etch solution (BOE, HF:NH4F = 3:2) at 80 °C for prolonged etching (>95 min). It was found that a larger hard mask width resulted in a smaller undercut, and a 30 μm difference in hard mask width would result in a 17.2% increase in undercut. In particular, the undercuts were mainly formed in the first 5 min of etching with a relatively high etching rate of 0.7 μm/min (max). Then, the etching rate decreased rapidly to 27%. Furthermore, based on the etching width compensation and etching position compensation, new solutions were proposed for quartz crystal device fabrication. And these two kinds of compensation solutions were used in the fabrication of an ultra-small quartz crystal tuning fork with a resonant frequency of 32.768 kHz. With these approaches, the actual etched size of critical parts of the device only deviated from the designed size by 0.7%. And the pattern position symmetry of the secondary lithography etching process was improved by 96.3% compared to the uncompensated one. It demonstrated significant potential for improving the fabrication accuracy of quartz crystal devices. [ABSTRACT FROM AUTHOR]

Device–body interface is significant for acquiring high quality bio‐signals, preventing skin‐irritation, and minimizing the motion artifacts. However, low breathability of the typical substrate used in a flexible electronic device usually deteriorates the stability of device–body interface, which is imperative for long‐term application but commonly disregarded. In paper, a directional sweat transport and breathable electrode with three‐layer sandwiched structure is reported. The top hydrophilic hydrolyzed‐polyacrylonitrile (HPAN) layer and middle hydrophobic thermoplastic‐polyurethane (TPU) layer form Janus structure; and the bottom layer is an electrode layer of Ag nanowires (AgNWs). This dedicatedly designed electrode can transport sweat from skin to the top HPAN layer, while keeping low noise electrocardiogram (ECG) signal detection. In the trial of ECG monitoring, the results show that the electrode can achieve reliable recording with high signal noise rate (SNR) both in calm state (10.5 dB) and sweaty state (10.1 dB) with sweat tolerance. No allergy or obvious SNR degeneration is observed when utilizing the electrode owing to the effective sweat transport away from the device–body interface rather than accumulation. Finally, the application of the anti‐sweat accumulating electrode in wearable electronics is demonstrated. [ABSTRACT FROM AUTHOR]